Advanced Package Technology Development Pi Staff Engineer Jobs

Responsibilities and Tasks: • Establish and improve equipment condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify equipment management projects. • Set up process parameters for a variety of semiconductor equipment. •…

Responsibilities and Tasks: • Accountable and sustain for Bond process. • Backup for Debond area process basic maintenance. • Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management…

HBM Advanced Package Process / Equipment Engineer at Micron in Taichung, Mtb, Taiwan. Full-time · On-site.

Job Description Summary: We are seeking an experienced Fail-Mode Metric Reaction (FMR) Engineer to drive yield analysis, failure mode characterization, and failure mechanisms understanding across test vehicles and advanced packaging products. This role owns the reaction loop…

As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material…

We are growing our team and looking for c

Chiplet Physical Design Engineer at Tenstorrent in Santa Clara, California, United States.

Senior DFT Engineer, Architecture at Tenstorrent in Tokyo, Japan, Japan.

About the job Own the manufacturing performance behind advanced AI compute systems in volume production. As, Senior Manufacturing Product Engineer you will connect product design, test, quality and supply chain with manufacturing execution. You will support volume production…

About The Weather Company: The Weather Company is the world’s leading weather provider, helping people and businesses make more informed decisions and take action in the face of weather. Together with advanced technology and AI, The Weather Company’s high-volume weather data,…

Responsibilities will include, but are not limited to: • Own and deliver critical HBM IO blocks and subsystems from architectural definition through circuit and RTL implementation, verification, tape-out, silicon bring-up, and post-silicon debug, including interfaces supporting…

We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next…

Responsibilities will include, but are not limited to: Work on electrical and physical design of high-speed interfaces in packages. Work on electrical model extraction and validation of package interconnects with circuit design team and IP vendor to optimize silicon layout and…

Semiconductor Package Electrical Engineer at Micron in Hyderabad, Phoenix Aquila, India.

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., you will contribute significantly to assuring the outstanding quality and durability of Micron’s products. This distinctive position allows you to coordinate package qualification for new products…