Packaging Area Shift Engineer Jobs

Role Description: Being a Product Manager at Defense Unicorns is more than just being part of the sparkliest Product team in defense tech. It means taking radical ownership over real products that make a real impact on real people. At Defense Unicorns, our mission is to make software a strategic deterrent, and our Product Management team clears the path. In this role, you’ll report to the Director of Product and work with teams who deliver outcomes that are critical business enablers and directly support both our missions and other internal teams. This team’s primary responsibility is the creation and maintenance of tooling and pipelines that support UDS application packaging, as well as maintenance of several packages which comprise our core software deliverables. Responsibilities: The listed responsibilities are not exhaustive and additional responsibilities may be assigned based on the evolving needs of the organization. We are seeking a dynamic individual who is able to adapt and take on new responsibilities as they arise. Passion for the intersection of business, open-source software, and national security Participate in and foster open source communities around Defense Unicorns’ open source projects Comfortable owning a product vision end-to-end and being accountable for delivering to several customer segments, including both paid and OSS Managing the expectations and delivery of outcomes of unicorns engineers entrusted to you Establishing and clearly communicating vision and objectives at all levels of the company - from engineers to executives Continuously balance customer, business, and technical priorities with limited resources Synthesizing external customer requests into an internal product roadmap Discipline required to work in a fast-paced, remote environment Keep our Growth and Delivery teams aligned on roadmap and value proposition in order to support product pricing, customer segmentation, and customer needs Experience managi

Where Performance Meets Purpose Join a team that values excellence and innovation, at a company known for its iconic golf brands. At Acushnet Company, your background and experience contribute to creating the best products for dedicated golfers worldwide. Here, your performance has purpose. What You Will Be Doing We’re seeking a detail-oriented and results-driven Quality Engineer to support quality assurance and continuous improvement initiatives across Acushnet’s Custom Ball and Packaging Operations. In this role, you will be responsible for driving quality improvements, reducing process variation, and ensuring products consistently meet customer expectations and internal quality standards. You will partner closely with manufacturing, operations, engineering, and cross-functional teams to identify opportunities to reduce defects, customer returns, quality exceptions, logo overruns, and make-ups while supporting the achievement of established quality performance goals. You will analyze and report quality data through quality management systems and Statistical Process Control (SPC) methodologies, providing insights that drive operational improvements and informed decision-making. As an active participant in quality-focused teams, including Quality Steering Committee activities and Quality Initiative Program projects, you will help lead efforts focused on process optimization, cost reduction, and product quality enhancement. Additionally, you will support continuous improvement initiatives by conducting root cause analyses, implementing corrective actions, and driving sustainable process improvements across Custom and Packaging operations. The Quality Engineer will also assist with Change Notice reviews,

Job Details: Job Description: As a Module Equipment Technician, you will play a vital role in ensuring the smooth operation of advanced manufacturing equipment used in semiconductor production. You will perform hands-on troubleshooting, maintenance, and calibration of electromechanical systems while supporting experiments and equipment modifications that drive cutting-edge advancements. Your work will directly contribute to enhancing equipment reliability and optimizing production efficiency, making an essential impact on Intel's manufacturing operations. Business Group Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) organization, a leader in delivering innovative and cost-effective substrate packaging solutions. This business group is focused on advancing Intel's capabilities in manufacturing technology to maintain competitive excellence across global markets. As part of this dynamic team, you will support critical equipment and collaborate on continuous improvement initiatives that align with Intel's broader mission of innovation and growth. Key Responsibilities Perform electrical and mechanical troubleshooting to diagnose issues with manufacturing equipment. Execute setup, calibration, corrective and preventative maintenance on production equipment, including wet chemistry, plating, and dry high-vacuum toolsets. Monitor tool performance and analyze data to identify and address equipment-related issues. Collaborate with engineering and support teams to improve equipment reliability and reduce downtime. Document maintenance activities, repair findings, and parts usage using established systems and procedures. Lead or contribute to continuous improvement projects, focusing on equipment optimization and yie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Develop and optimize HBM assembly and packaging processes to achieve manufacturing targets. Analyze process data and identify improvement opportunities using statistical and data-driven methodologies. Utilize AI-enabled tools and advanced analytics to improve troubleshooting efficiency and accelerate root cause identification. Drive yield improvement, defect reduction, and process capability enhancement initiatives. Support failure analysis activities and implement corrective and preventive actions. Collaborate with cross-functional teams to resolve technical challenges and support new product ramp. Apply digital and AI-assisted workflows to improve operational effectiveness and engineering productivity. Maintain process documentation and ensure compliance with manufacturing standards. Education Bachelor's or Master's degree in Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, or related disciplines. Experience 0–2 years of experience for New College Graduates (NCG). Semiconductor manufacturing, packaging, or process engineering experience is a plus. Skills Strong analytical thinking and problem-solving capability. Ability to interpret and analyze large datasets to support engineering decisions. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve equipment condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify equipment management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leverage AI-enabled tools and data-driven insights to improve operational efficiency, accelerate problem-solving, and support continuous improvement initiatives. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​ • Preferred to have over 3-year of working experiences in production line.​ • Must have process maintain experience.​ • Bachelor degree or

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department MSB Process Integration Engineering Project Title Semiconductor Manufacturing Reject Reduction Through Process Variability Analytics Project Description The intern will participate in a structured project focused on improving semiconductor manufacturing reject rates through process variability reduction. The project will provide practical exposure to semiconductor packaging, Assembly and Test processes, and manufacturing data analytics. Under appropriate guidance, the intern will analyze inline signals, process parameters, and test results to identify patterns and potential contributors to process variability and yield loss. The intern will also explore the responsible application of Artificial Intelligence and AI-Enabled analytical tools to improve the efficiency, quality, and effectiveness of project analysis. Objective of the Project The project aims to: Identify potential sources of process variability and yield loss. Improve the analysis of inline signals, process data, and test results. Determine relationships between process conditions and manufacturing rejects. Develop data-driven re

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping, micro‑cracks, subsurface damage,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates from other materials-intensive industries and research institutions to apply. Responsibilities Develop, characterize, qualify, and integrate advanced materials for next-generation memory and packaging technologies. Form hypotheses, design and run rigorous experiments, analyze data, and use the results to guide materials and technology decisions. Investigate materials behavior, including interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions. Drive materials development in areas such as: Polymer composites and encapsulation materials,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Build the Future of Memory and AI from India At Micron India , we are helping shape the next generation of memory and storage solutions that power Artificial Intelligence, cloud computing, mobile devices, automotive systems, and data centers worldwide. Join a team of innovators, engineers, and technology leaders working at the forefront of semiconductor design, verification, product development, advanced packaging, data analytics, and manufacturing technology. From pioneering High Bandwidth Memory (HBM) solutions for AI to developing next-generation DRAM and NAND technologies, Micron India plays a critical role in delivering innovations that enable the world's most demanding computing applications. As one of Micron's fastest-growing innovation hubs, our teams collaborate globally to solve complex engineering challenges, accelerate technology development, and transform breakthrough ideas into products used by billions of people around the world. Opportunities Across Micron India Engineering Teams DTPG (Design Technology & Product Group) Design and develop next-generation DRAM, NAND, and emerging memory technologies powering AI, high-performance computing, mobile, and cloud applications. Work across memory architecture, circuit design, layout, verification, characterization, and product engineering to bring cutting-edge semiconductor innovations to market. TD (Technology Development) Drive the future of memory technology

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Responsibilities Perform electrical and physical failure analysis on advanced packaging products to identify root causes of defects and failures using advanced failure analysis tools. Perform sample preparation, cross-sectioning, decapsulation, polishing, microscopy inspection, and other laboratory techniques as required for failure analysis investigations. Operate and maintain analytical equipment such as Optical Microscopes, SEM, EDX, FIB, X-ray, C-SAM, and other failure analysis tools. Write and document failure analysis findings, and FA reports in a timely manner. Ensure compliance with laboratory safety requirements, equipment operating procedures, quality management systems, and 6S housekeeping rules. Participate in continuous improvement initiatives to enhance laboratory efficiency, analytical capability, and turnaround time. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhanc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Engineering Operations Support Create, release, and track engineering lots within manufacturing systems. Monitor hold lots and support timely issue resolution. Execute authorized MES transactions, including lot creation, issue lot, undo process, and lot recovery activities. Support CQ lot start requests and engineering build execution. Support engineering and manufacturing operational meetings and follow-up actions. Material & Logistics Management Receive FOUPs from warehouse and verify material readiness. Perform FOUP/FOSB transfers to support engineering and qualification activities. Execute FOSB packaging and shipment preparation. Prepare shipment documentation and logistics records. Coordinate wafer and sample delivery for laboratory analysis activities. Support kit and re-kit activities for engineering lots. Inspection & Process Support Configure inspection-related recipes and operational setup activities. Modify and maintain Atlas maps to support engineering execution. Support transaction recovery activities, including system troubleshooting and data verification. Perform routine operational checks to ensure lot readiness and processing continuity. Troubleshooting & Continuous Improvement Investigate hold lot issues and support recovery actions. Escalate manufacturing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Intern for Assembly and Test (AT) Materials Category Supplier Management, you will support Micron’s Assembly and Test materials category team in managing critical semiconductor material suppliers, strengthening supply assurance, improving cost competitiveness, and enabling resilient global sourcing strategies. You will learn how category managers analyze market dynamics, supplier performance, cost drivers, risk exposure, and stakeholder requirements across key AT materials categories such as packaging substrates, molding compound, gold wire, die-attached film, solder-balls and other materials used in Assembly packaging. This internship offers hands-on exposure to strategic sourcing, supplier engagement, data analytics, benchmarking, and cross-functional business partnering in a fast-paced global semiconductor supply chain environment. Intern will take opportunity to use and apply AI tools including use of Agents, Agentic AI and Agentic solutions. Key Responsibilities AT Materials Cost, Market & Supplier Analysis Assist in developing cost, market, and supplier analysis for assigned AT materials categories, including price trend tracking, supply-demand outlook, cost drivers, and industry benchmarking. Support collection and synthesis of supplier intelligence, including capacity updates, technology roadmaps, commercial position, risk indicators, and regional supply considerations. Help maintain category dashboards, supplier scorecard

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Within the HBM organization, this role is part of a highly collaborative team focused on advancing next-generation High Bandwidth Memory (HBM) solutions through deep characterization, modeling, and root-cause analysis. The team partners closely with Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development organizations to drive product innovation and quality. This role is critical to achieving DTPCO objectives by developing a first-principles understanding of HBM cube limitations and validating hypotheses through silicon data and supporting models. The position focuses on custom bench-level characterization of HBM devices under thermal, mechanical, and electrical stress conditions to improve product performance, yield, reliability, and adaptability across future HBM generations. Responsibilities Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards. Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, tim

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Platform Architecture team defines the electrical, thermal, and power-delivery architectures that enable Micron's next-generation High Bandwidth Memory (HBM) solutions. Working closely with architecture, design, packaging, and technology teams, the organization drives innovation in signaling, power integrity, thermal management, and system optimization to support AI, high-performance computing, and data center applications. As an HBM Platform Architecture Intern, you will contribute to the development of future HBM platforms by evaluating electrical, thermal, and power delivery architectures for advanced memory systems. You will work alongside experienced architects to analyze design trade-offs, develop modeling tools, and investigate solutions that improve performance, power efficiency, reliability, and scalability for next-generation memory products. Responsibilities Perform signaling and timing analysis for on-die and off-die interfaces across multiple system and packaging topologies. Develop and evaluate thermal models to analyze heat transfer, thermal performance, and design trade-offs in advanced memory systems. Analyze power delivery networks (PDNs), including IR-drop, electromigration (EM), power integrity, and power grid optimization for advanced HBM architectures. Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation activities. Collaborate with architecture, design, packaging, and technology teams to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop an