Yield Analysis Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Boise, we are part of a historic $15 billion investment to expand one of the world’s most advanced semiconductor manufacturing sites. As a leader in memory and storage innovation, we are building the future of DRAM technology while creating opportunities to solve complex engineering challenges in a collaborative, fast-paced environment. As a Vapor Etch Process Engineer, you will develop and optimize critical vapor-phase cleaning and etch processes that enable advanced DRAM manufacturing. Unique to Micron, vapor etch is integrated within Wet Process Engineering, offering the opportunity to work across both wet chemistry and gas-phase surface reactions while partnering with equipment, integration, and yield teams to drive manufacturing excellence. Responsibilities: Own and optimize vapor etch process modules to support high-volume manufacturing Develop, qualify, and maintain processes on single-wafer vapor etch platforms Drive defectivity reduction and improve process performance through data-driven analysis Perform root cause investigations using SPC, FDC, FMEA, and 8D methodologies Partner with equipment and integration teams to improve yield, cost, productivity, and process stability Minimum Qualifications: BS or MS degree in Engineering or equivalent industry experience 2+ years of direct vapor etch process experience in semiconductor manufacturing Experience owning semiconductor manufacturing processes in a high

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job description We are seeking a Manufacturing Section Manager to lead high-volume semiconductor frontend manufacturing operations in a fast-paced, multinational environment. This role requires strong production management, people leadership, and process knowledge, along with the ability to collaborate closely with Engineering teams to continuously improve manufacturing efficiency, product quality, and overall operational performance. This position is primarily focused on manufacturing execution and operations management. The successful candidate should possess a solid understanding of semiconductor manufacturing processes and be able to effectively bridge Production and Engineering teams to drive problem-solving, continuous improvement, operational excellence, and sustainable business results. Job Responsibilities 🔹 Production Management Lead daily wafer fabrication operations to meet output, cycle time, and delivery targets Manage and develop production teams in cleanroom environment Monitor and drive manufacturing KPIs (WIP, cycle time, OEE, tool utilization) Ensure shift execution discipline and production stability 🔹 Process & Engineering Interface Work closely with Process Engineering (PE), Equipment Engineering (EE), and Yield teams Support process control, excursion handling, and root cause analysis Drive continuo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the R&D DRAM Device and Cell Technology Group at Micron, working at the heart of future memory scaling in an industry‑leading 300mm R&D facility. We explore new device concepts, push the limits of DRAM cell performance, and turn deep physics understanding into manufacturable technology. If you enjoy learning fast, solving hard problems, and collaborating across process areas, this team delivers! In this role, you will play a critical part in defining and validating future DRAM device and cell technologies. As a Device Engineer, you will characterize memory arrays, analyze electrical behavior and failures, and influence process and material decisions that directly impact yield, quality, and performance. Your work will shape the electrical foundation of next‑generation DRAM products. Responsibilities: Define and drive electrical specifications for DRAM, Advanced DRAM and emerging memory technologies, translating product requirements into device-level targets for performance, reliability and scaling Design, implement, and interpret experiments to optimize cell and access device performance. This includes running materials experiment, developing new integration schemes and defining new characterization methodologies Develop physical and electrical models (TCAD and compact modeling) to identify performance, yield and reliability limiters, using advanced materials characterization, device physics insight, and statistical data analysis Creat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Install, start-up, and continually improve cutting edge semiconductor processing equipment and hardware both internally with process engineering and externally with vendors to enable leadership in next-gen memory. Apply project management skills to projects and demonstrate the ability to exchange complex information with customers Set Module Level. Identify alternate CMP/Bond hardware technologies Recognizing opportunities and provide feedback to R&D personnel for technical innovation. Mentor new engineers and other upcoming engineers. Drive module level development and lead large projects of a technical nature. Standardize methods and procedures across area, department and/or FABs. Research, gather and analyze information related to specific assignments within your technical discipline. Recommend process or equipment changes to improve FAB metrics Interpret results and conduct quantitative analyses. Interpret results of new or modified equipment or processes. Design, develop, and implement technical products, systems, or processes to improve product quality and/or Fab performance Evaluating issues and define solutions to develop and implement improvements in equipment or processes to improve scrap, cost, rework, cycle time, throughput or yield. Resolve integration issues through process development. Identify and evaluate interactions between equipment, modules and processes and resolve related issues. Employer will accept a Bachelor’s degree in Engineering Technology, Electrical Engineering, Materials Engineering or related field and 2 years o

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description What You’ll Do Team Leadership & Talent Development: Lead and develop global engineering and analytics teams across multiple levels. Recruit, mentor, and grow analysts, engineers, and contractors into high–performing contributors. Foster a culture of technical excellence, collaboration, and continuous improvement. Yield & Process Optimization: Collaborate with semiconductor manufacturing engineering teams to analyze inline/param/probe data to identify top yield detractors and drive continuous improvement. Data Pipeline & Automation: Extract, cleanse, and analyze datasets from SQL databases, sensor networks, and fabrication tool logs to support semiconductor manufacturing operations. Advanced Analytics & Modeling: Apply data science techniques, statistical modeling, and machine learning to troubleshoot yield issues and support defect reduction strategies. Experimentation Support: Assist process and integration engineers in running and analyzing Design of Experiments (DOE) to enhance process capabilities and margins. Visualization & Communication: Develop automated reports and dashboards using visualization tools (e.g., Dash, Plotly, streamlit) to communicate technical concepts and project outcomes

About the Role As Head of First Party Chip Finance, you will be the finance leader for OpenAI’s custom silicon efforts. You will partner with teams across chip design, engineering, infrastructure, supply chain, and finance to turn technical roadmaps into sound investment decisions and financially disciplined execution. This role spans the full chip development lifecycle: evaluating design and roadmap choices, building investment cases, forecasting development and production costs, and supporting manufacturing and deployment at scale. You will give leadership a clear view of program economics, funding requirements, and risks as we build first-party compute capabilities. In this role, you will: Lead financial evaluation of custom silicon programs, including development investment, production economics, deployment assumptions, and expected returns. Assess first-party chips against alternative compute options. Build and own program-level models and multiyear forecasts that connect engineering milestones, development spending, manufacturing volumes, supplier commitments, and cash requirements. Partner closely with chip-design and engineering leaders on technical decisions that affect performance, power consumption, cost, and time to deployment. Translate complex design tradeoffs into clear financial recommendations. Develop a detailed view of chip and system costs, including wafers, manufacturing yields, packaging, memory, testing, and integration. Identify opportunities to improve economics as programs move from development into production. Partner with Supply Chain and Procurement on supplier strategy and commercial negotiations, including capacity reservations, volume commitments, prepayments, and contractual risk. Work with Treasury, Corporate Finance, Accounting, Tax, and Legal to evaluate financing and payment structures, manage financial exposure, and support program execution. Support commercial deployment and pricing decisions through analysis of unit economics,

Reolink , a leader in intelligent visual technology for homes and businesses, was founded in 2009 by a group of engineers with a strong commitment to and passion for smarter security solutions. Our products are now trusted by millions of users across more than 110 countries and regions worldwide. Building on this trust, we continue expanding our presence and bringing our innovations to more markets around the globe. Reolink remains committed to delivering advanced, reliable, and user‑centric solutions that empower people to protect what matters most. Position: Costing Accountant (Group Finance) 5 Work Days Per Week Office Near Tai Seng MRT, Singapore Medical Benefits Provided Entitled to Yearly Bonus & Performance Bonus Role Summary This role owns the full costing lifecycle for finished goods and components sourced from factories and subcontractors — from standard cost build-up and BOM validation through to landed cost, variance analysis, and margin reporting. The successful candidate will be the finance business partner to Operations, Procurement, and Product Engineering, ensuring product costs are accurate, transparent, and defensible, and that the Group has real-time visibility of manufacturing cost drivers across 16 legal entities on a single NetSuite ERP backbone. Key Responsibilities Factory & Subcontracting Cost Management Own end-to-end product costing for all CM- and subcontractor-manufactured SKUs, including camera hardware, accessories, and NVR/hub products. Build and maintain standard costs (material, labour, overhead, tooling amortisation) at BOM/routing level in NetSuite; review and approve cost rolls each cycle. Validate CM/subcontractor quotations against BOM cost breakdowns, labour rates, and process yields; challenge quoted costs with fact-based benchmarking. Track and reconcile subcontracting fees, processing charges, tooling/mould amortisation, and NRE (non-recurring engineering) charges billed by factories. Monitor landed cos

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data ‑ driven root ‑ cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure and cross ‑ fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo/overlay metrology engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an OCT CPEE Photo Metrology Principal/Senior Engineer, you will lead HVM photo metrology (especially overlay metrology) yield, quality, productivity, and cost improvement initiatives, and serve as the technical authority for resolving complex photo metrology related issues across fabs, and drive photo metrology supplier roadmap and engagement. You will be responsible for defining and deploying photo metrology Best Known Methods (BKM) for HVM and NPI, driving MOR‑POR gap closure, and enabling cross‑fab and cross‑node process alignment. You will also be acting as a key technical escalation point, and collaborate closely with internal partners and suppliers to improve photo metrology capability, process margin, and execution consistency, while representing OCT in technical reviews, workshops, and governance forums. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data‑driven root‑cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo yield, quality, productivity, and cost improvement initiatives Resolve complex photo process issues (overlay, CDU, EPE, MMM, destack, RWC, yield matching) through data ‑ driven root ‑ cause analysis Define and deploy Photo Process Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex lithography customer concerns Drive MOR–POR gap closure and cross ‑ fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT Photo in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo process engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability to act as a t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job description We are seeking a Wafer Manufacturing Section Manager to lead high-volume semiconductor frontend production in a fast-paced, multinational environment. This role requires strong manufacturing execution, team leadership, and process understanding, with the ability to collaborate closely with Engineering teams to drive yield and productivity. We are not looking for a pure process engineer — this role owns manufacturing execution with strong process collaboration. Job Responsibilities 🔹 Production Management Lead daily wafer fabrication operations to meet output, cycle time, and delivery targets Manage and develop production teams in cleanroom environment Monitor and drive manufacturing KPIs (WIP, cycle time, OEE, tool utilization) Ensure shift execution discipline and production stability 🔹 Process & Engineering Interface Work closely with Process Engineering (PE), Equipment Engineering (EE), and Yield teams Support process control, excursion handling, and root cause analysis Drive continuous improvement on yield, defect reduction, and productivity Support new process qualification and technology transfer 🔹 Operational Excellence Lead continuous improvement initiatives (Lean / Six Sigma concepts preferred) Optimize fab capacity and resour

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Minimum Qualifications: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts Experience with wafer probe and fin

About the Job Do you get excited when a messy, ambiguous business problem finally yields to the right model? Do you think in systems, speak fluently across the technical-business divide, and want your work to do more than sit in a notebook — you want it to actually ship, scale, and matter? With over 2,000 employees, 36 offices on five continents, and world-class clients like Samsung, L'Oréal, and Mattel, Artefact is a consulting firm that transforms data into measurable value and business impact. We've launched in the US with offices in NYC and Los Angeles — and we're looking for a Senior Data Scientist to help define what world-class data science looks like on our founding team. Who We Are Founded and headquartered in Paris, Artefact is a next-generation consulting firm specializing in data, analytics, and AI consulting — dedicated to transforming data into business impact across the entire value chain of organizations. We don't just advise; we build, implement, and deliver results our clients can measure. We have 2,000 employees across 36 offices focused on accelerating digital transformation for some of the world's most recognizable brands. Our state-of-the-art data technologies, lean AI agile methodologies, and cohesive teams of elite business consultants, data analysts, data scientists, data engineers, and digital experts are all laser-focused on delivering real value to every client. We design data-driven solutions tailored to each client's specific needs — always conceived with a business-first mindset and delivered with tangible, measurable results. Our expertise is built on deep AI knowledge acquired through 1,000+ client engagements across the globe. Find out more at artefact.com. What You Will Be Doing As a Senior Data Scientist, you'll be the technical engine behind some of our most complex and consequential client engagements. You'll move fluidly between data exploration, model development, and executive communication — bringing scientific rigor to busi

Yield Analysis Lead (Remote support) — Taichung - Fab 16, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As NAND TD RDA LEADER , you will lead a team in the use of next-generation defect detection equipment and processes to identify and solve issues. The goal of this position is to accelerate cycles of learning and technology transfer in Technology Development. We need leaders who are passionate about developing their team, delivering solutions to our internal customers, and driving our supplier's road maps to meet our future inspection needs. This position will provide the opportunity for you to collaborate with process integration, process development, data science, and yield analysis within and outside Technology Development. As a Technology Development RDA Lead, your leadership and innovation will have the ability to impact the team globally. You and your team will be responsible to support experimentation, data analysis, baseline health metrics, and systematic and random defect improvement through partnering with others in Technical Development and Global Manufacturing. Responsibility includes , but not limited to: Encourage a safe work environment Mentor your team in analyzing experimental process flows looking for defect anomalies and quarantining process tools that are out of control Build an environment of continuous improvement process (CIP) demeanor, looking for ways to improve operations, and how to make a difference today Develop inspection technology roadmaps to drive our internal and external partners enabling a clear path to future advanced memory needs</l