Hbm Process Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 43 years, Micron Technology, Inc. has advanced the world’s most innovative memory and semiconductor technologies. As an HBM Memory Design Engineer within the HBM Architecture Team, you will design, simulate, and optimize digital and analog DRAM circuits for next‑generation high‑bandwidth memory products. You will evaluate block‑level and full‑chip functionality, solve complex challenges in building, and collaborate with a distributed team to deliver highly reliable, industry‑leading HBM solutions. This role provides the opportunity to contribute to groundbreaking DRAM design, TSV‑based 3D integration, and high‑speed mixed‑signal architectures supporting Machine Learning and AI applications. Responsibilities Design and analyze digital, analog, and mixed‑signal circuits for HBM DRAM products. Perform schematic entry, simulation, and optimization of DRAM blocks including data path, ECC, command control, and clocking circuits. Evaluate full‑chip and block‑level functionality and deliver solutions ensuring functional accuracy. Conduct pathfinding and feasibility studies for next‑generation HBM architectures. Optimize circuit timing, area, power, and complexity across high‑speed DRAM designs. Support design floor planning, layout reviews, and cross‑domain integration of memory, logic, and analog circuits. Collaborate with global engineering teams to drive innovation and support vertical integration across design

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Member of Technical Staff HBM Design Architect, you will be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and control logic, as well serializing and de-serializing scheme. You will collaborate with a highly creative and motivated development team applying brand-new memory technologies to build groundbreaking HBM products! Responsibilities: Responsible for the high-speed DRAM and Base die interface in HBM cube. Design the DRAM command and control logic, as well as serializing and de-serializing scheme at the interface. Conduct circuit simulations using standard industry simulators such as FINESIM, HSPICE and VERILOG Collaborate with data path design on floor planning and full chip testbench. Analyze timing/area/power in high-speed DRAM or mixed-signal design. Contribute to the development of new HBM product opportunities by assisting with the overall design, layout, and optimization of Memory, Logic, and Analog circuits. Qualifications: Extensive experience with DRAM operation and JEDEC specifications across DDR, LPDDR, GDDR, and HBM product families. Strong technical expertise in analog and mixed-signal circuit design. Hands-on proficiency in DRAM command decoding, bank logic, and RAS/CAS chain design. Demonstrated innovation and problem‑solving capabilities in

ENGINEER - HBM VERIFICATION — Jalisco, Mexico. Apply via Workday.

Staff HBM Design Architect — 2 Locations. Apply via Workday.

Probe HBM application integration engineer — Taichung - TCP, Taiwan. Apply via Workday.

MTB HBM Assembly Equipment Manager — Taichung - MTB, Taiwan. Apply via Workday.

Intern - HBM SoC RTL Design Engineer — Folsom, CA. Apply via Workday.

TCP HBM production technician — Taichung - TCP, Taiwan. Apply via Workday.

MTB HBM Manufacturing Engineer — Taichung - MTB, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join a team at Micron where you will have the chance to own verification and end-to-end analysis of complex full-chip custom builds. Our advanced low-power and power management technologies span multiple categories, including high-speed memories. Collaborate closely with global development and verification team members, many of whom have decades of experience in memory engineering. This role will also offer cross-functional tasks that can broaden your abilities. Responsibilities Lead and define the approach for the verification activities within your areas of expertise in any project the team engages in. Provide verification support to build projects by simulating, analyzing, and debugging pre-silicon full-chip builds. Design test cases/stimuli aimed at broadening the functional coverage for HBM emerging memory architectures and features. Take part in the development of verification methodology and environments for advanced HBM and emerging memory products. Collaborate with international colleagues on building new verification flows to address challenges in HBM and emerging memory development. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Apply AI for automation of technical and non-technical processes. Minimum Qualifications More than 5 years of experience in pre-silicon verification. BE or MTech in Electronics Engineering or related field.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive cross-functional collaboration across Design, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities Lead the design and execution of complex memory subsystems and top-level integration activities. Own design planning, technical decision-making, risk assessment, and schedule execution. Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. Review design specifications, microarchitecture documents, and implementation plans. Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs. Lead design reviews and drive issue resolution across organizations. Mentor junior engineers and provide technical leadership to project teams. Define and improve design methodologies utilizing AI-enabled tools, automation, and best practices. Support silicon bring-up, debug, characterization, and yield improvement activities. Communicate project status, risks, and mitigation plans to management and stakeholders. Required Qualifications BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field. 8+

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal/MTS Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design onl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Platform Architecture team defines the electrical, thermal, and power-delivery architectures that enable Micron's next-generation High Bandwidth Memory (HBM) solutions. Working closely with architecture, design, packaging, and technology teams, the organization drives innovation in signaling, power integrity, thermal management, and system optimization to support AI, high-performance computing, and data center applications. As an HBM Platform Architecture Intern, you will contribute to the development of future HBM platforms by evaluating electrical, thermal, and power delivery architectures for advanced memory systems. You will work alongside experienced architects to analyze design trade-offs, develop modeling tools, and investigate solutions that improve performance, power efficiency, reliability, and scalability for next-generation memory products. Responsibilities Perform signaling and timing analysis for on-die and off-die interfaces across multiple system and packaging topologies. Develop and evaluate thermal models to analyze heat transfer, thermal performance, and design trade-offs in advanced memory systems. Analyze power delivery networks (PDNs), including IR-drop, electromigration (EM), power integrity, and power grid optimization for advanced HBM architectures. Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation activities. Collaborate with architecture, design, packaging, and technology teams to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Memory Systems Architecture team defines the next generation of High Bandwidth Memory (HBM) solutions that power artificial intelligence, high-performance computing, and data center applications. The team drives architectural innovation across memory systems, controllers, interfaces, and reliability features to deliver industry-leading performance, scalability, and efficiency for future computing platforms. As a Memory Systems Architecture Intern, you will contribute to the architecture and microarchitecture development of future HBM products. You will work alongside experienced architects to evaluate new memory features, analyze architectural trade-offs, develop performance models, and explore solutions that improve memory performance, reliability, and efficiency for AI and high-performance computing workloads. Responsibilities Research and evaluate next-generation HBM architecture and microarchitecture features, including memory scheduling, refresh management, reliability features, thermal behavior, and memory controller interactions. Develop and enhance performance models, simulators, and analytical tools using Python, C++, or similar technologies to assess architectural trade-offs and system performance. Analyze workload behavior, simulation results, and architectural data to provide recommendations for future HBM product development. Utilize AI-assisted engineering tools and workflows to accelerate software development, specification analysis, data exploration, and technical documentat