Assembly And Test Central Quality Assurance Manager Jobs

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Conduct mechanical feasibility study from initial ID concepts through sizing analysis, component selection, refinement of design details, assembly and integration, and performance/environment qualification testing Search out materials, components. Create detailed 3D CAD models, 2D drawing and BOM for the product. Perform thermal, structural testing and analysis to predict and optimize the system performance Build prototypes, analyze results of reliability testing, improve the design and bring to production. Develop component and assembly drawings and specifications, tolerances for production Qualifications At least 7+ years of hands-on mechanical design experience. 3D CAD experience is required Collaborate closely with cross-functional teams including ID, EE, Thermal, RF, Optical, Audio, and UX to drive system layout and mechanical integration. Experience in owning a mechanical development effort as a lead engineer Experience with manufacturing processes including plastic injection molding, sheet metal, extrusion, die casting, CNC machining Experience in design for manufacture; design for cost, and other DFX concepts Support failure analysis and root cause investigations; troubleshoot, iterate, and validate solutions efficiently. Experienced in DFM/DFA optimization with mechanical vendors, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Develop and optimize HBM assembly and packaging processes to achieve manufacturing targets. Analyze process data and identify improvement opportunities using statistical and data-driven methodologies. Utilize AI-enabled tools and advanced analytics to improve troubleshooting efficiency and accelerate root cause identification. Drive yield improvement, defect reduction, and process capability enhancement initiatives. Support failure analysis activities and implement corrective and preventive actions. Collaborate with cross-functional teams to resolve technical challenges and support new product ramp. Apply digital and AI-assisted workflows to improve operational effectiveness and engineering productivity. Maintain process documentation and ensure compliance with manufacturing standards. Education Bachelor's or Master's degree in Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, or related disciplines. Experience 0–2 years of experience for New College Graduates (NCG). Semiconductor manufacturing, packaging, or process engineering experience is a plus. Skills Strong analytical thinking and problem-solving capability. Ability to interpret and analyze large datasets to support engineering decisions. <

ABOUT THE BRAND: Callaway Golf Company is a premium golf equipment, gear and apparel company with a portfolio of global brands, including Callaway Golf, Odyssey, TravisMathew, and OGIO. Through an unwavering commitment to innovation and premium craftsmanship, Callaway designs, manufactures, and sells high-performance golf clubs, golf balls, apparel, bags, and other accessories—setting the standard for performance in the game of golf. Our Mission: To create demonstrably superior and pleasingly different products powered by innovative technology and premium craftsmanship enabling golfers of all abilities to play their best and find more joy in the game. Our company is a blend of experience and diverse backgrounds, and together we look to leave the past behind while moving the game forward. For more information, please visit https://www.callawaygolf.com JOB OVERVIEW This role is responsible for the assembly and disassembly of golf ball compression molds. This role will clean, inspect, and repair molds as necessary. This is a 2nd Shift position (2:30 PM - 10:30 PM) ROLES AND RESPONSIBILITIES Work in a safe manner following all PPE and standardized processes Remove molds from compression molding cells and transport to maintenance area and return once completed Required to media blast, bake, and coat semi-permanent mold release Transport mold parts, positions them for assembly Works towards improvements for process efficiencies Perform all other duties as assigned by the Supervisor. TECHNICAL COMPETENCIES (Knowledge, Skills & Abilities) Must be able to read,

At Zoox, we are reimagining personal transportation from the ground up. As an Issue Resolution Engineer, you will play a critical role in ensuring the quality and build readiness of our autonomous vehicles during manufacturing. You will operate at the intersection of engineering and production, driving rapid containment and resolution of issues identified during general assembly and end-of-line validation. This role requires strong technical depth, urgency in execution, and the ability to lead cross-functional teams to root cause and implement durable corrective actions. You will partner closely with Vehicle Engineering, Manufacturing, Quality, Supplier Quality, and Operations to ensure vehicles meet Zoox’s quality standards and production targets. Your work will directly impact vehicle readiness, production efficiency, and overall fleet reliability. In this role, you will: Lead triage, containment, and resolution plan of issues identified during general assembly and end-of-line testing within your assigned subsystem/domain Define and execute short-term containment actions, including rework plans, part quarantine, and build flow protection Collaborate cross-functionally to lead root cause analysis across design, process, supplier, and manufacturing domains, identify and prioritize blockers, and drive Design for Manufacturing (DFM) improvements. Support cross-functional teams to implement permanent corrective actions (PCA) and prevent recurrence Support prototype builds, production trials, and engineering changes to validate fixes and improve manufacturability Develop and maintain metrics, dashboards, and reporting to track issue health, closure rates, and recurrence and improve PIRT processes, including issue tracking, prioritization, and cross-functional execution Qualifications B.S. or M.S. degree in Electrical Engineering or related technical field 8 to 12 years of experien

Job Title Disease management Solutions Clinical Support Specialist (90% Travel M-F) Job Description Disease management Solutions Clinical Support Specialist (90% Travel M-F) Help healthcare providers maximize the value of Philips Disease Management Solutions by delivering expert clinical training, product education, and implementation support across a highly customer-facing field role. Your role: Deliver hands-on and remote clinical training for Philips Disease Management Solutions products, with primary focus on DynaCAD and UroNav, ensuring customer competency and successful adoption. Serve as a trusted clinical consultant to physicians and technologists, providing education, workflow guidance, and application support that improves customer productivity and outcomes. Partner closely with Sales, Marketing, Service, Customer Support, Quality, Research & Development, and Manufacturing teams to support customer success, product implementations, and new product introductions. Demonstrate product expertise, you will be responsible for product assembly and installation for the UroNAV product as well as troubleshoot software and workflow issues, and help customers optimize their use of advanced imaging and post-processing solutions. Travel extensively (approximately 90%) to customer sites throughout the U.S., working from a home-based office and supporting changing customer locations as business needs require. You're the right fit if: You’ve acquired 5&#43; years of clinical experience as an MRI Technologist and/or Ultrasound Technologist, with strong knowledge of imaging workflows and patient care environments. Your skills include troubleshooting software, computer, networking, and basic Digital Imaging and Communications in Medicine (DICOM) issues, along with strong teaching, presentation, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff SSD Firmware Engineer at Micron Technology, Inc., you will build groundbreaking high-performance controller firmware for volatile and non-volatile memory systems. You will assist in the evaluation, creation, build, bench testing, debugging, and failure analyzes of firmware for new high-performance memory controllers and Solid State Drives (SSD) that will improve performance, while reducing power, latency and SoC (System on Chip) complexity for the target sectors. You can expect to partner multi-disciplinary Engineers seek multi-functional product development issues. You will triage failures, file bug reports, and help the development teams with isolating issues. 6-15 Years in SSD/Storage Firmware Development would be a strong plus. Strong firmware design and debug experience using assembly and C programming. Knowledge of NAND flash, SSD flash translation layer, wear leveling, garbage collection. Knowledge on backend SLC, MLC, QLC concepts in the architecture of solid-state drives (SSDs) and flash memory. Knowledge of mass storage interfaces such as SATA, SAS, NVMe (optional but strong plus). Knowledge of configuring and debugging issues from the usage of register settings of ASICs in an SoC and embedded firmware dev environment High level of skill in problem recreation and trapping, and in identifying performance critical algorithms for optimization. Strong skill in ARM development tools and IDE such as Eclipse Ability to scope and esti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff SSD Firmware Engineer at Micron Technology, Inc., you will build groundbreaking high-performance controller firmware for volatile and non-volatile memory systems. You will assist in the evaluation, creation, build, bench testing, debugging, and failure analyzes of firmware for new high-performance memory controllers and Solid State Drives (SSD) that will improve performance, while reducing power, latency and SoC (System on Chip) complexity for the target sectors. You can expect to partner multi-disciplinary Engineers seek multi-functional product development issues. You will triage failures, file bug reports, and help the development teams with isolating issues. 6-15 Years in SSD/Storage Firmware Development would be a strong plus. Strong firmware design and debug experience using assembly and C programming. Knowledge and experience of NAND flash, SSD flash translation layer, wear leveling, garbage collection. Knowledge of mass storage interfaces such as SATA, SAS, NVMe (optional but strong plus). Strong knowledge of Flash Translation Layer (FTL) and SSD firmware concepts. Knowledge of configuring and debugging issues from the usage of register settings of ASICs in an SoC and embedded firmware dev environment High level of skill in problem recreation and trapping, and in identifying performance critical algorithms for optimization. Strong skill in ARM development tools and IDE such as Eclipse Ability to scope and estimate developmen

This is where your work makes a difference. At Baxter, we believe every person—regardless of who they are or where they are from—deserves a chance to live a healthy life. It was our founding belief in 1931 and continues to be our guiding principle. We are redefining healthcare delivery to make a greater impact today, tomorrow, and beyond. Our Baxter colleagues are united by our Mission to Save and Sustain Lives. Together, our community is driven by a culture of courage, trust, and collaboration. Every individual is empowered to take ownership and make a meaningful impact. We strive for efficient and effective operations, and we hold each other accountable for delivering exceptional results. Here, you will find more than just a job—you will find purpose and pride. Your Role at Baxter This is where my hands make life-sustaining products In this role, you will work on the assembly line as part of a collaborative team, contributing to the efficient and accurate production of hospital beds and stretchers. Perform a range of repetitive assembly and/or solder operations at assigned workstations using hand and power tools to assemble various products and sub-assemblies. Move completed assembly to designated areas. Move stock to and from workstations, stock racks and holding areas. May be required to rack and un-rack parts. Your Team Nestled in the scenic hills of Southeastern Indiana, Batesville is more than a great place to live—it’s home to Baxter’s thriving facility, where purposeful work meets a supportive community. Since 1956, our 765,000 sq. ft. site has grown to ov

We’re seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer capture pad design rules, OSAT engagement, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities Own end-to-end bump interconnect development for both ubump (micro-bump) and C4 processes, including bump formation, and reflow for use with mass reflow, TCB, and LAB chip attach for high-performance semiconductor packages. Define and own bump metallurgy stacks for ubump (e.g., Cu pillar/SnAg) and C4 (e.g., SAC alloys) interconnects, including UBM selection and pad finish specifications for both chip-side and interposer capture pads. Develop and own design rules for bump interconnects including pitch, bump diameter, standoff height, keep-outs, and land pad geometry for both the chip side and interposer or substrate capture pads. Lead RDL (redistribution layer) process development including electroplating of Cu RDL traces, via fills, and pad finishes; define RDL design rules for line/space, via diameter, and layer stack-up to meet electrical and reliability requirements. Collaborate with OSATs and bumping foundries to qualify ubump and C4 bumping processes, drive design rule alignment, and manage process transfers into production. Evaluate and mitigate bump interconnect assembly risks including non-wet opens, voiding, head- in-pillow, intermetallic growth, and joint fatigue failures across both ubump and C4 interconnect types. Perform root cause analysis of assembly and reliability failures using cross-sectioning, SEM, CSAM, and other failure analysis techniques. Support reliability qualification including thermal cycling, drop, mechanical shock, and power cycling. Work cross-functionally with design, reliability, thermal, and manu

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities: - Product hardware development, schematics design, layout review, BOM maintenance, functionality verification, planning of production testing, and failure analysis - Work with RF engineers to figure out performance issues of radios. - Review design derating and suggest design update due to DFM (design for manufacturing), DFA(design for assembly) and DFC (Design For Cost.) - Report projects’ status and issue tracking to internal. - Survey and evaluate potential technologies for related products. Teardown and review new products in the market. Must-haves: - At least 3 years of relevant experience in network, server or Media ODM companies. - BS or MS in EE engineering. - Good working knowledge of system level architecture and switch applications, PoE etc.. - Can communicate with foreign engineers directly. - Basic knowledge of EE lab equipment including: oscilloscopes, multimeters, power supplies, etc. - Familiar with QCA/MTK platforms - Proficiency on PCB and schematic tools such as pads, allegro, orcad etc.. Nice-to-haves: - Familiar with EE and RF parts and its fundamental mechanism and its applications. - very organized on platforms and innovative on product concepts. - Leadership in a project. Better to have experience managing teams of 3+ engineers.

Airplane Equipment Installation Design Engineer Company: The Boeing Company Boeing South Carolina (BSC) is looking for Airplane Equipment Installation Design Engineer (Associate, Experienced or Senior) to join our Equipment Installation team in North Charleston, South Carolina. Position Overview: Boeing South Carolina is the home of the 787 Dreamliner. Our team designs, builds and delivers the 787 Dreamliner family of airplanes to customers all over the world. The industry-leading technology of the 787 Dreamliner is creating remarkable opportunities for airlines around the world and dramatically improving the air travel experience. We create a better way to fly for the passengers with more comfort and less fatigue like non-other in the air. We call it the Dreamliner effect. Want to know how aerospace innovations get off the ground? Join us today to be part of our many diverse teams that come together to create an airplane that lives up to Boeing’s principles of safety, quality, and integrity. You will learn more about the people and the products leading the way to the future of air travel. If, this sounds like you and the culture you would like to be part of, we invite you to apply to this role. Our team is currently hiring for a broad range of experience levels including Associate (Level 2), Experienced (Level 3) or Senior (Level 4) Airplane Equipment Installation Design Engineer. Primary Responsibilities: Develops and maintains basic electrical product detail, assembly and installation designs (e.g., equipment racks, power panels, cable routing and geometry, antennas). Develops and maintains basic cable/wire harness detail and assembly d

Wire Harness Installation Engineer (Associate, Experienced, or Lead) Company: The Boeing Company Boeing Defense, Space, & Security (BDS) is looking for a Wire Harness Installation Engineer (Associate, Experienced, or Lead) to join our team in Oklahoma City, OK . This position will provide engineering support across the Boeing portfolio of products, to include – but not limited to – Boeing Military Aircraft and Military Derivative Aircraft (AEW&C, AWACS, C-32/C-40, E-4B, VC-25A, KC-767, B-1B, B-2, B-52 and others). Our teams are currently hiring for a broad range of experience levels including Associate, Experienced, or Lead Level Engineers. Position Responsibilities Associate (Level 2) Develops and maintains wire harness installation engineering drawings Supports analysis and design reviews Develops and maintains electrical product detail, assembly and installation designs (e.g., equipment racks, power panels, cable routing and geometry, antennas) Provides engineering design disposition on discrepancies (e.g., rejection tags, production action requests, shop revision requests) Follows documented processes, specifications and procedures that support the design and manufacture of electrical commodities Supports the development of statements of work. Assists in the technical review of supplier capabilities to facilitate source selection Analyzes functional and physical input used in the development of integrated design and system architecture. Works under general supervision.</spa

Wire Harness Design Engineer (Associate, Experienced or Lead) Company: The Boeing Company Boeing Defense, Space, & Security (BDS) is looking for a Wire Harness Design Engineer (Associate, Experienced or Lead) to join our team in Oklahoma City, OK . This position will provide engineering support across the Boeing portfolio of products, to include – but not limited to – Boeing Military Aircraft and Military Derivative Aircraft (AEW&C, AWACS, C-32/C-40, E-4B, VC-25A, KC-767, B-1B, B-2, B-52 and others). Our teams are currently hiring for a broad range of experience levels including Associate, Experienced, or Lead level Engineers. Associate (Level 2) Develops and maintains cable/wire harness detail and assembly design Supports analysis and design reviews Develops and maintains electrical product detail, assembly and installation designs (e.g., equipment racks, power panels, cable routing and geometry, antennas) Provides engineering design disposition on discrepancies (e.g., rejection tags, production action requests, shop revision requests) Follows documented processes, specifications and procedures that support the design and manufacture of electrical commodities Supports the development of statements of work. Assists in the technical review of supplier capabilities to facilitate source selection Analyzes functional and physical input used in the development of integrated design and system architecture. Works under general supervision. Experienced (Level 3) <

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m