Dram Design Technology Layout Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DFT (Design for Test) Product Development Engineer in the DRAM Technology group, you will be part of a forward-thinking team of engineers that solves complex problems to develop industry-leading DRAM. In this role, you will gain an in-depth understanding of semiconductor memory functionality and become an expert in the test manufacturing code and testing techniques used to develop, implement, validate, and ensure device performance. You will engage with new technology at the build start to cultivate DFT and Micron’s component test flow philosophy on modern architectures. This will be accomplished through innovation and by multi-functional engagement with partner groups – Build, Test, Technology Development, Manufacturing, Marketing, and Quality Assurance departments. Agentice AI. Responsibilities Partner with Test Manufacturing, Product Engineering, and Design Engineering to provide test guidance, set priorities, and drive improvements in product quality and yield. Develop new DFT concepts and test architectures to support future enhancements in test coverage, efficiency, and test time reduction. Debug and identify root causes of failures using data analysis, elec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s DRAM Technology Development group, where engineers operate at the leading edge of semiconductor process and product innovation. This role sits at the intersection of process technology, product requirements, and manufacturing execution, and is critical to enabling next generation DRAM technology. As a Principal Node Development Product Engineer, you will play a technical role in driving product readiness through close engagement with process integration, device, yield, test, design, and manufacturing teams. You will own deep process‑aware product knowledge, identify node‑specific risks, and translate silicon behavior into actionable decisions that ensure robust, scalable next generation DRAM products. Responsibilities Serve as a technical contributor during development stage of next gen DRAM! Drive process‑aware product optimization, identifying sensitivities, interactions, and integration risks Analyze silicon data (electrical, parametric, yield, reliability) to identify systematic process or integration limiters Partner with design, process integration, test, and device teams to debug yield and performance issues and converge on root cause Collaborate closely with manufacturing and TD to enable smooth node readiness, learning cycles, and factory ramp Translate process changes into product impact assessments, including PPA, yield, reliability, and test coverage Guide test content and monitoring strategies to ensure early detection of process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Compute and Memory Business Unit (CMBU), where we shape how memory powers the world’s most demanding computing platforms. Our team works at the intersection of advanced DRAM technology, system architecture, and emerging AI workloads. We collaborate closely with customers, partners, and internal R&D teams to influence the future of memory-centric system design—and we have a lot of fun doing it! As a Product Architecture Engineer for DRAM, you will play a key role in defining how Micron memory technologies enable AI training and inference platforms. This role blends deep technical exploration with industry engagement and internal collaboration. You will help translate system-level challenges into differentiated DRAM solutions while influencing both customer designs and Micron’s product roadmap. Responsibilities : Explore and evaluate system architectures using modeling, simulation, and prototyping tools Engage customers and partners to identify system bottlenecks and future memory innovations Pathfind AI-focused architectures using LPDDR and DDR DRAM technologies Define and explore DRAM features that increase value in AI and high-performance systems Mentor and coach junior architects and engineers Minimum Qualifications : Bachelor’s degree in Electrical Engineering or equivalent practical experience 10+ years of experience in product engineering or product archit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline visibility to enable fast yield ramp and minimize excursion. Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network. Travel to Micron sites as necessary for face to face collaboration. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people creat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Do you love the interaction of cutting-edge hardware and innovative software solutions? In today's data economy, Micron's memory and storage products are essential to advancing state of the art computing technology. Continued scaling of memory technology presents challenges that require complex and creative testing solutions. As a Product Test Engineer, you will be responsible for the development, debug and maintenance of test programs that help deliver Micron's world-class DRAM portfolio to market. A product test engineer can be focused on the health and quality of the memory cells [DRAM features 16 billion cells in less than 80mm^2 of area] or focused on high-speed interface, AI proficiency, AI supported workflow automation, and system level application testing. Responsibilities Develop, debug and support test programs from new product introduction phase up through high volume manufacturing Write test programs and support scripts in C++, Python Contribute input and feedback to help define next generation 'design for test' capabilities Analyze device and test flow data to make informed test coverage decisions Balance test time objectives while maintaining optimal yield and quality Collaborate with partners in Design and Product Engineering, Fab, Manufacturing, Yield Enhancement, Global Quality, Systems Integrati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develops, implements, and maintains methods, operation sequences, and processes in the manufacture or fabrication of parts, components, subassemblies, and final assemblies. Interfaces with design engineering to coordinate the release of new products. Estimates manufacturing costs, determines time standards, and makes recommendations for tooling and process requirements of new or existing product lines. Maintains records and reporting systems to support and coordinate manufacturing operations. Leverages Artificial Intelligence (AI), machine learning, and data analytics tools to optimize manufacturing processes, improve operational efficiency, enhance yield performance, enable predictive maintenance, automate data analysis, and support data-driven decision-making across manufacturing operations. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from th

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Sr Principal CAD & HPC Workflow Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Position Overview Micron is seeking a Senior Principal CAD Engineer to help shape the engineering environment that powers Memory product development across DRAM, HBM, NAND, and custom memory programs. In this high-impact technical role, you will partner with Micron’s CAD Software and HPC teams to architect, modernize, and scale the platforms our worldwide design teams rely on every day, from CAD software infrastructure, project setup flows, and quality-gating solutions to engineering automation and compute workload scalability. You will also define how success is measured. By developing improvement and quality metrics for job management and workflow performance, you will establish customer-facing service levels that give design teams clear visibility into the performance of their environment and give engineering leaders a data-driven path to continuous improvement. Along the way, you will help bring next-generation AI and agentic software solutions into Design Automation, working closely with CAD, Design Engineering, HPC, and EDA vendors. Key Responsibilities Serve as a senior engineer partnering with the CAD Software and HPC team

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Owner at Micron Technology, Inc., you will report to the Smart Manufacturing and Artificial Intelligence organization. The team defines, drives, and delivers end-to-end smart manufacturing solutions, integrated across functions of the business. The team applies industry-leading methodologies in automation, artificial intelligence (AI) , and generative AI (GenAI) to enhance Micron’s product development, business, and administrative processes across the company. Responsibilities and Tasks Support DRAM technology development, which includes deployment of existing smart-manufacturing solutions to TD as well as the development of new customized tools/solutions for TD. Work with users to capture and analyze information related to the adoption of apps for Smart Manufacturing. Identify gaps, weaknesses, and inefficiencies in current solutions, including opportunities for AI-driven enhancements. Define business solutions and propose projects for implementation, leveraging AI and GenAI technologies where applicable. Lead projects and activities requiring coordination, support, and management of resources from global teams. Collaborate with Data Engineers and Data Scientist to design, execute, and deliver smart manufacturing solutions. Use metrics and performance data to identify opportunities for improvement, including predictive analytics and intelligent decision support. Provide domain and system expertise; collaborate with data sci

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Additional Responsibilities Align TDT CMOS Device development and transfer objectives with Technology Development sites. Drive and ensure close collaboration with Design, TCAD, Modeling, and Product Engineering groups across Micron sites. Collaborate with process integration module owners and process owners to drive electrical characterization of CMOS devices and CMOS circuits and identify device improvement opportunities. Utilize technology development and transfer knowledge to develop new technology nodes to mature manufacturing capability while achieving key program metrics. Ensure CMOS devices meet electrical, performance, power, variability, and reliability targets required for product success. Drive close collaboration with device and process integration development groups at other Technology Development sites. Collaborate closely with manufacturing fabs to facilitate successful technology transfer and production ramp. Contribute to the fundamental understanding of CMOS technology and its impact on overall product figures of merit. Lead cross-functional exploration and development of future CMOS device architectures, including non-planar transistor technologies, by partnering with Device, TCAD, Process Integration, Design, and Manufacturing teams to enable future DRAM technology roadmaps. Drive adoption of AI, machine learning, advanced analytics, and engineering automation solutions to accelerate technology development, r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is expanding its semiconductor manufacturing operations in Boise through a historic $15 billion investment that will support next-generation DRAM production and advanced manufacturing capabilities. This growth creates exciting opportunities for students to contribute to the future of semiconductor technology while working in a highly collaborative, data-driven manufacturing environment. The High Volume Manufacturing Process Engineer Intern supports process optimization, yield improvement, throughput enhancement, cost reduction, and issue resolution within a manufacturing area. This role partners closely with equipment engineering, operations teams, process owners, and cross-functional stakeholders to improve process performance and achieve key manufacturing objectives. Responsibilities Drive process optimization and manufacturing efficiency initiatives by monitoring process performance, analyzing data, and supporting area throughput and wafer output goals. Identify, troubleshoot, and resolve process issues that could result in yield loss, defects, equipment restrictions, excursions, or production impacts, escalating concerns when necessary. Apply SPC, FDC, Design of Experiments (DOE), and structured problem-solving methodologies, including 8D, to improve process capability and equipment performance. Partner with process owners, operations teams, and engineering stakeholders to address chronic process issues and support continuous improvement initiatives. Leverage Artificial Intelligence and data a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Analyze data using engineering knowledge and visualization tools to make critical process decisions. Perform project work to optimize wafer processing and increase wafer outs. Update or create procedures to align with area and global practices. Minimum Qualifications Current student in an engineering or related degree program; graduation date not before September 2027. Understanding of SPC and Design of Experiments. Prof

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we accelerate the transformation of information into intelligence, enabling advances in learning, communication, and technology. Micron's Boise site is at the center of a historic semiconductor manufacturing expansion, supported by a $15 billion investment. This growth creates exciting opportunities for students to contribute to leading-edge DRAM manufacturing while developing technical expertise in one of the world's most advanced fabrication environments. The ID1 High Volume Manufacturing Process Engineer supports process quality, yield improvement, manufacturing efficiency, and cost reduction within a high-volume semiconductor fabrication environment. This role partners closely with equipment engineers, manufacturing teams, process owners, and operations leaders to find opportunities, resolve process issues, and optimize wafer output. The successful candidate will apply statistical analysis, engineering principles, and data-driven decision making to improve manufacturing performance, support operational excellence, and contribute to key area performance indicators. Responsibilities Monitor, analyze, and improve manufacturing processes to achieve yield, quality, throughput, and cost objectives. Apply SPC, FDC, Design of Experiments, and systematic problem-solving methodologies to identify and resolve process deviations and chronic is

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments. Drive improvements in yield, cost efficiency, and quality. Run Design of Experiments (DOE) to enhance process capability and margin. Monitor trends and sustain line stability. Address top detractors to improve device yield and reliability. Lead workshops during technology transfer for next-generation devices. Start up, develop, and optimize processes for product quality and reliability. Identify and resolve process-related issues using FMEA, 8D, SPC/FDC methodologies. Coordinate and execute process, equipment, and material evaluations. Validate and qualify new processes, tools, and materials for new product introduction. Manage and audit material suppliers to meet quality, cost, and risk objectives. Support internal and external audits. Be willing to travel internationally for 3&#43; months for tech transfer/training. Be prepared to work a shifted schedule as required. Required Qualifications Bachelor’s degree in Materials Science, Electrical, Electronics, Chemical, or related engineering fields. Basic understanding of MOSFET and DRAM operation. Knowledge of CMOS and characterization methods. Familiarity with DOE, SPC, and JMP. Ability to support SPC/FDC/RMS/APC systems and site-to-site portability. Preferred Qualifications Internship experience in a 300mm semicondu