Assembly And Test Central Quality Assurance Manager Jobs

About the Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a PCB Layout Engineer to design high-density electronics for next-generation robotic systems. You will own PCB layout from floor planning through fabrication release, working closely with electrical, SI/PI, mechanical, and manufacturing teams. This role is based in San Francisco and requires in-person presence four days per week. In this role, you will: Own PCB layout, component placement, routing, and fabrication release for complex robotic systems. Collaborate with SI/PI engineers to refine layouts based on simulation results. Implement high-speed routing, controlled impedance, power distribution, decoupling, grounding, EMI/EMC, thermal, and mechanical-integration requirements. Work directly with fabricators and assembly partners to define stack-ups, establish design rules, drive DFM/DFA/DFT reviews, and close findings before release. Prepare fabrication and assembly documentation, including drawings, ODB++, drill files, stack-up tables, and manufacturing notes. Inspect newly received PCBAs and participate in board-level manufacturing failure analysis. Contribute to reusable design constraints and layout workflows, and maintain component-library assets such as symbols, footprints, and 3D models. You might thrive in this role if you: Have 6+ years of experience designing complex, multilayer PCBs. Are fluent in Cadence Allegro PCB Designer and Constraint Manager. Have strong HDI design experience, including fine-pitch BGAs, microvias, blind and buried vias, via-in-pad, and sequential lamination.

What We’re Looking For: We’re looking for engineers to contribute to the thermomechanical, electrical and mechanical design and assembly of the IO modules that attach to our A-0 and A-1 wafers. Ideal Background: Deep understanding and hands-on experience with signal integrity signoff for copper and electro-optic connector interfaces Hands-on experience with mechanical aspects of electrical and electro-optic connectors Experience with bringup of connectorized links and systems Nice to Have: Experience and understanding of sockets and socketed connectors Experience with co-packaged copper and co-packaged optics Experience with high density optical modules Experience with XPO optical pluggable form factors

About the Role You will contribute to and own aspects of the Volantis A-0 and A-1 package. We are interested in both people with package design as well as package process development backgrounds Our end goal has challenges to overcome in warpage, CTE mismatch, thermomechanical aspects, assembly speed and more. We're building a wafer-scale package with both silicon and compound semiconductor dies sitting together at very high TDP. This creates both unique challenges and opportunities. The end result is breaking the memory wall, enabling a new era of AI, and a platform that scales another 1-3 orders of magnitude. What We Look For Ability to think from first principles about novel problems- not just applying existing solutions outside of their range of application. What works for 5x reticle platforms may not work for 56x reticle platforms Design or process development of complex packages Nice to Have: Experience with heterogeneous material assemblies Experience with high-TDP packages Experience with compound semiconductor assemblies Experience with co-packaged optics Ability to work with architects to co-design system architecture and package design Experience with interposer platforms such as CoWoS, CoWoS-L, CoWoS-R, EMIB, FoCoS, FoCoS-Bridge, etc Experience with flip-chip integration, especially mass reflow, TCB & LAB Experience with large scale (>50x50mm) substrates Compensation Package: Competitive Base salary + Significant Equity Stake. You'll be well compensated while also owning a piece of the outcome. California Pay Range: $250K-$400K

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will work and support the efforts of groups such as Design Engineering, Product Engineering, Process Integration, Probe, and Assembly to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer happiness. How To Qualify: B.S.EE degree with + 4 years of experience M.S.EE degree with 2+ years of experience. Coursework in CMOS Circuit Design and VLSI Coursework that included crafting the physical layout of circuits Knowledge and experience using Cadence Virtuoso Excellent problem-solving and analytical skills A self-motivated, hard-working team player who enjoys working with others. Good communication and documentation skills Drive innovation into the future Memory generation with a dynamic work environment. What Sets You Apart: Knowledge of layout synthesis and place and route techniques Experience with LVS and DRC tools such as Calibre Utilize AI-Enabled tools to assist in layout floor planning, place and route Standard cell construction and analog layout techniques Having an innovative approach that is open to improving upon any of our processes or products. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professiona

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will work and support the efforts of groups such as Design Engineering, Product Engineering, Process Integration, Probe, and Assembly to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer happiness. How To Qualify: B.S.EE degree with + 2 years of experience M.S.EE degree with 1+ years of experience. Coursework in CMOS Circuit Design and VLSI Coursework that included crafting the physical layout of circuits Knowledge and experience using Cadence Virtuoso Excellent problem-solving and analytical skills A self-motivated, hard-working team player who enjoys working with others. Good communication and documentation skills Drive innovation into the future Memory generation with a dynamic work environment. What Sets You Apart: Knowledge of layout synthesis and place and route techniques Experience with LVS and DRC tools such as Calibre Utilize AI-Enabled tools to assist in layout floor planning, place and route Standard cell construction and analog layout techniques Having an innovative approach that is open to improving upon any of our processes or products. As a world leader in the semiconductor industry, Micron is dedicated to your persona

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About Our Team: The Frontend Manufacturing Applications team develops and supports critical software platforms that enable Micron's wafer fabrication and assembly operations. Our team partners closely with manufacturing, product, and engineering organizations to deliver reliable, scalable solutions while advancing the adoption of AI-assisted engineering practices that improve developer productivity and software quality. Position Overview: As a Principal Software Engineer, you will serve as a technical authority responsible for defining architecture, engineering standards, and technical strategy for frontend manufacturing applications. You will lead the organization's AI-assisted engineering initiatives while delivering business-critical software solutions that improve manufacturing efficiency, reliability, and operational performance. Responsibilities: Lead architecture, design, and technical strategy for frontend manufacturing applications and platform modernization initiatives. Design, develop, and support production applications using technologies including .NET, C#, C++, Angular, Python, and related platforms. Establish and govern engineering standards, code review practices, and quality controls, including standards for AI-assisted software development. Evaluate, implement, and operationalize AI development tools, agentic workflows, and engineering productivity solutions across multiple tea

Why RoboForce RoboForce is an AI robotics company developing Physical AI–powered Robo-Labor for dull, dirty, and dangerous work. The company's robots are engineered for demanding industrial environments, with a focus on real-world deployment and scalability. We are seeking a highly motivated Manufacturing Engineer to define and optimize manufacturing processes, develop production equipment, and provide manufacturing input during product definition for our advanced robotic systems. You will work closely with design, supply chain, and operations teams to establish reliable processes and equipment that meet quality, cost, and delivery requirements. Responsibilities Bridge the gap between initial concept and full production by providing design teams with critical insights on manufacturability, assembly, testing, and tooling. Apply design for manufacturing and assembly (DFM/DFA) principles and resolve manufacturability issues before production release. Define assembly sequences, work instructions, and tooling requirements; establish critical process and quality parameters; and validate processes before production release. Lead manufacturing readiness for new product launches, upgrades, and component changes by coordinating cost targets, resources, and schedules. Provide hands-on technical support and collaborate with external integrators and suppliers during tooling and equipment specification, validation, commissioning, and production ramp-up. Incorporate requirements for safety, product quality, resource utilization, and preventive maintenance into process and equipment design. Collaborate with cross-functional teams to synchronize priorities. Investigate manufacturing defects and process failures, implement corrective actions, and track improvements in yield, cycle time, and cost. Assess the manufacturing impact of engineering changes, update process documentation and tooling, and track risk mitigation actions through implementation. Requirements Bachelor’s degr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will work and support the efforts of groups such as Design Engineering, Product Engineering, Process Integration, Probe, and Assembly to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer happiness. How To Qualify: B.S.EE degree with + 2 years of experience M.S.EE degree with 1+ years of experience. Coursework in CMOS Circuit Design and VLSI Coursework that included crafting the physical layout of circuits Knowledge and experience using Cadence Virtuoso Excellent problem-solving and analytical skills A self-motivated, hard-working team player who enjoys working with others. Good communication and documentation skills Drive innovation into the future Memory generation with a dynamic work environment. What Sets You Apart: Knowledge of layout synthesis and place and route techniques Experience with LVS and DRC tools such as Calibre Utilize AI-Enabled tools to assist in layout floor planning, place and route Standard cell construction and analog layout techniques Having an innovative approach that is open to improving upon any of our processes or products. As a world leader in the semiconductor industry, Micron is dedicated to your persona

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but not limited to: Develop strategies and execute to improve Equipment maturity for First of a Kind (FOAK) hardware. Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. Optimizing equipment to reduce cost, availability, and improve hardware and process capability. Collaborating with process development teams to develop innovative new solutions. Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions. Performing fundamental research to drive innovative solutions for next-generation equipment products. Support equipment transfer to production facilities (some domestic or international travel may be required). Applying Artificial Intelligence.AI Minimum Qualifications: Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Strong analytical and creative problem-solving skills. Ability to use extensive technical knowledge to guide strategic directions. Ability to resolve complex issues through root-cause or model-based problem solving. Proficiency in statistics, preferably in statistical process contro

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but not limited to: Develop strategies and execute to improve Equipment maturity for First of a Kind (FOAK) hardware. Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. Optimizing equipment to reduce cost, availability, and improve hardware and process capability. Collaborating with process development teams to develop innovative new solutions. Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions. Performing fundamental research to drive innovative solutions for next-generation equipment products. Support equipment transfer to production facilities (some domestic or international travel may be required). Applying Artificial Intelligence.AI Minimum Qualifications: Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Strong analytical and creative problem-solving skills. Ability to use extensive technical knowledge to guide strategic directions. Ability to resolve complex issues through root-cause or model-based problem solving. Proficiency in statistics, preferably in statistical process contro

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but not limited to: Develop strategies and execute to improve Equipment maturity for First of a Kind (FOAK) hardware. Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. Optimizing equipment to reduce cost, availability, and improve hardware and process capability. Collaborating with process development teams to develop innovative new solutions. Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions. Performing fundamental research to drive innovative solutions for next-generation equipment products. Support equipment transfer to production facilities (some domestic or international travel may be required). Applying Artificial Intelligence.AI Minimum Qualifications: Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Strong analytical and creative problem-solving skills. Ability to use extensive technical knowledge to guide strategic directions. Ability to resolve complex issues through root-cause or model-based problem solving. Proficiency in statistics, preferably in statistical process contro

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Bendemeer, Singapore Department Assembly, Process and Equipment Engineering Project Title Assembly Output and Yield Optimization for Cost Improvement Project Description The Assembly Process and Equipment Engineering Intern will undertake an engineering project focused on improving assembly output, process yield, product quality, and manufacturing cost. Under the guidance of experienced engineers, the intern will study semiconductor assembly processes and apply engineering methodologies to identify process variations, analyze potential failure modes, and evaluate improvement opportunities. The project will include experimental planning, engineering data collection, statistical analysis, and effectiveness monitoring. The intern will also explore how data analytics, Generative AI, and Agentic AI can improve engineering analysis, technical documentation, and problem-solving workflows. Objective of the Project Identify assembly process factors that influence output, yield, product quality, reliability, and manufacturing cost. Apply structured engineering methods to investigate selected process or equipment-related opportunities.<

Where Performance Meets Purpose Join a team that values excellence and innovation, at a company known for its iconic golf brands. At Acushnet Company, your background and experience contribute to creating the best products for dedicated golfers worldwide. Here, your performance has purpose. Responsibilities: -Responsible for process set up and troubleshooting injection molding, blending and grinding processes. Preventive Maintenance for molds, machines, and related automation. -Troubleshoot, repair and maintenance of injection mold machines, molds, and associate equipment including automation, and support equipment including blenders, grinders, conveying equipment, hoists, and hoppers. -Maintain inventory for machine molds, and related equipment. Set up and process of machines and related equipment. -Required to maintain work records (work orders, PM's, Materials and parts) on computerizedMaintenance system. Experience/Requirements: -3-5 years of experience troubleshooting, repairing and maintaining injection molding equipment. -Required to have own trade related tools to perform required tasks. Skills: -Should work well with others and have communication and interpersonal skills. -Must have analytical and problem-solving skills to use with production to identify and correct injection cup, and assembly defects. -Must have a thorough knowledge of mechanical related production equipment. -Must possess a demonstrated ability to make process adjustments to bring parts into specification. -Must have knowledge of electronic equipment controls. -Demonstrated ability to install, repair and maintain injection molding and support equipment. -Demonstra

Who we are Lab37 Robotics , is a technology company focused on the development and deployment of robots designed specifically for direct-to-customer food production. Our mission is to revolutionize the food industry by creating innovative robotic solutions that enhance efficiency, quality, and customer satisfaction. We are passionate about pushing the boundaries of technology to deliver cutting-edge products that meet the evolving needs of our clients. About the role Work with a team to understand the contents of the larger system. Take on the ownership of a hardware module, understand, develop and improve upon its requirements. Create CAD and all documentation required for its development, build, and testing. Be detail-oriented and demonstrate a sense of pride in your work. What you’ll do Design and develop mechanical systems for robotic applications, ensuring functionality, cost-effectiveness, and manufacturability. Create detailed 3D CAD models, engineering drawings, and assembly instructions. Collaborate with cross-functional teams, including electrical engineers, software developers, and product managers, to integrate mechanical designs with electronic and software components. Conduct hands-on prototype building and testing, analyzing performance data to iterate on designs. Utilize a variety of manufacturing processes and materials to optimize designs for performance and efficiency. Participate in design reviews, presenting design concepts and demonstrating prototypes to stakeholders. Manage documentation related to project plans, design specifications, and testing procedures What we are looking for Bachelor’s degree or equivalent in Mechanical Engineering or a related field is required. 3+ years of experience working as a Mechanical Design Engineer. Proficiency in SolidWorks CAD software, with a strong portfolio showcasing past projects and designs. Practical experience in building and testing mechanical systems; hands-on fabricatio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but not limited to: Develop strategies and execute to improve Equipment maturity for First of a Kind (FOAK) hardware. Develop hardware roadmaps for 5&#43; years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. Optimizing equipment to reduce cost, availability, and improve hardware and process capability. Collaborating with process development teams to develop innovative new solutions. Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions. Performing fundamental research to drive innovative solutions for next-generation equipment products. Support equipment transfer to production facilities (some domestic or international travel may be required). Applying Artificial Intelligence.AI Minimum Qualifications: Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Strong analytical and creative problem-solving skills. Ability to use extensive technical knowledge to guide strategic directions. Ability to resolve complex issues through root-cause or model-based problem solving. Proficiency in statistics, preferably in statistical process contro