Advance Packaging Process Development Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements. 其他職務說明 As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations. Driving Cumulative Yield Ownership wit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept throug

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Memory Design Engineer you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products . You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates , supporting both silicon release and ongoing product lifecycle needs. This role requires strong AI driven technical execution and the ability to independently drive complex issues to closure. Responsibilities Design Support: Work on HBM product design and support sustaining design maintenance (ECOs/spec changes). Silicon Debug: Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. Cross-Functional Collaboration: Work closely with DE, PE, TD,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping, micro‑cracks, subsurface damage,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology Development — Advanced Modeling & AI Solutions (AMAIS) organization, you will be part of a multidisciplinary team developing next-generation Digital Twins, predictive modeling solutions, and AI-driven technologies that accelerate advanced memory development and manufacturing excellence. You will create predictive digital representations of semiconductor processes, materials, structures, equipment, and products across DRAM, NAND, and advanced packaging technologies including HBM. Leveraging physics-based modeling, computational methods, machine learning, GenAI, large language models (LLMs), and agentic AI frameworks, you will enable technology co-optimization, design-space exploration, process optimization, yield improvement, and accelerated technology learning. Working at the intersection of engineering fundamentals, manufacturing data, and digital engineering, you will develop scalable predictive and prescriptive solutions that connect process, structure, performance, yield, reliability, and cost. This role offers the opportunity to influence critical technology decisions, drive fab-technology co-optimization , and advance Micron's leadership in data-driven semiconductor memory innovation. Qualifications: Independence – be comfortable executing activities and needs Experience in algorithm development, numerical methods, and scientific computing Solid experience with Plasma, FPM, HAR etching, and MC modeling Experience with Wet Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Responsibilities: Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products Drive process capability, cost, and variability improvements using data‑driven experimentation and equipment innovation Collaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding Perform root‑cause and failure‑mode analysis a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary We are seeking a highly motivated Failure Analysis Engineer to join our Product Failure Analysis (PFA) Laboratory. The successful candidate will be responsible for conducting failure analysis, root cause investigations, and advanced package characterization to support product development and yield improvement. This role requires strong analytical skills, hands-on laboratory experience, and the ability to collaborate with cross-functional teams in a fast-paced semiconductor environment. Qualifications Education Bachelor's or Master's degree in: Materials Science & Engineering Electrical Engineering Electronics Engineering Mechanical Engineering Chemical Engineering Physics, Chemistry, or related technical disciplines Experience in one or more of the following areas is preferred: Wafer Fabrication Assembly and Packaging Product Engineering Yield Enhancement Failure Analysis Laboratory Advanced Packaging Technologies Responsibilities Perform electrical and physical failure analysis of semiconductor devices and packages. Conduct root cause investigations and provide technical recommendations. Develop and execute analytical plans to support engineering requests. Interpret analytical results and communicate findings effectively. Collaborate with Process, Product, Quality, Reliability, and Manufacturi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Design Engineer, you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products . You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates , supporting both silicon release and ongoing product lifecycle needs. This role requires strong technical execution and the ability to independently drive complex issues to closure. Responsibilities Design Support: Work on HBM product design and support sustaining design maintenance (ECOs/spec changes). Silicon Debug: Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. Cross-Functional Collaboration: Work closely with DE, PE, TD, and system teams

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the Customer Engineering Technical Leadership (CETL) function within HIG PSE, the Technical Leader will serve as a key technical interface between external customers and internal engineering teams. In conjunction with CIL (Customer Integration Lead), this role requires deep technical engagement to understand customer application requirements and align them with internal HBM design, product engineering, and manufacturing processes (Front-End and Back-End). The position emphasizes technical problem-solving, multi-functional teamwork, and driving integration success for advanced HBM products. Develops and deploys AI systems that help automate processes and tackle technical challenges. Responsibilities: Develop a strong understanding of customer system architecture, application requirements, and integration challenges. Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams. Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies. Develops and deploys AI (artificial intelligence) systems that help automate processes and tackle technical challenges Work closely with internal teams across front-end/back-end process engineering, product development, and manufacturing to ensure seamless integration. Support design reviews, failure analysis, and yield improvement initiatives tied to customer requirements. </ul

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Advanced Package/Product Integration Drive package product integration for next-generation advanced packaging technologies. Identify integration risks and implement corrective actions during development. Support design rule development and package architecture optimization. Hiring Need: Current workload exceeds available engineering bandwidth, increasing program delay and technical risk exposure. 2. Cross-Functional Technical Leadership Act as primary interface among product engineering, process engineering, manufacturing, suppliers, and customers. Drive alignment on technical decisions and risk mitigation plans. Lead failure analysis and corrective action activities. Hiring Need: Growing project complexity requires additional senior technical leadership to avoid bottlenecks and improve execution efficiency. 3. Customer Support and Technical Engagement Support customer technical reviews and package feasibility assessments. Provide technical recommendations for package implementation and risk reduction. Address customer escalations related to package performance and reliability. Hiring Need: Increased customer interaction volume requires dedicated engineering support to maintain responsiveness and customer satisfaction. 4. Reliability Improvement Drive root-cause investigations for package failures. Improve package yield, reliability, and manufacturing robustness. Develop long-term corrective and preventive actions. Hiring Nee

Principal/Staff Advanced Packaging Development Process Engineer — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior or Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities. You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron’s global leadership in s

About the Role You will contribute to and own aspects of the Volantis A-0 and A-1 package. We are interested in both people with package design as well as package process development backgrounds Our end goal has challenges to overcome in warpage, CTE mismatch, thermomechanical aspects, assembly speed and more. We're building a wafer-scale package with both silicon and compound semiconductor dies sitting together at very high TDP. This creates both unique challenges and opportunities. The end result is breaking the memory wall, enabling a new era of AI, and a platform that scales another 1-3 orders of magnitude. What We Look For Ability to think from first principles about novel problems- not just applying existing solutions outside of their range of application. What works for 5x reticle platforms may not work for 56x reticle platforms Design or process development of complex packages Nice to Have: Experience with heterogeneous material assemblies Experience with high-TDP packages Experience with compound semiconductor assemblies Experience with co-packaged optics Ability to work with architects to co-design system architecture and package design Experience with interposer platforms such as CoWoS, CoWoS-L, CoWoS-R, EMIB, FoCoS, FoCoS-Bridge, etc Experience with flip-chip integration, especially mass reflow, TCB & LAB Experience with large scale (>50x50mm) substrates Compensation Package: Competitive Base salary + Significant Equity Stake. You'll be well compensated while also owning a piece of the outcome. California Pay Range: $250K-$400K