Advanced Packaging Substrate Supplier Enablement Lead Jobs

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful. Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives. Key Responsibilities Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones. Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement. Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments. Drive continuous improvement initiatives to minimize defects and optimize process reliability. Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance. C

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer

Job Details: Job Description: The Role and Impact: We are seeking a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site, supporting Intel's advanced packaging programs (EMIB, Foveros). This role spans silicon processing and wafer-level assembly (WLA) flows, and key interfaces with packaging substrates and 2.5D EMIB technology. You will help ensure that products and processes meet rigorous quality and reliability standards from wafer fabrication through packaging and assembly. The position directly influences manufacturing performance, yield, reliability, and customer satisfaction by driving robust quality control, disciplined excursion management, and continuous process improvement. You will also have the opportunity to represent Quality and Reliability in development forums, Silicon and Advanced Packaging factory operations, and Substrate suppliers. Key Responsibilities Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications. Collaborate with cross-functional teams to drive effective root cause analysis, systemic corrective and prevention actions using 8D and related problem-solving methodologies. Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen early excursion detection, process controls, in-line screens, and outgoing quality. Drive quality control improvements devising incoming/ outgoing quality controls, using statistical process control, defect pareto analysis, control plans, audit learnings, and excursion prevention indicators across fab, substrate manufacturing, and assembly manufacturing steps. Support manufacturing excursion management, including MRB facilitation, cont

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: As a Module Equipment Technician, you will play a vital role in ensuring the smooth operation of advanced manufacturing equipment used in semiconductor production. You will perform hands-on troubleshooting, maintenance, and calibration of electromechanical systems while supporting experiments and equipment modifications that drive cutting-edge advancements. Your work will directly contribute to enhancing equipment reliability and optimizing production efficiency, making an essential impact on Intel's manufacturing operations. Business Group Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) organization, a leader in delivering innovative and cost-effective substrate packaging solutions. This business group is focused on advancing Intel's capabilities in manufacturing technology to maintain competitive excellence across global markets. As part of this dynamic team, you will support critical equipment and collaborate on continuous improvement initiatives that align with Intel's broader mission of innovation and growth. Key Responsibilities Perform electrical and mechanical troubleshooting to diagnose issues with manufacturing equipment. Execute setup, calibration, corrective and preventative maintenance on production equipment, including wet chemistry, plating, and dry high-vacuum toolsets. Monitor tool performance and analyze data to identify and address equipment-related issues. Collaborate with engineering and support teams to improve equipment reliability and reduce downtime. Document maintenance activities, repair findings, and parts usage using established systems and procedures. Lead or contribute to continuous improvement projects, focusing on equipment optimization and yie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio. As a Principal Signal Integrity Engineer , you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption. What You’ll Work On Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks. Key signal integrity domains include: Intercon

Job Details: Job Description: As one of the world's largest semiconductor manufacturers, Intel is committed to advancing every aspect of semiconductor technology, from process development and manufacturing to advanced packaging and reliability characterization. Employees within Intel Foundry are part of a global network spanning technology development, manufacturing, assembly, test, and quality organizations across both front-end silicon and advanced packaging facilities. You will join the Foundry Lab Network (FLN), a key organization within Foundry Quality, Reliability, and Labs (FQRL), located at Intel's growing Chandler, Arizona site. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations. FLN is actively expanding its laboratory capabilities and capacity to support Intel Foundry's roadmap, enabling faster technology qualification and accelerating development cycles through Quick Turn Monitoring (QTM) solutions that significantly reduce time-to-data. As the Stress Test and Reliability (STaR) Back-End Laboratory Manager, you will play a critical leadership role within FLN. You will partner closely with Packaging Technology Development, Quality and Reliability, and Failure Analysis teams to establish and enhance laboratory capabilities that support qualification and certification of next-generation packaging technologies and products. This position offers a unique combination of people leadership, technical problem solving, and organizational strategy. You will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operati

Job Details: Job Description: The Role and Impact We are seeking a Module Engineer to play a pivotal role in advancing Intel's high-volume manufacturing capabilities. In this position, you will oversee critical equipment and processes that enable the production of cutting-edge integrated circuits, driving innovation in device miniaturization and semiconductor excellence. Your expertise will directly impact production efficiency, quality, and yield, ensuring Intel maintains its leadership in the semiconductor industry. Business Group Join Intel Corporation's Engineering team, which is dedicated to enabling the rapid advancements of semiconductor manufacturing technologies. This group supports Intel's broader mission of delivering world-class technology solutions by optimizing manufacturing processes, ensuring high-quality outputs, and transferring technology globally. As part of this team, you will collaborate across regions to shape the future of semiconductor innovation. Key Responsibilities - Operate and optimize high-volume manufacturing equipment and processes to maintain control over critical dimensions and defectivity. - Conduct tests and measurements to evaluate equipment and process performance, recommending and implementing modifications to improve productivity and quality. - Execute maintenance, repair, and upgrades for assigned equipment and modules to ensure consistent operational excellence. - Lead continuous improvement initiatives focused on enhancing safety, productivity, cost efficiency, and yield. - Develop and implement excursion prevention systems to detect and address discrepant materials or activities in equipment and processes. - Facilitate technology transfer to global manufacturing sites through training, audits, and documentation to ensure consistent processing across locations. - Oversee installation, conversion, and qualification of

ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION — Taichung - Fab 16, Taiwan. Apply via Workday.

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

Senior Advanced Packaging Material Category Supplier Manager (HBM) — Taichung - MTB, Taiwan. Apply via Workday.

Director - Foundry Advanced Packaging Business Development — US, California, Santa Clara. Apply via Workday.

Package Architect – Advanced Packaging & System Exploration — 2 Locations. Apply via Workday.

Mechanical Simulation Engineer – Advanced Packaging — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Principal/Staff Advanced Packaging Development Process Engineer — Fab 10A, Singapore. Apply via Workday.