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Hbm Bond Equipment Engineer Jobs
495 active opportunities · Updated for October 2026
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Explore current hbm bond equipment engineer jobs. Use filters to narrow by work mode, employment type, experience and date posted.
Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) at Micron in Singapore. Full-time · On-site.
Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering at Micron Technology in Singapore. Full-time · On-site.
Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM at Micron in Singapore. Full-time · On-site.
Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding) at Micron in Boise, ID - Main Site, United States. Hybrid.
Staff Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering at Micron in Singapore. Full-time · On-site.
Senior/Staff Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM — Fab 10A, Singapore. Apply via Workday.
Snr/Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering at Micron in Singapore. Full-time · On-site.
Member of Technical Staff, SoC Power and Physical Architect, Next-generation HBM Architecture at Micron in United States. Full-time · On-site.
Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.
Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM — Fab 10A, Singapore. Apply via Workday.
Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth Memory) at Micron Technology in Boise, ID - Main Site, United States.
Job Summary Reporting to the Memory Validation leadership team, the Senior Silicon DDR/HBM Validation Engineer will be responsible for the bring-up, validation, characterization and debug of advanced memory subsystems used in next-generation AI compute platforms. The role will…
Product Integration Lead, HIG High Bandwidth Memory at Micron in Singapore.
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