Dram Technology Sr Layout Design Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 次世代DRAM技術開発におけるプロセスインテグレーション業務をご担当いただきます。 【主な業務内容】 次世代DRAMノード向けプロセス技術の開発および統合 キャパシタモジュールの設計、開発、最適化 複数のプロセスモジュールを統合し、性能および整合性を確保 プロセス条件最適化のためのDOE&#xff08;実験計画法&#xff09;の設計・実施およびデータ解析 歩留まりおよび品質に関する課題の特定と改善 Process、Design、Device、Qualityチームとの部門横断的な連携 応募資格 必須要件&#xff08;技術スキル&#xff09; 半導体プロセスに関する基礎知識 プロセスインテグレーションまたは関連するエンジニアリング分野の知識 半導体業界における5年以上の実務経験 歓迎要件 DRAMデバイスおよび構造に関する知識 語学・コミュニケーションスキル 海外チームとの会議に対応できる英語でのコミュニケーション能力 日常業務を遂行できる日本語力 関係部門との連携・調整を円滑に進めるための高い対人コミュニケーション能力 求める人物像 高い分析力と問題解決能力をお持ちの方 チーム環境において主体的に業務を推進できる方 技術的課題に対して粘り強く取り組み、オーナーシップを持って対応できる方 ------------------------------------------------------------------- ■ Job Responsibilities In this role, you will be responsible for process integration activities for next-generation DRAM technology development. Your key responsibilities will include: Development and integration of process technologies for Future DRAM nodes Design, development, and optimization of capacitor modules Integration across multiple process modules to ensure consistency and performance <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal/MTS Process Development Engineer with a focus on Vapor/Thermal etching, you will be part of a revolutionary Advanced DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration, equipment development engineers, hardware vendors and other process areas including Dry Etch, Metals, CVD, Diffusion, Lithography and CMP. You will work on state of the art and best in class tooling and own the process roadmap to meet program and yield goals! Responsibilities: Develop and integrate advanced thermal, vapor, and atomic layer etch processes for next-generation DRAM technologies Lead feasibility studies, technical investigations, and root-cause analysis to resolve complex process challenges Drive process roadmaps, technical readiness, and yield improvements to meet program objectives Collaborate with Process Integration, equipment development, hardware vendors, and cross-functional engineering teams to deliver innovative solutio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Diffusion Process Development Engineer, you will act as a technical leader accountable for FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM devices! This position emphasizes gate dielectric scaling, process reliability, and manufacturing preparedness. The ideal candidate blends extensive expertise in diffusion processes, oxidation principles, and device physics with practical experience transitioning technologies from development to production. You will collaborate closely with groups dedicated to process development, device engineering, equipment, and manufacturing to support future technology nodes. This role requires work with AI for productivity. Key Responsibilities Lead the progress of FEOL diffusion, thermal treatment, and gate oxidation operations in advanced DRAM technology. Develop and scale ultra-thin gate dielectrics, balancing electrical performance, reliability, variability, and manufacturability. Drive process development from concept through integration, pilot qualification, and manufacturing transfer. Evaluate, qualify, and optimize diffusion and oxidation equipment platforms and reactor builds. Define and monitor manufacturing metrics, including statistical process control, process capability, defectivity, and variability. Interpret electrical, physical, and materials characterization data to guide development decisions. Partner with external suppliers to develop hardware and processes aligned with future technology

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Technology group at Micron Technology develops and validates advanced memory solutions that enable the transformation of information into intelligence. The team operates in a collaborative, inclusive, and globally distributed environment, partnering closely with design, product, test, process, manufacturing, and quality organizations to deliver industry‑leading DRAM technologies. The Design Validation Product Engineer supports the validation of new DRAM products by focusing on real‑silicon behavior through bring‑up, characterization, and debug. This role builds a strong technical foundation in DRAM architecture, semiconductor devices, and validation methodologies while working closely with multi-functional engineering teams. Responsibilities Support DRAM design validation through silicon bring‑up, characterization, and validation testing of new memory products Analyze electrical and functional data to identify trends, marginalities, and failure mechanisms Assist with debug of validation issues using simulations, test results, and laboratory measurements Use engineering lab equipment and testers to characterize device behavior and performance Document validation results, test coverage, and observed behaviors while collaborating with design, test, manufacturing, and quality teams Minimum Qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field Strong fundamentals in digital logic,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Our Team as a STAFF ENGINEER, TDT PD CMP At Micron, we are driven by the pursuit of excellence and innovation. As a Chemical Mechanical Planarization (CMP) Process Development Engineer, you will play a key role on our Technology Development Taiwan (TDT) CMP team. You will contribute to the progress of our innovative DRAM technology. If you have a passion for semiconductor development and enjoy working in a dynamic and collaborative environment, we invite you to join us in defining the future of the semiconductor industry! Key Responsibilities Develop and refine CMP processes to support advanced DRAM technology acceleration. Collaborate with diverse teams to develop new outstanding semiconductor devices. Perform rigorous process characterization, develop new consumables, and evaluate new hardware. Conduct groundbreaking research and innovate to contribute to Micron’s extensive patent portfolio. Drive continuous process and efficiency improvements to meet yield, quality, and cycle time requirements. Direct and manage CMP consumables and equipment suppliers. Plan and complete well-designed experiments, presenting results in clear and concise reports. Minimum Qualifications Proficiency in both Chinese and English languages. Expertise in CMP process development. Hands-on experience with CMP polishing equipment, including familiarity with equipment operation, optical metrology, profilometry, common polishing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Process Integration team plays a critical role in developing and manufacturing advanced DRAM technologies that power next-generation computing, data centers, mobile devices, and AI applications. Our team collaborates across Process Engineering, Device Engineering, Yield Engineering, and Technology Development to optimize semiconductor manufacturing processes, improve product performance, and accelerate the successful deployment of leading-edge memory solutions. Through data-driven decision making, innovation, and continuous improvement, we enable the development of technologies that support the future of artificial intelligence and advanced computing. Position Overview Micron is seeking a highly motivated Process Integration Engineer Intern for a 6-month internship supporting advanced DRAM technology development and manufacturing. This position provides hands-on experience in semiconductor process integration, electrical and inline data analysis, yield improvement, and cross-functional engineering collaboration. The intern will work closely with experienced engineers to analyze complex manufacturing data, identify process optimization opportunities, and support engineering solutions that enhance technology performance, manufacturing readiness, and AI-enabled innovation. Responsibilities Support the integration and optimization of semiconductor process modules across the DRAM manufacturing flow. Analyze electrical, inline, process, and yield data to identify performance gaps, yield detractors, and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are undergoing a historic expansion with our new fabrication facility in Boise, ID. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry and AI. We’re building a next-generation manufacturing capability in Boise (ID1), partnering closely with global teams to bring advanced DRAM technology into a greenfield fab. This is a highly collaborative environment where we solve complex integration challenges and directly impact yield, cost, and product quality. If you enjoy working at the intersection of device physics and manufacturing, you’ll find strong ownership and technical depth here. As a Senior Process Integration Engineer in our Advanced Technology and Engineering group, you will play a key role in transferring and scaling advanced DRAM nodes into high-volume production. You’ll lead integration efforts across modules, drive yield ramp, and resolve complex process interactions. This role is critical to achieving production readiness and sustaining best-in-class performance as we launch a state-of-the-art fabrication facility. Responsibilities: Lead module ownership including root cause analysis and fast-paced failure investigation Drive yield, cost, and quality improvements using data-driven met

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise High-Volume Manufacturing (HVM) fab is at the leading edge of DRAM technology, driving sophisticated semiconductor innovation through EUV lithography. We operate in a fast-paced, data-driven manufacturing environment focused on achieving extraordinary yield, process capability, and operational excellence while maintaining strict safety and contamination-control standards. For this great opportunity as an EUV Photolithography Engineer, you will lead the development, optimization, and sustainment of EUV processes and scanner performance critical to advanced DRAM nodes. You will be responsible for ensuring process stability, improving yield and throughput, and driving continuous improvement through data analysis, multi-functional teamwork, and sophisticated process control techniques in a high-volume manufacturing environment. Responsibilities Own EUV lithography processes and scanner fleets, ensuring stable high-volume manufacturing performance through SPC monitoring, overlay/CD optimization, defectivity reduction, and tool matching. Lead rapid response to process excursions, including containment, root-cause analysis, wafer disposition, and implementation of corrective and preventive actions (CAPA). Collaborate with Operations, Equipment Engineering, Integration, and Metrology teams to align on production priorities, resolve risks, and optimize cycle time, capacity, and output. Drive continuous improvement of process capability, yield, and equipment productivity using sophist

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Overview The High Volume Manufacturing (HVM) organization is responsible for delivering world-class manufacturing performance through process excellence, operational discipline, and continuous improvement. At Micron's Boise, Idaho facility, HVM teams play a critical role in ramping next-generation DRAM technology and supporting one of the most significant semiconductor manufacturing expansions in the United States. Through collaboration across engineering, manufacturing, and equipment teams, the organization drives yield improvement, productivity, and quality while enabling the memory solutions that power AI, data centers, and advanced computing technologies. Position Overview As a High Volume Manufacturing Shift Process Engineer, you will be responsible for improving process quality, yield, equipment performance, and manufacturing efficiency within your assigned area. You will analyze process performance, resolve manufacturing challenges, and drive continuous improvement initiatives that support area objectives and semiconductor production goals. In this role, you will partner closely with equipment engineers, shift operations leaders, and cross-functional stakeholders to ide

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in DRAM Technology Node Development, the role is responsible for bringing up new technology from design start through qualification and production ramp while co-optimizing product and process. Primary Responsibilities Enable new process node startup, qualification, yield and ramp. Provide direction to development teams using process integration knowledge. Develop technology health metrics and drive learning. Work with Design, TD, DFT, Manufacturing and Quality teams. Perform electrical failure analysis and yield improvement activities. Identify design marginalities and recommend fixes. Perform deep statistical analysis to improve product yield. Process–Device Integration & Failure Mechanism Diagnosis Collaborate with Process Integration, TD, Design, Test, and Reliability teams to identify yield‑limiting mechanisms and propose corrective actions. Conduct electrical failure analysis (bench &#43; probe) to isolate circuit, array, or process‑originated signatures. Interpret data from proprietary internal tools (e.g., FRPT/efrpt, csensei, Node Dev analysis workflows). Test Program & Probe Flow Development Guide probe program correctness by correlating design intent, simulation data, and production test behavior. Ide

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3&#43; months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, exp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3&#43; months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, expectations, and deliverables aligned with ramp milestones and fab n

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In your role as a Staff / Principal Wafer Bonding Process Engineer within Micron Technology's DRAM Technology Development group, you will join a worldwide memory development organization. You will contribute to developing modern wafer bonding process technology that keeps Micron at the forefront of memory technology. This position is important because it directly affects product quality, reliability, yield, cost savings, efficiency, and risk control. You will initiate, develop, and fine-tune bonding processes while addressing manufacturing line challenges. You will also manage process, equipment, and material evaluations and improvements to apply changes at various process steps. Your duties include leading and engaging in activities to improve yield and reduce costs, overseeing new process baseline qualifications, and collaborating with suppliers to achieve quality, cost, and risk objectives. You will use AI/ML/LLM tools to boost efficiency and maintain flawless operations. Responsibilities include, but not limited to: Develop and optimize wafer bonding processes to enable next-generation DRAM technologies. Plan and execute experiments (DOEs) to improve process performance, product quality, and reliability. Drive yield improvement, cost reduction, and productivity initiatives using data-driven problem solving. Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing. Collaborate with manufacturing, suppliers, and cross-

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DFT (Design for Test) Product Development Engineer in the DRAM Technology group, you will be part of a forward-thinking team of engineers that solves complex problems to develop industry-leading DRAM. In this role, you will gain an in-depth understanding of semiconductor memory functionality and become an expert in the test manufacturing code and testing techniques used to develop, implement, validate, and ensure device performance. You will engage with new technology at the build start to cultivate DFT and Micron’s component test flow philosophy on modern architectures. This will be accomplished through innovation and by multi-functional engagement with partner groups – Build, Test, Technology Development, Manufacturing, Marketing, and Quality Assurance departments. Agentice AI. Responsibilities Partner with Test Manufacturing, Product Engineering, and Design Engineering to provide test guidance, set priorities, and drive improvements in product quality and yield. Develop new DFT concepts and test architectures to support future enhancements in test coverage, efficiency, and test time reduction. Debug and identify root causes of failures using data analysis, elec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Summary The role requires a Member Technical Staff who has broad experience and innovative thinking. This person will lead the improvement of Diffusion, Thin Film Deposition (PECVD/PVD), and Wet Etch processes in advanced DRAM technology nodes. This role is critical to enabling manufacturing requirement memory products. It requires strong process integration expertise , strategic vision, and leadership capabilities. You will drive innovation, lead technical initiatives, define technology roadmaps, and mentor engineering talent. The focus is on improving process capability and accelerating yield ramp . Key Responsibilities Coordinate all activities related to the characterization, and refinement of Diffusion, PECVD/PVD thin film deposition, and Wet Etch processes for advanced DRAM applications. Collaborate cross-functionally with Integra