Dram Ip Development Layout Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Static Timing Analysis (STA) Engineer — you will be part of the Heterogeneous Integration Group (HIG), owning chip-level timing sign-off for next-generation die. You will work closely with RTL design, physical design, architecture, DFT, verification, and product teams to ensure timing integrity and drive timing closure across all modes and corners from initial design through tape-out. This is a hands-on senior technical role focused on chip-level STA ownership, constraint authoring, timing closure, methodology development, and pre-/post-silicon timing correlation. Key Responsibilities Responsibilities will include, but are not limited to: Own end-to-end chip-level static timing analysis and sign-off across all checks, modes, corners, and voltage and temperature conditions. Develop, maintain, and validate sign-off quality Synopsys Design Constraints (SDC) for clocks, resets, high-bandwidth memory (HBM) interfaces, design for test (DFT), and configuration logic.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Analog Verification Engineer at Micron Technology, Inc., you will help shape advanced analog verification methodologies for next-generation DRAM products. In this role, you will develop scalable verification solutions, improve coverage and efficiency, and contribute to high-quality silicon through innovation, automation , and close collaboration with design teams. Experience with reliability verification methodologies is a strong plus, but not a requirement; candidates with solid analog verification expertise and a willingness to grow in reliability-focused verification are encouraged to apply. Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams across worldwide geographies! Enabling the creative career path, you deserve with a collaborative environment and groundbreaking technology and growing upon your imagination and creativity. Responsibilities Define and drive DRAM analog verifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology Development — Advanced Modeling & AI Solutions (AMAIS) organization, you will be part of a multidisciplinary team developing next-generation Digital Twins, predictive modeling solutions, and AI-driven technologies that accelerate advanced memory development and manufacturing excellence. You will create predictive digital representations of semiconductor processes, materials, structures, equipment, and products across DRAM, NAND, and advanced packaging technologies including HBM. Leveraging physics-based modeling, computational methods, machine learning, GenAI, large language models (LLMs), and agentic AI frameworks, you will enable technology co-optimization, design-space exploration, process optimization, yield improvement, and accelerated technology learning. Working at the intersection of engineering fundamentals, manufacturing data, and digital engineering, you will develop scalable predictive and prescriptive solutions that connect process, structure, performance, yield, reliability, and cost. This role offers the opportunity to influence critical technology decisions, drive fab-technology co-optimization , and advance Micron's leadership in data-driven semiconductor memory innovation. Qualifications: Independence – be comfortable executing activities and needs Experience in algorithm development, numerical methods, and scientific computing Solid experience with Plasma, FPM, HAR etching, and MC modeling Experience with Wet Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has transformed innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are redefining how the world uses information to enrich life. We are looking for Layout Build engineer at our Micron Technology’s DRAM Team in Guadalajara, Mexico. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Responsibilities: Build and development of analog, mixed-signal, custom digital block and full chip level integration support. Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Responsible for timely delivery of block-level layouts with acceptable quality. Will bee leading planning, area/time estimation, scheduling, delegation and execution to meet project schedule/achievements in multiple project environment. Optimally copresentingith Global engineering teams to assure the success of layout project. Minimum Qualification: Around 5 years of experience in analog/custom layout design in sophisticated CMOS process, in various technology nodes (Planar, FinFET). <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3&#43; months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, expectations, and deliverables aligned with ramp milestones and fab n

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Department Overview: DRAM Engineering (DRAM Memory) focuses on designing and developing Micron’s industry leading dynamic random access memory products. The team drives process R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. We work across architecture, engineering, and business teams to evaluate innovative memory solutions and influence product direction. If you’re excited about solving complex challenges in DDR and emerging memory technologies, you’ll find strong impact and collaboration here! We are seeking an experienced Distinguished Member of Technical Staff (DMTS) Design Engineer to join the DRAM System team. This role is at the center of memory innovation. You will analyze current and next-generation memory technologies, identify performance and design gaps, and guide teams on future memory direction. Your work will directly influence architecture, product strategy, and competitive positioning, making it both highly visible and technically rewarding. This position is intended to be part of the Technical Leadership Program at Micron. This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Location: Boise, ID or San Jose, CA Responsibilities:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using Through Silicon Via (TSV) technology, we stack multiple DRAM chips with a high-speed interface die, significantly increasing memory density and bandwidth for next-generation AI/ML accelerators and high-performance computing platforms. Our designs target the industry's lowest power-per-bit and highest bandwidth, enabling the most demanding compute workloads. We are seeking a SI/PI Engineer in HBM Build Architecture to develop high-quality SI/PI analysis for interposers, packages, and silicon channels. This work contributes directly to HBM build sign-off and product success. You will be involved in complex, multi-disciplinary SI/PI initiatives spanning multiple HBM product generations — from early interposer channel analysis and equalization co-design, PDN architecture, and system PI analysis. You will ensure Micron's HBM SI/PI architecture remains the industry benchmark for signal quality, power delivery integrity, and interface reliability. This role supports the design and deployment of AI-enabled solutions that improv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We define ESD and latch-up architecture for next-generation HBM products across advanced nodes and 3D integration. Our team works across device, circuit, and packaging domains to solve reliability challenges that directly impact product quality. We take on complex problems and turn them into scalable solutions that enable high-performance memory! As an SMTS/DMTS HBM ESD/Latch-Up Architect, you will define protection strategies across base die, DRAM stacks, and interconnects. This role shapes product reliability from early architecture through silicon validation. You will work across teams and influence technical direction while solving system-level ESD challenges. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Define end-to-end ESD and latch-up architecture across base die, DRAM die, and interconnects Develop protection strategies for high-speed I/O, TSV interfaces, and advanced packaging Establish ESD/LUP standards, rule decks, and signoff criteria Drive correlation between d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information into intelligence through industry-leading memory and storage solutions. The Process Development Engineering team drives innovation for future DRAM and HBM technologies by developing and optimizing semiconductor manufacturing processes that enable next-generation memory products. Our engineers work at the intersection of advanced research and high-volume manufacturing to solve complex technical challenges and accelerate technology advancement. As a Process Development Engineering Intern, you will gain hands-on experience in semiconductor process development while working on a dedicated technical project within a fast-paced research and development environment. Under the mentorship of experienced engineers, you will collaborate across process and equipment teams to develop innovative solutions that meet demanding product requirements. The internship concludes with a formal presentation of your project results to technical and leadership audiences. Responsibilities Develop and optimize semiconductor processes that meet physical and electrical performance requirements for current and future memory products. Partner with multi-functional process and equipment engineering teams to identify and implement process improvements. Perform root-cause analysis and failure-mode analysis to identify process limitations and develop corrective actions. Conduct fundamental research to support next-generation memory technologies and process innov

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global leader in memory and storage solutions, driving innovation in next-generation DRAM technologies that power artificial intelligence, cloud computing, and advanced computing applications. The Dry Etch Process Development team develops and optimizes advanced plasma etch processes that enable future memory scaling and support groundbreaking semiconductor manufacturing. As a Dry Etch Process Development Engineering Intern, you will gain hands-on experience developing and optimizing semiconductor etch processes in a collaborative research and development environment. Working under the mentorship of experienced engineers, you will contribute to a technical project focused on process development, experimentation, data analysis, and technology innovation. The internship provides broad exposure to semiconductor processing and culminates in a presentation of project results to engineering and leadership teams. Responsibilities Research and develop innovative solutions that support future memory technologies and advanced dry etch process development. Develop, complete, and analyze experiments to optimize dry etch processes and improve product performance. Perform statistical analysis of technology development and pilot manufacturing data to identify trends and drive process improvements. Collaborate with process, equipment, integration, and multi-functional engineering teams to solve complex technical challenges. Apply AI-Enabled analytical tools, Leveraging AI, programming, or automa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE &#43; 10 years or BSEE &#43; 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong