Dram Design Technology Layout Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary As an MTS Design Verification Engineer, you will serve as a technical leader driving innovation in DRAM verification for advanced memory products. This role focuses on leading design and verification strategy, influencing key technical decisions, and ensuring high-quality, functionally correct, and scalable memory solutions. You will collaborate with global teams, guide methodology improvements, mentor engineers, and act as a domain expert to support next-generation DRAM technologies. Responsibilities Lead DRAM verification innovation, driving key technical decisions, architecture, and strategy during product execution Collaborate with global teams to define and implement best-known methods for verification and product development Drive verification planning, coverage closure, and silicon debugging for advanced DRAM products Evaluate and implement new tools, methodologies, and flows to improve verification efficiency and quality Mentor engineers and provide technical leadership while contributing expert guidance to senior leadership teams Minimum Qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field 8+ years of experience in DRAM/memory or advanced CMOS verification Strong circuit analysis and debug skills at the transistor level — able to root-cause behavior, not only at the testbench level Experience with simulation tools such as HSPICE, Finesim, Verilog, or SystemVe

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 次世代DRAM技術開発におけるプロセスインテグレーション業務をご担当いただきます。 【主な業務内容】 次世代DRAMノード向けプロセス技術の開発および統合 キャパシタモジュールの設計、開発、最適化 複数のプロセスモジュールを統合し、性能および整合性を確保 プロセス条件最適化のためのDOE&#xff08;実験計画法&#xff09;の設計・実施およびデータ解析 歩留まりおよび品質に関する課題の特定と改善 Process、Design、Device、Qualityチームとの部門横断的な連携 応募資格 必須要件&#xff08;技術スキル&#xff09; 半導体プロセスに関する基礎知識 プロセスインテグレーションまたは関連するエンジニアリング分野の知識 半導体業界における5年以上の実務経験 歓迎要件 DRAMデバイスおよび構造に関する知識 語学・コミュニケーションスキル 海外チームとの会議に対応できる英語でのコミュニケーション能力 日常業務を遂行できる日本語力 関係部門との連携・調整を円滑に進めるための高い対人コミュニケーション能力 求める人物像 高い分析力と問題解決能力をお持ちの方 チーム環境において主体的に業務を推進できる方 技術的課題に対して粘り強く取り組み、オーナーシップを持って対応できる方 ------------------------------------------------------------------- ■ Job Responsibilities In this role, you will be responsible for process integration activities for next-generation DRAM technology development. Your key responsibilities will include: Development and integration of process technologies for Future DRAM nodes Design, development, and optimization of capacitor modules Integration across multiple process modules to ensure consistency and performance <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary This position supports Micron’s DRAM Tester Solutions group, focusing on physical design implementation for processors, controller architectures, and ASICs. The role is responsible for full‑chip and block‑level physical design closure, low‑power implementation, timing, power, and signal integrity signoff, and successful tape‑out across advanced technology nodes. Responsibilities: Lead block‑level and full‑chip physical design including floorplanning, placement, CTS, routing, and tape‑out. Drive timing closure across multiple modes and corners using industry‑standard STA tools. Perform power integrity, IR/EM, and power grid closure to meet signoff requirements. Develop and optimize APR flows, scripts, and methodologies for PPA improvements. Own subsystem or full-chip closure work while coordinating with cross-functional teams. Minimum Qualifications: Bachelor’s degree or Master’s degree or equivalent experience in Electrical Engineering, Electronics, or Computer Architecture. Minimum of 15 years of hands‑on ASIC physical design implementation experience. Proven experience with multiple production tape‑outs in advanced process nodes. Strong expertise in low‑power design techniques including UPF/CPF and multi‑voltage systems. Proficiency in scripting languages such as Tcl, Perl, or Python for flow automation. Preferred Qualifications: Experience with Synopsys and Cadence physical design and ti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . As a team member of technology development reliability group, you will be working with DRAM device/process development team and circuit design team. You will be responsible for analyzing reliability performance of hot carrier, bias temperature instability, electromigration etc. for each cell transistor, high performance CMOS and advanced interconnect. Also, you will be responsible for reliability model building and the consultation from device development team and circuit design team. The reliability is one of the important pillar for device scaling and state of the art technology development. Its work is based on understanding the semiconductor device physics, DRAM architecture knowledge, DRAM process integration knowledge. For the new reliability findings during the technology development phase, to point in the right direction is required. Responsibilities and Tasks: Develop and implement test methodologies to evaluate wafer-level & circuit-level reliability behavior and performance. Analyze results and create reports to deliver decision-ready, actionable recommendations for guiding technology development. Collaborate with Process Integration and characterization teams to correlate reliability signature with process conversions and parametric test data. Integrate other data sources (inline metro, param,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Senior Verification Engineer with 4-8 years of Experience Unique Opportunities Complete ownership of verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR5, LPDDR5,DDR6 and LPDDR6 that can operate at high speeds of up to 9600MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for sophisticated products. Co-work with international colleagues on

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's ASIC Logic Design team develops next-generation ASICs and controller IP that enable industry-leading memory solutions. Working across advanced process technologies, the team collaborates with architecture, analog, verification, physical design, and validation engineers to deliver high-performance, production-ready silicon for future DRAM products. As an ASIC Digital Design Engineer, you will contribute to the design and development of RTL for next-generation DRAM memory controllers and subsystems. You will work in a collaborative engineering environment supporting design implementation, simulation, validation, and chip bring-up activities while leveraging AI-enabled tools to improve productivity and design quality. Responsibilities Design and develop RTL for DRAM memory controllers and subsystem components using SystemVerilog. Collaborate with analog, verification, physical design, validation, and other cross-functional teams to support successful product development. Develop and validate HDL models, support simulation and co-simulation activities, and analyze design functionality and performance. Support chip bring-up, debugging, and validation activities to identify and resolve design issues. Use scripting, automation, and AI-enabled tools to improve design workflows, productivity, and engineering efficiency. Minimum Qualifications 0-2 years of relevant experience through intern

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Handle new process baseline qualifications and managing. Identify, diagnose and resolve assembly process related problems. Coordinate and execute process, equipment and material evaluation and optimization initiatives and implement changes at process step. Lead and participate in continuous yield improvement and cost reduction activities. Validate and fan out new process baseline qualified, including new processes, tools and materials for new product introduction. Support site to site portability. Manage and audit material suppliers to achieve quality, cost and risk management objectives. Support internal and external audits. Develop new or modified process formulations, define processing or handle equipment requirements and specifications, and review processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Coordinate design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compile and evaluate test data to determine appropriate limits and variables for process or material specifications. Plan projects involving definition and selection of new concepts, equipment automati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve process related problems • Coordinate and execute process and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new technode • Support TD projects in different sites • Experience leveraging AI-assisted tools to improve engineering productivity and data analysis. • Familiarity with claude, Copilot, or other AI-enabled workflow tools. • Utilize AI-enabled tools to accelerate problem solving, yield learning, and process optimization. • Fulfill project requirements and meet project timelines • Be pro-active: anticipate and analyze problems • Generate alternative solutions, select the best solution, develop and implement an action plan, verify results and modify plan as needed • Perform detailed process characterization and understand process spec limits thru margin study • Design, develop, and implement technical products, systems, or processes to improve product quality • Set yield / module level roadmap • Make disclosures of patentable inventions • Interpret results of processes, know when to apply DOE and summarize experiment and document results • Train and mentor others, create mentor relationships to provide motivation, coaching, and skills training. • Accept and adapt to change when nece

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Integration Engineer working in the fast-paced DRAM R&D Memory Group, you will be instrumental in developing Micron’s core memory technology serving AI-enabled customers. The R&D development takes place in an industry leading 300mm facility which is adjacent to our newly announced Manufacturing facility (currently under construction). Your focus will be on the development and integration of critical technology which enables future DRAM memory scaling for Micron. You will develop the structural and electrical requirements for one or more modules and work in conjunction with Process Development and supporting teams to seamlessly integrate new module solutions into the entire process flow. Responsibilities include, but not limited to: Engineer and develop novel process flows for critical modules. This includes creating structural and electrical specifications as well as design rules for new process flows. Utilization of creative problem-solving skills to develop and optimize new process flows which improve performance and reduce the cost of future memory chips. Design experiments and analyze results using statistical analysis software. Results are applied to directly enhance yield. (DOE) Work cross-functionally with multiple groups including Design, Product Engineering, Process Development, Modeling, Yield Enhancement, Electrical and Physical Failure Analysis, Parametric, and Quality te

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, &#34;high bandwidth&#34;; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most ambitious due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s DRAM R&D Memory Group and help shape the future of memory technology. Our team develops the innovations that enable next-generation DRAM scaling in an industry-leading 300mm research facility located alongside our expanding manufacturing campus. We work at the intersection of device physics, process technology, and product innovation to solve some of the semiconductor industry’s most complex challenges. As a Process Integration Engineer, you will play a key role in developing and integrating critical technologies that enable future DRAM generations. You will define structural and electrical requirements, collaborate with cross-functional engineering teams, and drive solutions from concept through manufacturing transfer. This is an opportunity to influence core memory technology while working in a highly collaborative and technically rigorous environment. Responsibilities: Develop and integrate novel process flows for critical DRAM modules, including structural, electrical, and design rule requirements Design and execute experiments (DOE), analyze data using statistical methods, and apply findings to improve device performance and yield Partner with Design, Product Engineering, Process Development, Modeling, Yield Enhancement, Failure Analysis, Parametric, and Quality teams to resolve technical challenges Summarize complex issues, drive alignment across stakeholders, and implement effective solutions Collaborate with Manufacturing to successfully transfer new

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology - Advanced Modeling and AI Solutions (AMAIS) Group in Hyderabad, you will work in a multi-functional team of engineers highly skilled in the modeling of process, equipment, structures, and materials. This team’s primary responsibility is to support and enable solutions to Micron’s most significant challenges in Memory development and manufacturing. Your role will be to work on a project that directly supports one of our group’s critical programs. This project will involve materials or structure or process modeling. You are expected to work in a dynamic and fast-paced team environment developing models and reporting results to the AMAIS team and collaborating with them on next steps. This position seeks individuals that can code, implement, and utilize numerical models. You will interact with process engineers and development teams to identify questions and issues hindering the node development milestones. Additionally, you will create software programs, algorithms, and computational modeling tools to extract concrete insights from modeling and data. You will interpret and convey these insights and findings from models and experiments to engineering teams and leaders. You will be responsible for predictive structure modeling across multiple DRAM and NAND nodes. The modeling engineer will collaborate extensively with product design and process teams for structure model development, deployment, and providing solutions to be implemented on Silicon. Qualifica

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Engineering Execution Manager within Compute DRAM Product Engineering , you will lead engineering program execution for assigned DRAM products from pre-silicon readiness through qualification, production ramp, and transition to sustaining teams. This is an individual contributor leadership role, you will lead product execution across functional engineering teams through influence, technical judgment, and accountability. You will also collaborate across engineering and business organizations to build integrated plans, solve complex execution challenges, and deliver products that meet quality, yield, schedule, supply, and business requirements. Your work will have a direct impact on bringing innovative memory products to market! This technical leadership opportunity will allow you to develop broad product knowledge, strengthen your leadership skills across different functional groups, and learn across the semiconductor product lifecycle. Responsibilities Lead product execution from pre-silicon readiness through qualification and production ramp, building integrated schedules, dependencies, actions and decision points. Collaborate across Product Development, Design, Technology Development, Test, Package, Module, Quality, Manufacturing, Planning, and business teams to align technical and product achievements. Drive problem-solving for product risks and failures by facilitating issue triage, root-cause alignmen

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end to end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on the vertical integration and the various engineering working in unison. As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through various phases of a product i.e. concept, design, NPI and HVM by facilitating cross-functional life-cycle management. You will help build and maintain detailed development schedule and drive relevant tactical execution. In this position, you will provide leadership and direction for the Product Development Team (PDT

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi