Advanced Cmos Device And Process Integration Engineer Jobs

Advanced Practice Provider NP/PA — TX - Austin. Apply via Workday.

Advanced Practice Provider — NC - Huntersville. Apply via Workday.

Advanced Technology Japan Engineer, Dry Etch — Hiroshima - Fab 15, Japan. Apply via Workday.

Advanced Technology Japan ATE PHOTO ENGINEER — Hiroshima - Fab 15, Japan. Apply via Workday.

Advanced Technology Japan Engineer, CVD/PVD — Hiroshima - Fab 15, Japan. Apply via Workday.

Advanced Technology Japan Engineer, WoW Bonding — Hiroshima - Fab 15, Japan. Apply via Workday.

Advanced Technology Engineer (Wet Process) / 先端半導体技術エンジニア（ウェットプロセス） — Hiroshima - Fab 15, Japan. Apply via Workday.

Advanced Technology Engineer (Wet Process) / 先端半導体技術エンジニア（ウェットプロセス） — Hiroshima - Fab 15, Japan. Apply via Workday.

ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION — Taichung - Fab 16, Taiwan. Apply via Workday.

Advanced Engineering & Manufacturing Internship (Singapore) — 4 Locations. Apply via Workday.

Advanced DRAM Process Integration Engineer — Boise, ID - Main Site. Apply via Workday.

Advanced Technology Japan Engineer, Dry Etch — Hiroshima - Fab 15, Japan. Apply via Workday.

Advanced Technology Japan Engineer, CMP process — Hiroshima - Fab 15, Japan. Apply via Workday.

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Accountable and sustain for Bond process. • Backup for Debond area process basic maintenance. • Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​