Hbm Process Engineer Jobs

Staff Engineer – HBM PE Component Validation (Singapore) — Fab 10A, Singapore. Apply via Workday.

Senior Engineer - HIG HBM PSE — Fab 10A, Singapore. Apply via Workday.

Senior/Staff Engineer - HIG HBM PSE — Fab 10A, Singapore. Apply via Workday.

SENIOR ENGINEER HBM LAYOUT — Jalisco, Mexico. Apply via Workday.

Staff Engineer – HBM PE Component Validation (Singapore) — Fab 10A, Singapore. Apply via Workday.

PRINCIPAL ENGINEER HBM LAYOUT — Jalisco, Mexico. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. The Senior Engineer – HBM Design for Test (DFT) is an experienced technical contributor responsible for the definition, implementation, integration, and support of DFT solutions across HBM core die and base die for current and next‑generation HBM products. This role focuses on driving defined DFT architectures , contributing to DFT specifications, and partnering with multi‑functional teams to ensure DFT features meet test, quality, and manufacturability requirements. The Senior Engineer works closely with DFT Architecture, Design Engineering, Product Engineering, Test, and DFT Verification to support successful tape‑out, silicon bring‑up, and qualification. Key Responsibilities Implement and integrate DFT features for assigned HBM core die and base die designs in alignment with established DFT architecture and guidelines Contribute to the development, review, and maintenance of DFT specifications, requirements, and implementation guidelines Ensure DFT implementations support high‑quality, efficient, and manufacturable HBM products Collaborate with Design Engineering, Product Engineering, Test, and DFT Verification to: T

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Lead and develop teams responsible for customer integration, technical engagement, and system engineering. Drive customer technical interlocks, design reviews, escalations, and integration activities. Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions. Provide leadership in HBM architecture, system integration, packaging, manufacturing, and customer enablement. Establish scalable engagement models, governance processes, and executive communications that enable successful customer deployment and qualification. Drive resolution of complex technical issues while influencing future product and technology roadmaps. Develops and deploys AI (artificial intelligence) systems that help automate processes and solve technical challenges. Qualifications BS/MS in Electrical Engineering, Computer Engineering, or related field. 10&#43; years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience Strong understanding of HBM architecture, system integration, packaging, manufacturing processes, and customer qualification. <l

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, &#34;high bandwidth&#34;; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most ambitious due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are hiring a Layout Engineer for Micron Technology’s HBM Team in Hyderabad, India. In this role, you will contribute to advanced applications including artificial intelligence and high-performance computing solutions with High Bandwidth Memory. You will coordinate with peer groups across Micron's worldwide locations on multiple projects, providing an exceptional chance for career development! Role and Responsibilities Build and develop critical analog, mixed-signal, custom digital blocks, and provide full chip level integration support. Build and tapeout PWF Reticles. Collaborate with the Scribe Build team to implement and review Advanced Packaging requirements. Engage in TSV build with HIG-HBM DTPCO teams, ensuring flawless electrical, thermal, and mechanical performance. Exhibit a highly motivated, diligent, meticulous, and methodical approach in IC layout development. Perform layout verification like LVS/DRC/Antenna checks, quality control, and documentation. Ensure timely delivery of block-level layouts with outstanding qual

STAFF ENG-HBM-LAYOUT — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Senior Member of Technical Staff or Member of Technical Staff, DRAM Design Engineer in the next-generation HBM Architecture team, you will drive the architecture and optimization 3D-stacked, high-performance memories. Apply your knowledge to optimize DRAM designs and architectures for maximum performance, power, and area (PPA). This role is ideal for experienced DRAM designers who will identify, architect, design, and simulate next-generation architectures and memory features in collaboration with experts in stack architecture, memory systems architecture, and SoC microarchitecture. Responsibilities: Identify and develop novel DRAM circuit architectures that anticipate next-generation AI workload requirements, to unlock improvements in bandwidth and energy efficiency. Collaborate with peers to identify the highest-leverage DRAM circuit bottlenecks and define architectural hypotheses. Validate architectural hypotheses through schematic-level circuit design, SPICE simulation, and tradeoff analysis, establishing PPA feasibility. Partner with layout designers to conduct floorplanning studies. Colla

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Lead end-to-end layout execution of analog, mixed-signal, custom digital blocks and full-chip integration for HBM products. Own full-chip technical decisions covering analog, digital, memory, ESD, EM/IR and ensure optimal performance, power, and area (PPA). Technical Expertise : Hands-on experience in layout design of critical Memory /Analog and mixed-signal blocks such as: Array Layout, Decoder, Control logic , IOs , PLLs , ADCs, DACs, LDOs, Bandgaps, Reference Generators, Charge Pumps, Current Mirrors, Comparators, and Differential Amplifiers. Drive project planning and execution , including area/time estimation, scheduling, task delegation, and milestone tracking across multiple concurrent programs. Ensure timely delivery with quality , responsible for block-level and full-chip layouts meeting schedule commitments and quality expectations. Perform and oversee layout verification activities including LVS, DRC, Antenna checks, and ensure closure with proper documentation and audits. Lead and mentor the layout team , guiding junior engineers on sub-block execution, conducting design reviews, and enabling capability development. Drive innovation and productivity improvements , including adoption of AI/automation to reduce layout effort, improve turnaround time, and enhance quality. <li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Design layout for leaf cells, standard cells (Stdcell), or sub-blocks. Apply a systematic, meticulous, and methodical approach to IC layout design. Interpret DRC/LVS and other physical verification checks to ensure design accuracy. Demonstrate ownership and proactively plan work to meet project timelines. Collaborate effectively with internal teams to ensure successful layout project execution. Minimum Qualifications Bachelor’s, Master’s, or PhD in Electronics, Mechatronics, Robotics Engineering, Nanotechnology, or related fields. Graduation within the last 2 years (Bachelor’s, Master’s, or PhD). Strong knowledge of electronic circuit concepts. Experience using circuit simulation and design tools. Effective interpersonal and problem-solving skills. English communication skills (conversational level required). Self-motivated, enthusiastic, and collaborative standout colleague. Passion for technology and willingness to grow in the semiconductor industry. Preferred Qualifications Internship or academic project experience in pre-silicon circuit design. Understanding of pre-silicon development areas such as analog circuits and physical design. Basic knowledge of MOS concepts, semiconductor fabrication, and analog layout fundamentals. Strong interpersonal skills and goal-oriented perspective. Experience with programming or script

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertise :