Package Assembler Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will lead and develop a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and cov

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. Job Responsibilities: Perform linear and non-linear static analysis for package and material behavior Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages Develop multiphysics models (thermo-mechanical, therm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As MSH PDE Yield Enhancement (YE) Lead Engineer within Package Development Engineering (PDE), you will lead a team of YE Engineers responsible for yield performance, excursion management, and yield stabilization across High Bandwidth Memory (HBM) New Product Introduction (NPI) . This role is accountable for ensuring predictable yield ramps , fast learning closure , and robust manufacturing readiness for advanced HBM technologies. You will provide people leadership, technical direction, and execution governance , partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing, Quality, and Program Leadership to protect schedule, yield, and customer commitments. Job Responsibilities People & Team Leadership Build, lead, and develop a high‑performing MSH PDE YE team Set clear expectations on yield ownership, execution discipline, and escalation behavior Coach engineers on technical rigor, structured problem solving, and stakeholder communication Drive individual development plans, succession planning, and technical depth within the YE team Ensure sustainable on‑call / coverage models for critical NPI and

We’re seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer capture pad design rules, OSAT engagement, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities Own end-to-end bump interconnect development for both ubump (micro-bump) and C4 processes, including bump formation, and reflow for use with mass reflow, TCB, and LAB chip attach for high-performance semiconductor packages. Define and own bump metallurgy stacks for ubump (e.g., Cu pillar/SnAg) and C4 (e.g., SAC alloys) interconnects, including UBM selection and pad finish specifications for both chip-side and interposer capture pads. Develop and own design rules for bump interconnects including pitch, bump diameter, standoff height, keep-outs, and land pad geometry for both the chip side and interposer or substrate capture pads. Lead RDL (redistribution layer) process development including electroplating of Cu RDL traces, via fills, and pad finishes; define RDL design rules for line/space, via diameter, and layer stack-up to meet electrical and reliability requirements. Collaborate with OSATs and bumping foundries to qualify ubump and C4 bumping processes, drive design rule alignment, and manage process transfers into production. Evaluate and mitigate bump interconnect assembly risks including non-wet opens, voiding, head- in-pillow, intermetallic growth, and joint fatigue failures across both ubump and C4 interconnect types. Perform root cause analysis of assembly and reliability failures using cross-sectioning, SEM, CSAM, and other failure analysis techniques. Support reliability qualification including thermal cycling, drop, mechanical shock, and power cycling. Work cross-functionally with design, reliability, thermal, and manu

Who We Are HP IQ is HP’s new AI innovation lab. Combining startup agility with HP’s global scale, we’re building intelligent technologies that redefine how the world works, creates, and collaborates. We’re assembling a diverse, world-class team—engineers, designers, researchers, and product minds—focused on creating an intelligent ecosystem across HP’s portfolio. Together, we’re developing intuitive, adaptive solutions that spark creativity, boost productivity, and make collaboration seamless. We create breakthrough solutions that make complex tasks feel effortless, teamwork more natural, and ideas more impactful—always with a human-centric mindset. By embedding AI advancements into every HP product and service, we’re expanding what’s possible for individuals, organisations, and the future of work. Join us as we reinvent work, so people everywhere can do their best work. We would love to hear from you! We are always looking to connect with people who are passionate about our Mission. If you don’t see an open role that matches your background and interests, please apply here and let us know what you are looking for in your next career move. We would love to hear from you! We will review your background and keep you in mind as we open future opportunities. Compensation & Benefits (Full-Time Employees) The salary range for this role is listed above. Final salary offered is based upon multiple factors including individual job-related qualifications, education, experience, knowledge and skills. At HP IQ, we offer a competitive and comprehensive benefits package, including: Health insurance Dental insurance Vision insurance Long term/short term disability insurance Employee assistance program Flexible spending account Life insurance Generous time off policies, including; 4-12 weeks fully paid parental leave based on tenure 11 paid holidays Additional flexible paid vacation and sick leave ( US benefits overview ) Why HP IQ? HP IQ is HP’s new AI innovation lab, bu

Commercial Comm and Electric has been serving the greater Phoenix area since 2010. Our CEO, Dean Lundstrom has been a leader within the industry for 30+ years and has related his success directly to his "make it happen" motto. We acknowledge the importance of each project and have built our growing company with high quality foreman, technicians, project managers and estimators while building relationships with some of the country's most reputable general contractors. Veteran & Family Owned & Operated As an Air Force Veteran himself, our CEO Dean is proud to employ several retired military personnel. We are also a family owned and operated business. Members of Dean's family have been strongly involved in the business since the foundation of CCE and has been integral to our success embodying stability and longevity. Position Summary The Prefab Technician supports CCE’s electrical prefabrication operations by assembling, preparing, labeling, and staging electrical components and assemblies for delivery to project sites. This hands-on role follows approved drawings, work instructions, quality standards, and safe work practices to produce accurate, installation-ready materials. Key Responsibilities Measure, mark, cut, bend, drill, fasten, and organize materials using approved tools and equipment within the employee’s training and qualifications. Review work orders, assembly details, and material lists; ask questions when information is unclear before proceeding. Check completed assemblies for accuracy, workmanship, labeling, and completeness; report defects and assist with corrections before shipment. Keep workstations, tools, and materials organized; report shortages, damage, and waste. Package, label, and stage finished assemblies to support accurate deliveries and efficient installation by field crews. Follow CCE safety procedures, use required PPE, and report hazards, near misses, and equipment concerns promptly. Coordi

Estimator Help Build Projects That Make an Impact At Dome Construction, we’re not just building structures — we’re building trust, relationships, and lasting impact. We’re currently looking for an experienced Estimator to join our Preconstruction team. This role plays a key part in setting projects up for success from day one. If you enjoy working on complex commercial construction projects and thrive in a fast-paced, collaborative environment, we’d love to connect. What You'll Do What You’ll Be Doing As an Estimator, you’ll lead preconstruction efforts on a variety of exciting projects across sectors like Healthcare , Life Sciences , and Tenant Improvements . You’ll be the go-to for all things estimating — from reviewing early sketches to submitting full proposals and working directly with clients and trade partners. You’ll also help mentor team members and work closely with our operations team to ensure a smooth handoff into construction. Key responsibilities include: Develop complete and accurate project estimates and budgets Perform quantity takeoffs and detailed document reviews Manage subcontractor solicitations and bid processes Analyze subcontractor proposals for scope compliance and completeness Assemble final estimate packages and presentations Support project buyout activities and subcontract creation Coordinate turnover packages for project teams Maintain cost databases and unit pricing information Participate in project pursuit efforts and client presentations Support design-build project delivery processes Collaborate with MEP specialists on highly technical projects Attend weekly and monthly project and estimating meetings What We're Looking For Qualifications Bachelor's degree in Construction Management, Civil Engineering, or a related field preferred 5+ years of construction industry experience 2+ years of commercial construction estimating experience Strong understanding of construction means, methods,

NVIDIA is seeking an a PCB Library Engineer to join our PCB Design Infrastructure team. In this role, you will help develop and maintain the PCB library assets used across NVIDIA's Data Center, AI, Networking, Automotive, and Graphics products. Working alongside experienced PCB designers, library engineers, mechanical engineers, manufacturing engineers, and component engineers, you will create and validate component footprints, schematic symbols, mechanical components, panel definitions, and other critical design assets that enable successful product development. This position provides an excellent opportunity to build expertise in PCB design, manufacturing, component engineering, and design automation while supporting some of the most advanced computing platforms in the world. What you'll be doing: Develop PCB footprints, padstacks, schematic symbols, and mechanical library content using Cadence PCB design tools. Review component datasheets, package drawings, and engineering specifications to create accurate design libraries. Support library verification, release, and documentation processes. Partner with PCB design, mechanical engineering, manufacturing engineering, and operations teams to resolve library-related issues. Learn and apply industry standards, including IPC requirements, DFM, DFA, and DFT principles. Support quality initiatives to ensure library content is accurate, manufacturable, and scalable. Participate in continuous improvement and automation efforts within the library environment. Develop a strong understanding of PCB fabrication, assembly, and component technologies. What We Need to See: BS degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field or equivalent experience. <p

This is where your work makes a difference. At Baxter, we believe every person—regardless of who they are or where they are from—deserves a chance to live a healthy life. It was our founding belief in 1931 and continues to be our guiding principle. We are redefining healthcare delivery to make a greater impact today, tomorrow, and beyond. Our Baxter colleagues are united by our Mission to Save and Sustain Lives. Together, our community is driven by a culture of courage, trust, and collaboration. Every individual is empowered to take ownership and make a meaningful impact. We strive for efficient and effective operations, and we hold each other accountable for delivering exceptional results. Here, you will find more than just a job—you will find purpose and pride. Your role at Baxter: This position performs downstream activities that are required to successfully complete a production. This involves initiation of paperwork not generated by the documentation center, verification of components per the appropriate Bill of Materials, set-up, challenge & verification of label dispensers, verification of weighing/measuring devices for current calibration status, and set-up and verification of batch board and seal integrity stations. Some areas require assembling equipment including the operation of blending, grinding, and some molding. What you'll be doing: Monitor product exposure times and document process flow as required Periodically performs all Operator I/Operator II functions Pull required processing samples, document, package and distribute Set-up/Tear down room and keep production area supplies up to date Perform all line clearances Replace labels on dispensers, take appropriate samples and verify as well as troubleshoot any label dispenser prob

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today, SpaceX is actively developing the technologies to make this possible, with the ultimate goal of making life multiplanetary and expanding consciousness to the stars. SpaceXSI is building Super Intelligence to help humanity understand the universe. Our teams are building the full Super Intelligence stack: from our Colossus supercomputers, to Grok models, to our suite of applications, including Grok Bot, Grok Build, Grok Imagine, Grok Voice, and X. We're creating a powerful flywheel where more compute trains better models, better models power more useful products, and what we learn from people using those products shapes what we build next. ABOUT THE ROLE: We are seeking an Industrial Welder to support the buildout of SpaceXSI's high-performance data centers. In this hands-on role, you will fit and weld large industrial piping and structural steel to ASME Section IX and keep construction moving on our next-generation AI supercomputing infrastructure. You will work closely with mechanical, structural, electrical, and operations teams to weld pipe, supports, and structures from construction through turnover. This is a full-time, onsite role with significant travel to SpaceXSI data center sites. RESPONSIBILITIES: Fit, tack, and weld large-bore industrial piping and/or structural steel (pipe racks, platforms, supports, skids, and related assemblies) per drawings and ASME Section IX welding procedure specifications (WPS). Lay out, cut, bevel, grind, and align joints; check fit-up, root opening, and reinforcement before and after the weld. Read isometric, spool, and structural drawings; work to weld maps, heat numbers, and rod-control / continuity requirements where used. Support hanging of strut, supports, hangers, and structural members; assist with equipment set and bolt-up as needed to complete the weld package. Stag

About the job Shape the component choices that turn complex electronics designs into reliable, manufacturable products. You’ll support component selection, evaluation and qualification across new product introduction and volume manufacturing. Your decisions will help protect product performance, quality, yield and continuity of supply. You’ll identify component risks and develop practical alternatives. Working across Manufacturing, Test, Quality and Supply Chain, you’ll manage component specifications, approved lists and Bill of Material revisions. You’ll also explore enabling component technologies for future products. This role connects detailed electronics knowledge with real manufacturing and supply chain challenges. The team and culture You’ll join Graphcore’s Manufacturing and Technology Process team within Operations. The team works across Bristol, Cambridge and Taiwan. Your work will connect internal engineering teams with component suppliers and manufacturing partners. You’ll solve problems across component, PCB, package and manufacturing dependencies. You’ll be expected to take ownership, surface risks early and use evidence to make sound decisions. Some global travel to supplier sites may be required. What we’re looking for Strong electronics knowledge, including component parameters, datasheets and component selection. Practical knowledge of BoM management and component sourcing systems, such as Arena and Silicon Expert. A good understanding of PCB manufacturing and SMT assembly processes. Ability to understand dependencies between silicon, package and PCB design. Experience working with electronics suppliers and contract manufacturers, plus strong stakeholder communication skills. Electronic Engineering qualifications or equivalent practical experience. Ability to communicate effectively using Chinese speaking language (Mandarin) Benefits Unlimited annual leave Medical & Life Insurance Eye Care Cover Annual Health Assessment Phantom equi

What is JetZero ? Today’s aircraft contribute around 4% of global CO2 emissions, equivalent to the emissions of 200 million cars. This is only going to increase: Air travel is forecasted to double by 2050, while meaningful efficiency gains using current airplanes have hit a wall. JetZero is developing a b lended - wing body (BWB) aircraft . It uses up to 50% less fuel and will be built to accommodate zero-emission hydrogen propulsion. JetZero is the inevitable solution to sustainable air travel. The JetZero Team We are experienced aerospace professionals and engineers, excited about the future. That future will only be possible if we share our vision and what it means to people’s lives: carbon-free flight that ' i s better for both passengers and airlines around the world . We are seeking a Senior Manufacturing Engineer to join our team and revolutionize the role of manufacturing planning within the aviation industry. This role will focus on collaborating within an integrated product team to develop innovative solutions and create a producible product. Manufacturing Engineers will be responsible for driving design for manufacturing (DFM) principles into the product development process, ensuring designs are optimized for producibility, cost, quality, and scalability. They will collaborate closely with design teams to influence material selection, tolerances, part consolidation, and assembly methods, while developing manufacturing processes, tooling strategies, and build sequences that enable efficient, repeatable production so that our future manufacturing efforts can thrive. What You'll Do: Create comprehensive work package instructions to translate design concepts into actionable, production-ready processes. Design efficient guidelines and standards for producibility of the build Develop and validate manufacturing processes, tooling, and build strategies that enable efficient, repeatable production. Collaborate with structures and