Physical Security Agent in United States

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We’re looking for a Timing Engineer to join our silicon team. In this role, you’ll drive static timing analysis and closure for complex, high-performance designs. You’ll collaborate closely with logic, DFT, and physical design teams to debug constraints, optimize paths, and ensure our chips meet performance targets across corners and modes. This role is hybrid , based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA . We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Experienced in STA and passionate about enabling silicon to meet aggressive performance goals. Analytical and detail-oriented, with a strong understanding of timing paths, constraints, and optimization strategies. A collaborative team player who works well across logic, DFT, and physical design boundaries. Resourceful and self-driven, capable of developing scripts and methodologies that improve timing closure workflows. What We Need 7+ years of industry experience and a proven record of successful tapeouts. Deep knowledge of STA tools and techniques, including noise, crosstalk, and OCV analysis. Proficiency in writing and debugging SDC constraints, creating ECOs, and

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent licenses RISC-V and AI IP to customers who need hardened, PPA-proven deliverables on their target node and foundry. This role owns physical implementation of those IP blocks end to end, from synthesis through PnR, timing closure, and GDSII signoff, and directly determines how fast we can commit to a customer's timeline. This role is hybrid, based out of Toronto, ON; Austin, TX; or Belgrade, Serbia. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on physical design engineer who owns blocks end to end, with a track record of block-level and IP tapeouts on advanced nodes. Driven by PPA outcomes, working closely with RTL owners to close critical paths and hit power budgets. Rigorous about signoff quality, because our IP ships to customers who integrate it without you in the room. What We Need BS/MS/PhD in EE/ECE/CE/CS with 5+ years of block-level or IP-centric physical design through tapeout. Expertise with industry-standard tools (Innovus, ICC2/FusionCompiler, PrimeTime) and scripting languages (Tcl, Python, Perl). Deep understanding of advanced node challenges, low-power design (UPF, power gating, multi-Vt, voltage sc

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a talented Physical Design Engineer to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid, based out of Austin, TX or Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts. Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration. Strong problem solver who excels at debugging complex issues across design hierarchies. Collaborative team player who thrives in fast-paced, technically challenging environments. What We Need BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs. Expertise with industry-stan

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Our IP delivery timelines are set as much by flow maturity as by design work. This role develops, deploys, and owns the RTL-to-GDSII methodology the IP physical design team runs on, so a new block, node, or customer variant starts from a working flow instead of a cold start. This role is hybrid, based out of Toronto, ON; Austin, TX, or Belgrade, Serbia. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A physical design or CAD methodology engineer who has built flows that production teams depend on daily. Automation-minded, happiest when you are removing manual steps and making PPA exploration repeatable. Building with AI as part of how you develop flows, and opinionated about where LLMs and ML-driven optimization genuinely help versus where they do not. An effective partner to design teams and EDA vendors, and a clear writer who documents flows well enough that others can run them without you. What We Need An Engineer with 5+ years developing and supporting physical design methodology or CAD flows in production use. Expertise with industry-standard tools (FusionCompiler/ICC2, Innovus/Genus, PrimeTime, RedHawk) and scripting languages (T

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are seeking a highly skilled Physical Design Engineer with deep expertise in physical design and methodology. This individual contributor role sits within our physical design team and is central to delivering power, performance, and area (PPA) optimized datapath and interconnect solutions for next-generation AI accelerators. You’ll work closely with RTL designers to define and execute on physical design strategies. You will develop tools, flows and methodologies to increase team productivity. Your work will directly impact silicon’s performance and cost efficiency, as well as the team’s execution velocity and quality. In this role, you will: Develop, build and own tools, flows and methodologies for physical implementation Own physical implementation of floorplan blocks from floorplanning to final signoff Collaborate with RTL designers to drive optimal block implementation solutions Analyze and optimize design for timing, power, and area trade-offs, working in collaboration with EDA vendors and ASIC partners Qualifications: BS w/ 4+ or MS with 2+ years or PhD with 0-1 year(s) of relevant industry experience in physical design and methodology development Demonstrated success in taping out complex silicon designs Hands-on experience with block physical implementation and PPA convergence Strong coding experience with python, bazel, TCL Strong experience building physical design tools, flows and methodologies Strong understanding of microarchitecture, RTL design,

About the Team OpenAI’s Forward Deployed Engineering team partners with leading semiconductor companies to deploy production-grade AI systems across the entire chip design lifecycle: design, verification, and physical design. We operate at the intersection of customer delivery and core platform development, embedding deeply with customers to translate frontier model capabilities into systems that materially improve engineering workflows and accelerate innovation. Our work turns early, high-touch deployments into repeatable solution patterns, reference architectures, and evaluation practices that scale across the semiconductor ecosystem. About the Role We are seeking a highly skilled Physical Design Engineer to join our semiconductor-focused Forward Deployed Engineering team. This is a senior IC role that will begin with a strong emphasis on physical design expertise, technical judgment, advisory leverage, and customer credibility, with the expectation that the person will grow into a broader Forward Deployed Engineering role over time. In the near term, you will serve as the team’s physical design SME across semiconductor deployments: helping FDEs, Product, and Research understand backend implementation workflows, pressure-test AI-assisted solution ideas against real physical design constraints, and raise the quality of our customer-facing technical work. You will help the broader team build fluency in implementation flows, EDA tooling, signoff methodology, and the trade-offs that shape physical design decisions in practice. Over time, we expect this role to expand beyond SME support into broader FDE ownership: partnering directly with customers, shaping deployment strategy, building and iterating production-grade AI systems, driving technical workstreams, and helping turn high-touch semiconductor deployments into repeatable solutions. This is a strong fit for someone who brings deep physical design expertise today and is excited to grow into a customer-facing, syst

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will be joining a brilliant team to collaborate with Micron’s various design and verification teams all over the world, support the efforts of design verification flow development, optimization, and implementation and work with cross-functional team to assure the best cost, quality, reliability, time-to-market, and customer satisfaction As Memory Design Group CAD Engineer at Micron Technology, Inc., you will be working in a collaborative, production support role evaluating, developing enhancing and debugging both in-house and commercial Electronic Design Automation (EDA) tools and flows for the physical layout and design of CMOS integrated circuits. You will work closely with the Design, Layout teams, supporting their use of electronic design automation tools and methodologies to increase design and layout productivity and work efficiency. Responsibilities : Develop tools, flows, and methodologies to increase the productivity and reliability of our Memory designs Integrate commercial EDA (Electronic Design Automation) tools into design flows Provide training, documentation, and support to end users on new tools and method. Work closely with design, layout, verification and process teams. Undertake independent research and development of ne

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an Physical Design Engineer to lead cross-functional efforts to solve complex physical design challenges and develop end-to-end RTL-to-GDS methodologies across advanced nodes, with a strong focus on PPA and runtime improvements. The engineer will architect, integrate, and deploy AI/ML-driven solutions into production physical design flows, creating custom CAD tools and partnering with internal teams and EDA vendors to drive next-generation, ML-enabled capabilities. This role is hybrid, based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are BS in Electrical or Computer Engineering (or equivalent experience) with 5+ years in Physical Design CAD methodology at advanced nodes. Proven track record improving PPA and/or runtime on high-performance, low-power taped-out designs. Hands-on with industry-standard EDA tools (e.g., Fusion Compiler) across synthesis, P&R, STA, signoff, and hierarchical flows. Strong Python/Tcl and data skills, with interest or experience in ML frameworks (PyTorch, TensorFlow), and the ability to drive complex projects independent

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking talented Physical Design Engineers to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid , based out of Austin, TX, Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts. Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration. Strong problem solver who excels at debugging complex issues across design hierarchies. Collaborative team player who thrives in fast-paced, technically challenging environments. What We Need BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs. Expertise with industry-

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an exceptional Senior-level Physical Design Engineer to drive top-level implementation of our complex AI and CPU System-on-Chip designs. You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level. If you excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware, we need your expertise. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned physical design engineer who thrives on complex, full-chip implementation challenges. Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams. Passionate about optimizing chip-level implementations for power, performance, and area. Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules. What We Need 8+ years of top-level SOC physical design experience on complex, multi-million gate designs. Deep expertise in hierarchic

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You’ll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we’d love to hear from you. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure. A hands-on problem solver who excels at debugging and driving signoff through complex verification flows. A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces. A mentor and technical leader passionate about building efficient, manufacturable silicon. What We Need BS/MS in Electrical/Electronics Engineering (or related) with 7–14 years of hands-on CPU/IP/SoC physical verif

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑performance, low‑power digital logic used in advanced memory products. This role spans backend implementation from Netlist to GDSII, with a strong focus on timing closure, power integrity, and manufacturability in advanced process technologies. The successful candidate will work closely with RTL, DFT, CAD, and verification teams to deliver high‑quality physical designs, contribute to methodology improvements, and help push performance, power, and area (PPA) targets in complex, multi‑hierarchy designs. Key Responsibilities: Own and execute physical design implementation from synthesized netlist through GDSII, including floorplanning, placement, clock tree synthesis, routing, and physical signoff Utilize AI-Enabled tools in the Netlist to GDS flow Perform and drive timing closure across multiple modes, corners, and scenarios using industry‑standard STA tools Analyze and resolve congestion, timing, IR drop, EM, and power integrity issues Develop and refine floorplans, power grids, and clocking strategies for high‑performance designs Work with placement and timing closure of custom analog hard IP macros in a digital-on-top design flow Collaborate closely with RTL designers to influence partitioning, constraints, and micro‑architecture decisions early in the design cycle Implement and va

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Design Technology Co-Optimization (DTCO) team works at the intersection of process technology, standard cell architecture, and design implementation to optimize power, performance, and area (PPA) for advanced memory products. The team collaborates closely with standard cell library, RTL, and physical design engineers to evaluate design tradeoffs and develop methodologies that improve silicon outcomes. As a DTCO Intern, you will gain hands-on experience assessing and optimizing PPA at the standard cell and logic block level. You will use industry-standard place-and-route tools and AI-enabled automation techniques to implement, benchmark, and optimize logic blocks while developing practical skills in physical design, timing closure, and design analysis. Responsibilities Implement standard cell logic blocks using industry-standard physical design tools, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization activities focused on PPA assessment. Analyze and benchmark power, performance, and area across standard cell libraries and logic block configurations, identifying opportunities for improvement. Perform static timing analysis (STA), investigate setup and hold timing violations, and support timing closure activities. Execute physical verification checks, including DRC, LVS, and IR-drop analysis, and assist with resolving design issues. Leverage Generative AI, AI Assistants, and Agentic AI solutions to automate data collection, reporting, comparison, and w