Package Assembler Jobs

Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72+ million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life Responsibilities may include the following and other duties may be assigned. Sets up, operates, maintains, and troubleshoots packaging equipment. Monitors, evaluates and adjusts processes or packaging equipment to maximize quality and efficiency. Operates equipment that packages materials or products by inserting them into containers or filling containers from spouts or chutes. Completes the batch records and associated documentation. Works in an integrated computerized manufacturing environment. Tasks are performed in accordance with applicable safety guidelines, as well as appropriate processing standards. Tasks are completed in compliance with all regulatory requirements. May participate in program or functional team projects developing process improvement methods, solutions, and procedures to enhance program quality, cost, and scheduling. PRODUCTION SUPPORT CAREER STREAM:

Real people. Real service. At SupplyHouse.com , we value every individual team member and cultivate a community where people come first. Led by our core values of G enerosity, R espect, I nnovation, T eamwork, and GRIT, we’re dedicated to maintaining a supportive work environment that celebrates diversity and empowers everyone to reach their full potential. As an industry-leading e-commerce company specializing in HVAC, plumbing, heating, and electrical supplies since 2004, we strive to foster growth while providing the best possible experience for our customers. We are looking for a new Value Added Services (VAS) Associate to join our growing Inventory Control Team and Fulfillment Center network. This individual will report into our Inventory Control Supervisor and is responsible for executing kitting, assembly, packaging, labeling, and inventory rework activities within the Inventory Control department. This role ensures that inventory impacted by promotions, internal process corrections, or quality initiatives is accurately modified, documented, and returned to available stock while maintaining high standards of inventory integrity and quality control. If you are motivated and want to start a career with a rapidly growing company , we’d love to hear from you! Job Type: Full-Time, Non-Exempt Location: 530,000 sq. ft. in Columbus, OH at 6085 Winchester Pike, Columbus, OH 43110 Schedule: Monday through Friday, from 11:00am to 7:30pm EST Base Salary

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of product package assembly and process flow, to work with Process Integration, Process Dev

What We’re Looking For: We’re looking for mechanical design engineers to contribute to, and own aspects of the wafer-scale assembly, including the interactions between the power delivery system, mechanical chassis, heatsink and more. Ideal Background: Track record of solving one or more challenging mechanical engineering problems where the solution was something different than “the usual solution to this type of problem, slightly tweaked” Experience with high power density compute trays, chassis and/or racks. Experience working with multi-material assemblies with mismatched CTEs Nice to Have: Experience with solder joint reliability Experience with large physical size IC packages and assemblies Experience with CoWoS package assemblies Experience with optical system assemblies Experience with mechanical aspects of liquid cooled assemblies

What We're Looking For: We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team. Ideal Background: Experience with integrated photonics package assemblies with multiple dies Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc. Nice to Have: Experience with large device count photonic assemblies Experience with clear underfill Experience with high density fiber attach Experience with large substrate size photonic MCM assemblies Hands-on experience with PIC design

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Yield Enhancement (PYE) Electrical Failure Analysis (EFA) Engineer, you will work with a team dedicated to improving yields of next-generation memory products across all stages of the manufacturing lifecycle. Through failure analysis of test, internal qualification, and RMA failures, you will identify and help eliminate yield-limiting defects — driving enhanced product reliability, rapid production ramp, and early time to market. Your day-to-day work will center on fault isolation using a combination of electrical and physical characterization techniques paired with data analysis to pinpoint physical defects introduced during process fabrication or package assembly. You will also be responsible for presenting and coordinating failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams to ensure corrective actions are implemented and yields continue to improve. Responsibilities Perform Electrical Failure Analysis and Fault Isolation using emission microscopy, laser techniques, EO

About the job Own the manufacturing performance behind advanced AI compute systems in volume production. As, Senior Manufacturing Product Engineer you will connect product design, test, quality and supply chain with manufacturing execution. You will support volume production across PCB assembly with our build partners in Taiwan. Your work will improve yield, quality and manufacturability across complex products. You will link manufacturing process performance to the product metrics that matter most. You will manage partner engineering relationships, resolve manufacturing issues and drive continuous improvement. You will also shape DfM feedback, production data requirements and next generation manufacturing technologies. This role suits someone who combines practical manufacturing judgement with strong data thinking. You will work close to suppliers, product teams and the decisions that shape production outcomes. The team and culture You will join the Manufacturing and Technology Process team within Operations. The team works across Bristol, Cambridge and Taiwan, close to wafer foundry, package assembly and PCBA subcontractors. Work happens through direct ownership at partner sites and clear technical engagement with internal teams. You will move quickly on production issues, using data and engineering judgement to guide action. The team values people who speak up, take responsibility and build strong supplier relationships. Decisions are grounded in evidence, product impact a

About the job Shape how Graphcore products move from hardware design into reliable volume manufacturing. As Staff Manufacturing Product Engineer, you will take a leading role in supporting NPI development and volume production across complex hardware products. You will connect design, test, quality and supply chain decisions with real manufacturing outcomes. Your work will help ensure products are manufacturable, resilient and ready for supplier capability. You will provide DfM feedback that improves PCB and system design before issues reach production. You will work closely with contract manufacturers, especially during NPI and early volume manufacture. You will drive yield improvement, analyse production data and resolve L6 manufacturing issues. This role suits someone who enjoys practical engineering ownership across design and production. You will travel to Taiwan and work close to suppliers shaping next generation manufacturing technologies. The team and culture You will join the Manufacturing and Technology Process team within Operations. The team works across Bristol, Cambridge and Taiwan, close to foundry, package assembly and PCBA partners. Work happens through clear ownership, supplier engagement and fast feedback into design teams. You will speak up early when manufacturability, yield or capability needs attention. The team values evidence, responsibility and strong cross-regional relationships. Decisions are made through engineering judgement, data and direct acco

Corporate Paralegal About Backblaze Backblaze is a public company that makes storing and using data astonishingly easy. When our founding team got together, they committed to helping people save their data. Today, the Backblaze Storage Cloud provides a foundational platform around the world for a broad community of developers, IT generalists, entrepreneurs, and individuals who seek the easy, affordable, trusted solutions we provide. We have managed to nurture a team-oriented culture with amazingly low turnover. Our approach is guided by honesty, transparency, and a commitment to doing the right thing. Our customers are happy, and so are our coworkers: in the most recent “Great Place to Work” survey, 97% of our team rated Backblaze as “a great place to work.” Check out what our employees are saying on Glassdoor! About the Role We are seeking a Legal Paralegal to support Backblaze’s public-company, corporate, and governance operations. This role is the execution engine behind the Legal & Compliance team: public-company filings, board and committee preparation, entity and governance records, and litigation and insurance claims support. It frees attorney time and keeps a fast-moving public-company calendar running on schedule. The ideal candidate is exceptionally organized, detail-oriented, and comfortable handling confidential and market-sensitive information with discretion. This is a high-ownership role for someone who takes pride in accurate, on-time execution and wants t

About the job Own the component choices that help Graphcore products reach manufacturing with quality built in. As Component Engineer, you will support NPI and volume manufacturing across Graphcore’s hardware products. You will help specify, select and source the components needed for performance, reliability, quality and yield. Your work will connect engineering requirements with supplier capability and manufacturing reality. You will manage component data, BOM revisions, compliance checks, supply risks and alternative sourcing routes. You will work with manufacturing, test, quality, supply chain, suppliers and contract manufacturers. You will also help identify enabling component technologies for next generation products. This role suits someone who enjoys detail, electronics and practical problem solving. You will influence decisions that protect product delivery and strengthen manufacturing resilience. The team and culture You will join the Manufacturing and Technology Process team within Operations. The team works across Bristol, Cambridge and Taiwan, close to foundry, package assembly and PCBA subcontractors. Work happens through clear ownership, careful data management and direct engagement with internal and external partners. You will speak up when component risk, quality or supply continuity needs action. Decisions are grounded in technical evidence, supplier insight and manufacturing impact. The team values people who act responsibly, move issues forward and keep co

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities: Develop and optimize flip chip attach processes including bump formation, placement, reflow, and underfill for high-performance semiconductor packages. Define and manage bump metallurgy stacks (e.g., Cu pillar, SnAg, micro-bumps) and substrate pad finishes for robust interconnect performance. Drive package integration from die to substrate, ensuring alignment, coplanarity, and yield optimization. Evaluate and mitigate assembly risks including warpage, non-wet opens, voiding, head-in-pillow, and interconnect defects. Collaborate with substrate vendors, OSATs, and internal teams to define design rules (pad pitch, bump pitch, keep-outs, stack-ups). Lead process development for reflow profiles, flux selection, cleaning, and underfill dispense/cure. Perform root cause analysis of assembly and reliability failures using cross- sectioning, SEM, CSAM, and other failure analysis techniques. Support reliability qualification including thermal cycling, drop, mechanical shock, and power cycling. Work cross-functionally with design, reliability, thermal, and manufacturing teams to ensure robust pa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is within Micron’s Package Development Engineering (PDE) group, a global organization with teams in the United States, Singapore, Malaysia, China, Taiwan, and India. As a Package Device Product Engineer (PDPE), you will support new DRAM, NAND, or managed NAND (mNAND) products by coordinating resources, test readiness, and analysis throughout the product lifecycle. You will perform data analysis and modeling, create and maintain root cause analysis documentation, analyze parametric, front-end (FE) probe, and back-end (BE) electrical test data, and respond to product failures. Responsibilities and Tasks Enable new BE test signals to capture assembly-related failures.</