Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Memory Design Engineer at Micron, you will have the outstanding opportunity to impact the future of memory technology! You will be working in an ambitious environment with a team of world-class engineers to build and analyze digital, analog, and mixed-signal circuits for advanced memory products. Our collaborative approach ensures flawless solutions and innovation, driving the success of future memory generations. Responsibilities Contribute to the development, optimization, and layout of Memory, Logic, and Analog circuits for next-generation memory products. Perform parasitic modeling and support build validation, reticle experiments, and required tape-out revisions. Coordinate and guide the layout process including floor-planning, placement, routing, and physical integration. Conduct circuit modeling and simulation using industry-standard tools to verify timing, functionality, and reliability. Collaborate across CAD, modeling, standards, and verification groups to align with best-known-methods and improve build quality. Partner with Probe, Test, Product Engineering, Assembly, Marketing, and Process Integration to ensure accurate manufacturability and product readiness. Support cross-team communication to promote standardization, consistency, and shared engineering success. Propel innovation through contributions to methodologies, architectures, and technologies for upcoming memory generations. Minimum Qualifications Bach
Jobiba hiring network
Analog Circuit Design Engineer Jobs
236 active opportunities · Updated for October 2026
Fresh results
15 shown
Explore current analog circuit design engineer jobs. Use filters to narrow by work mode, employment type, experience and date posted.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions! In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction! Job Description As a Staff DRAM Design Engineer, you’ll play a critical role in shaping memory architectures and circuit innovations that directly impact product performance, power, and reliability. This is a hands-on design role where your expertise will drive key decisions from concept through silicon validation, while collaborating with cross-functional teams to deliver meaningful results. Responsibilities: Lead design and optimization of DRAM circuits including memory array, control logic, datapath, and test logic Perform and analyze circuit simulations using tools such as SPICE and Verilog Evaluate architectural trade-offs impacting power, performance, and die size Integrate layout parasi
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Design Engineer, you will build the future of memory by architecting and delivering high‑performance DRAM circuit compositions for advanced technology nodes. In this highly visible technical leadership role, you’ll develop innovation across building, layout, verification, and silicon validation. You will collaborate closely with multi-functional teams to deliver scalable, manufacturable solutions for next-generation memory products. Your work will directly influence performance, power, reliability, and time‑to‑market for Micron’s groundbreaking memory technologies. Responsibilities Design and optimize DRAM circuits spanning digital, analog, and memory core subsystems to meet aggressive power, performance, and reliability targets Develop and refine floorplans, routing strategies, power delivery networks, sense margins, timings, and die‑size tradeoffs Perform advanced circuit simulations using FINESIM, HSPICE, and VERILOG, analyzing speed, power, noise, and long‑term reliability Model parasitics, verify power and signal integrity, and support validation, reticle experiments, and tape‑out revisions Drive simulation‑to‑silicon correlation, identify gaps, and recommend schematic and layout improvements Lead technical reviews, documentation, and best‑practice standardization across design and layout teams Coordinate and manage layout and build resources, tracking breakthroughs and resolving critical path issues S
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction The Non-Volatile NAND Design Engineering group is responsible for the design and optimization of analog, digital and mixed-signal circuits enabling advanced NAND Flash memory products. Close collaboration with cross-functional teams ensures scalable, manufacturable, and reliable solutions across technology nodes. Position Overview As a Design Engineer in the NVE Design Engineering Core group at Micron Semiconductor Italia, you will contribute to the development of memory products that are best-in-class, using your specialized knowledge and Micron proprietary methods of designing and analyzing core and mixed circuits used in the development of memory products. Responsibilities Responsibilities include, but not limited to: • Design, simulate, and optimize NAND core circuit blocks, balancing performance, power, area, and reliability trade-offs. • Translate product and system requirements into circuit implementations, evaluating feasibility and functionality across use cases. • Perform comprehensive circuit verification (DC, AC, transient, noise, Monte Carlo, PVT corners) at block and chip level. • Collaborate with cross-functional teams to improve power efficiency, manufacturabil
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are shaping the memory technologies that power today's most advanced computing platforms, from AI accelerators to mobile and client devices. Our DRAM Engineering team brings together skilled engineers across the globe to solve complex technical challenges, drive innovation, and deliver high-performance memory solutions. If you enjoy tackling difficult problems and turning ideas into products, you'll find exciting opportunities to make an impact here. As a Semiconductor Design Engineer (Principal / Member of Technical Staff / Senior Member of Technical Staff), you will play a key role in designing and optimizing next-generation DRAM products. You will work closely with global design, verification, and multi-functional teams to develop innovative circuit solutions that balance performance, power, quality, reliability, and cost. This role also offers the opportunity to influence technical direction, mentor engineers, and help advance future memory technologies. Responsibilities: Design and optimize digital and analog circuits for next-generation DRAM products, including memory arrays, control logic, datapaths, address decoding, and I/O circuitry. Lead circuit development, simulation, verification, and silicon validation to achieve performance, power, area, and quality targets. Drive floor-planning, layout optimization, parasitic analysis, and tape-out activities. Advance AI-assisted design, automation, and design-space exploration through collaboration with internal and external partne
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior or Staff Design Engineer in the NVE Design Engineering Core group at Micron Technology, Inc., you will contribute to the development of memory products that are best-in-class, using your specialized knowledge and Micron proprietary methods of designing and analyzing core and mixed circuits used in the development of memory products. What’s Encouraged Daily: Develop array waveforms with detailed timing and biasing conditions of array signals. This requires in-depth familiarity of Nand Flash memory read, program and erase algorithms. Collaborate closely with Firmware team, Analog team and Design validation teams during actual implementation of waveforms. Plan the wordline and bitline path architecture according to area, performance and power specifications. Determine the placement of these circuit blocks and collaborate with project teams in integrating these circuit blocks to the chip plan. Perform die size cost and benefits analysis of new array circuits and algorithms prior to implementation. Working closely with other functional teams to evaluate, analyze, and improve NAND power consumption. Generate Xpath, Ypath and Array schematics during project execution and work with project teams integrating the Core schematics into the fullchip schematics. Perform block level simulations of the circuits using spice simulator and oversee layout implementation of the circuits. Perform subsystem and fullchip simulations during project execution. Develop and maintain Python-ba
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description We develop advanced memory technologies that transform how the world uses information to enrich life for all. As a Design Engineer, you will craft and optimize digital, analog, and memory circuits while collaborating with global design and verification teams. You will build solutions that improve quality, reliability, manufacturability, and product performance while continuing to learn and innovate in a global engineering environment! Responsibilities Design, develop, and optimize memory, logic, and analog circuits for new memory products. Perform circuit validation, parasitic modeling, reticle experiments, and tape-out revisions to drive performance and manufacturing efficiency . Lead layout activities including floorplanning, placement, routing, verification, modeling, and simulation using industry-standard tools. Collaborate across Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to solve technical challenges and support successful product execution. Drive innovation in future memory technologies while building design quality and standardization across global engineering teams. Minimum Qualifications Bachelor’s degree or equivalent experience in Electrical Engineering, Electronic Engineering, or a related field, with 10+ years of relevant industry experience; or a master’s degree with 7+ years; or a Ph.D. with 5+ years of relevant industry experienc
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ROLE Lead first-silicon bring-up, characterization, debug, and validation of advanced 3D NAND products. Establish whether silicon meets design intent and datasheet requirements, correlate simulation with measurements, and resolve issues that could affect product qualification, reliability, yield, or SSD/system integration. This role provides a unique opportunity to develop end-to-end expertise across advanced NAND products, spanning circuit design concepts, mixed-signal simulations, first-silicon bring-up, silicon debug, product qualification, and manufacturing readiness. Engineers gain broad exposure to analog, mixed-signal, digital, firmware, memory-array, and system-level behavior while working closely with design, verification, firmware, product, and system teams. RESPONSIBILITIES • Own validation strategies, coverage, and test plans for assigned NAND circuits and functions; define expected behavior, operating corners, and pass/fail criteria from product specifications and design intent. • Lead first-silicon bring-up, characterization, debug, and simulation-to-silicon correlation across voltage, temperature, process, timing, and workload conditions. • Characterize and debug NAND subsystems including reference and bias generation circuits, bandgap references, oscillators, voltage regulators, charge pumps, sensing and page-buffer paths, high-voltage program/er
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff DFT Design Engineer, you will work on design, simulation, and validation of next generation High Bandwidth Memory (HBM) architectures and circuit blocks. The HBM DFT Design Engineer is responsible for defining, designing, and integrating Design for Test (DFT) architectures for next generation High Bandwidth Memory (HBM) products. This role ensures robust test coverage across wafer, die, stack, and system in package (SiP) test stages while balancing performance, power, area, and manufacturing cost. The engineer works in a multi-functional manner with HBM build, verification, product engineering, test enablement, packaging, and external partners to deliver manufacturable, high quality HBM solutions. Responsibilities will include, but are not limited to: Define and implement HBM DFT architectures, including scan, MBIST, JTAG, boundary scan, TSV test, redundancy test, and at‑speed test structures. Develop DFT solutions for both base die and DRAM die, considering stacked‑die and cube‑level test requirements. Design and integrate test access mechanisms to support wafer probe, cube test, and SiP/system test flows. Collaborate with Product Engineering and Test Enablement teams to align DFT features with manufacturing test flows and cost targets. Support yield learning, failure analysis, and debug by enabling observability and controllability in silicon. Work closely with logic, analog, layout, verification, and physical design teams to ensure DFT is
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction The Systems Integration Group (SIG) develops advanced test solutions that support semiconductor manufacturing and product quality. The team partners across engineering, operations, procurement, and external suppliers to design, build, and deploy innovative hardware platforms that enable reliable testing and validation of semiconductor devices. Join the team building semiconductor memory test platforms for tomorrow’s AI infrastructure. Position Overview As an Electrical Design Engineer, you will design and develop electronic hardware used in advanced semiconductor test systems. You will apply electrical engineering principles to create analog, digital, and mixed-signal solutions that support manufacturing and product development. This role spans the full hardware development lifecycle, from concept and design through validation, deployment, and sustaining support. You will collaborate with cross-functional teams around the world to deliver reliable, high-quality test solutions. Responsibilities Design analog, digital, and mixed-signal electronic circuits from concept through implementation and validation Evaluate and select electronic components to meet system performance, reliability, and cost objectives Develop schematics and collaborate with PCB designers to create optimized board layouts Perform circuit simulation, analysis, and design verification using industry-standard tools Debug, test, and val
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Design Engineering Group (DEG) is where bold ideas become real technology. We push the limits of memory and storage innovation, and we thrive in a collaborative environment where engineers learn, build, and solve challenges together. We are driven by curiosity, creativity, and the pursuit of better solutions every day! As a Design Engineer, you will help shape the next generation of Micron’s memory products. You’ll work closely with global design, verification, and product teams to bring innovative circuit designs from concept to silicon. Your work will directly influence product performance, quality, and reliability—and contribute to advancements that define the semiconductor industry. Responsibilities: Design, optimize, and verify block‑level circuits for DRAM projects Compare silicon performance with simulation results and support correlation activities Collaborate with process integration and modeling teams on new process node development Partner with global design groups and provide layout guidance through post‑layout simulation Minimum Qualifications: Bachelor’s degree in Electrical Engineering with 2+ years of semiconductor design or manufacturing experience Demonstrated experience in mixed-signal, digital, or analog IC design Experience designing regulators, charge pumps, oscillators, current references, bandgaps, or comparators Proficiency with SPICE and Verilog modeling and simulation Experience working wi
Get new analog circuit design engineer jobs by email
Daily job updates · Unsubscribe anytime