Packaging Area Shift Engineer Jobs

About the Team The Pricing & Monetization team is responsible for how our products create and capture value. We partner closely with Product, GTM, Finance, and Systems teams to design pricing models, packaging, and commercial strategies that support adoption, growth, and long-term scaling of the business. To thrive in this team, you need to be a proactive problem-solver who excels at bringing structure to ambiguous challenges. Our work demands strategic thinking, cross-functional collaboration, and precision in execution. Team members succeed when they are analytical, detail-oriented, skilled at balancing multiple priorities, and passionate about driving high-stakes projects forward to deliver meaningful results. About the Role We are looking for a Pricing Operations Lead to help translate pricing and packaging decisions into clear, scalable execution. You will work closely with pricing leaders and cross-functional partners across Product, Engineering, Billing, Finance, and GTM to ensure pricing changes are implemented accurately, system requirements are well managed, and launch decisions move from strategy to reality with discipline. You should be comfortable operating at the intersection of business judgment, systems thinking, and program management. This role will help shape the operating backbone for pricing implementation, support teams developing billing and related monetization systems, and ensure the pricing team's needs are represented clearly in cross-functional planning and execution. In this role, you will: Lead the operational execution of pricing and packaging decisions from approval through implementation and launch Translate pricing strategy, policies, and launch decisions into clear business requirements for billing, quoting, revenue, and related systems teams Partner with Product, Engineering, Billing, Finance, and GTM teams to manage dependencies, scope tradeoffs, testing needs, and launch readiness Own pricing-related requirement intake and p

Creative Cloud is Adobe’s suite of creative tools including Photoshop, Illustrator, and Premiere Pro, which are used by millions of creatives worldwide. AI is transforming how people create. There’s an opportunity to simplify our plans and packaging so customers can easily find and understand the plan that’s right for them. We are seeking a strategic Group Product Marketing Manager to own how Creative Cloud is packaged, new AI products get monetized, and AI features launch across Creative Cloud products. You will lead a team responsible for this work and set the direction for how it comes together. This is a horizontal role: you’ll work across Product , Finance, and Marketing teams to give Creative Cloud a single point of view on packaging, monetization, and launches. The right candidate will be comfortable with ambiguity , energized by big cross-functional problems , and confident enough to build and defend a point of view . What You’ll Do Develop the Creative Cloud offering strategy: Use customer and market insights to define how plans are structured and priced across the portfolio, balancing customer value with business goals . Define and oversee a testing roadmap: Build

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Advanced Package/Product Integration Drive package product integration for next-generation advanced packaging technologies. Identify integration risks and implement corrective actions during development. Support design rule development and package architecture optimization. Hiring Need: Current workload exceeds available engineering bandwidth, increasing program delay and technical risk exposure. 2. Cross-Functional Technical Leadership Act as primary interface among product engineering, process engineering, manufacturing, suppliers, and customers. Drive alignment on technical decisions and risk mitigation plans. Lead failure analysis and corrective action activities. Hiring Need: Growing project complexity requires additional senior technical leadership to avoid bottlenecks and improve execution efficiency. 3. Customer Support and Technical Engagement Support customer technical reviews and package feasibility assessments. Provide technical recommendations for package implementation and risk reduction. Address customer escalations related to package performance and reliability. Hiring Need: Increased customer interaction volume requires dedicated engineering support to maintain responsiveness and customer satisfaction. 4. Reliability Improvement Drive root-cause investigations for package failures. Improve package yield, reliability, and manufacturing robustness. Develop long-term corrective and preventive actions. Hiring Nee

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Advanced Packaging Technology Development Manufacturing Development Engineering (MDE) Senior Manager , you will lead the MDE organization supporting DLT, MRDA, and WLT process development execution within APTD. The APTD MDE organization serves as the execution engine of technology development by enabling rapid learning cycles, maximizing development velocity, and providing scalable 24/7 execution support across advanced packaging technology development programs. In this role, you will provide organizational leadership, strategic direction, operational governance, and technical oversight to accelerate technology learning and ensure safe, predictable, and efficient development execution. You will establish and continuously improve the MDE operating model, workforce strategy, organizational capability, and execution systems required to support future technology roadmaps. In support of Micron's AI transformation strategy, this role is expected to champion AI-enabled ways of working, promote responsible adoption of AI and automation technologies, and build organizational capability in leveraging AI, data analytics, and digital solutions to improve decision quality, operational effectiveness, workforce productivity, and technology development execution. You will work closely with Technology Development, Manufacturing, Product Engineering, Equipment Development, Quality, and other cross-functional organizations to accelerate technology readiness and achieve business objectives.

Location: Hybrid - SF Employment: Full-time Develop and qualify Volantis’s testing procedures for custom lasers and scale for mass production. You will own development and implementation of testing and reliability procedures for our first- and second-generation custom laser designs, and their integration with the wafer-scale interposer. Responsibilities Partnering with the laser design team to define test plans, specifications and pass/fail criteria for new individually addressable VCSEL array designs. Characterizing prototype devices (LIV, spectral, far-field/beam profile, polarization, thermal and high-speed modulation) and delivering timely analysis that feeds back into design iterations. Managing test data, including databases, wafer maps, yield analysis and SPC, to track device performance and process variation in conjunction with the designers. Designing, building and maintaining wafer- and die-level prober systems, test fixtures and automated test software. Owning qualification and ramp-up of VCSEL array product testing systems, scaling from R&D characterization to high-volume production test. Working with the laser design, packaging and wafer-scale interposer teams to prove out reliability of the VCSEL itself and the overall system. Requirements Deep hands-on experience with semiconductor laser (preferably VCSEL) testing, characterization, validation, reliability and qualification. Experience designing prober systems, test fixtures and related software automation Proficiency with optical and electrical test equipment such as SMUs, optical spectrum analyzers, power meters, VNAs, and beam profilers Ability to work independently as well as in cross-functional teams including quality and packaging Nice to have Experience qualifying and using contract manufacturers for large volume production test of VCSELs Experience testing high-density VCSEL arrays, both top and bottom side emitting. High speed direct modulation laser diode test experience Understanding of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products. Position Overview: As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands-on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision-making. Responsibilities: Lead technical integration projects for new memory and advanced packaging technologies Design and complete experiments to assess process performance, variability, reliability, and yield Solve complex integration issues using data from

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented. Main Responsibilities: Conduct Electrical and PFA Characterization Perform electrical fault analysis to pin-point hot

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Work Flexibility: Onsite Schedule: Monday - Friday 5:00am-1:30pm, OT as needed Position Summary: The Production Tech I position is responsible for issuing materials to manufacturing orders; packaging operations including blister packaging, pouch sealing, cartooning and shrink wrapping; and making and checking labels, as well as operating digital scales and cleaning various components/products. This position could either focus in SJO, Biologics, Augment, or Xerogel operations. Essential Duties & Responsibilities Issues materials to manufacturing orders. Performs packaging operations (blister, pouch, carton, shrink wrap). Makes labels. Fills out routers correctly in Device History Record Management. Performs all preventive maintenance on time. Operating miele washer and cleaning components. Operate digital scales. Data entry - correctly entering required production data into systems for business purposes. Perform daily, weekly, monthly, quarterly, and annual cleanings as required. Participate in daily management activities. Maintains a dependable work schedule through regular attendance and punctuality. Demonstrates flexibil

The Executive Director, Product Management – Supply Chain Resiliency reports to the VP, Product Management and owns the full product development lifecycle and go-to-market execution for GHX's Supply Resiliency Platform — the cross-application layer spanning two use-case tracks: Procure-to-Pay (hospital) and Order-to-Cash (manufacturer/supplier) workflows. This is a build-and-commercialize role: the Executive Director owns the platform requirements, product launch, and forward-deployed pilot through general availability, driving pilot customer selection and execution, product requirements and roadmap, commercial packaging and pricing, and cross-functional GTM alignment across Engineering, forward-deployed teams, Sales, Marketing, Implementation, Professional Services, Customer Care and Finance. Areas of focus include, but are not solely limited to: pilot program design and stage-gate governance; product definition, roadmap execution, and technical alignment; commercial packaging, pricing, and profitability; competitive positioning; cross-functional consensus building; and executive/steering-committee reporting. WHY THIS ROLE MATTERS Healthcare supply chain resiliency is now a contested category: well-funded, AI-native challengers are selling point solutions directly to hospitals. This role is chartered to win that fight — turning GHX's two-sided network of 600+ connected providers and their suppliers into a resiliency platform that out-executes single-sided competitors on speed, breadth, and proven customer outcomes. The Executive Director owns that competitive outcome end to end, from platform definition through GA and beyond. KEY RESPONSIBILITIES Working with a broad group of stakeholders and partners — across GHX product pods, Forward-Deployed Engineering, current and prospective pilot customers, and the executive leadership team — the Executive Director develops and leads GHX Product Management execution for the Supply Res

Job Details: Job Description: Intel Foundry Automation - Back End Automation Group is seeking a talented student to support our Automation Integrators in advancing manufacturing automation systems. Key Responsibilities: • Assist Automation Integrators with troubleshooting, system upgrades, user training, and root cause analysis to improve efficiency and reduce waste. • Enable Automation Integrators in designing, developing, testing, and debugging software for factory operations, wafer processing, and packaging across multiple software layers. • Support client-based Station Controller systems through validation, troubleshooting, and quality control. Collaborate with global cross-functional teams to drive automation projects and integrate machine learning and AI solutions as needed. Qualifications: Candidates must be currently pursuing a bachelor's degree in computer science, Data Science, Computer Engineering, or a related discipline. They should possess strong analytical, problem-solving, and communication skills, along with hands-on programming experience in languages such as Python, C, and C#. Knowledge of Agile software development methodologies and experience with manufacturing systems are highly desirable. Job Type: Student / Intern Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Malaysia, Kulim Posti

Product Manager Enterprise Integrations Description - Role Summary We are looking for a Principal Product Manager to lead the evolution of HP’s Enterprise Integration strategy—from fragmented, point-to-point integrations to a scalable, productized API ecosystem. This role will define and drive a shift toward API-as-a-product, enabling reusable business capabilities, accelerating developer productivity, and laying the foundation for an AI-first, composable enterprise. You will play a pivotal role in transforming our integration landscape into a unified Integration Fabric, and ultimately an Intelligence Fabric that powers next-generation digital and AI-driven experiences. What You’ll Own API Productization Strategy Transform APIs from point solutions into reusable, discoverable product offerings Define capability-based packaging aligned to business domains (B2C, B2B, Partner ecosystems) Drive standardization across design, classification, and maturity frameworks Enterprise Integration Fabric Define integration patterns that unify platform, SaaS, and custom-built APIs Establish a holistic, cross-application view of enterprise APIs Reduce point-to-point integrations through reusable architecture patterns and services Data + API Convergence Partner with Data teams to define and expose data products via APIs Enable consistent access to enterprise data through standardized interfaces Align API strategy with enterprise data governance and cataloging AI-First APIs & Developer Experience Define APIs optimized for AI agents, automation, and developer productivity Build APIs that are discoverable, composable, and machine-consumable Enable next-gen use cases including agent or

Work Flexibility: Onsite Schedule: Monday - Friday 5:00am-1:30pm, OT as neede Position Summary: The Production Tech I position is responsible for issuing materials to manufacturing orders; packaging operations including blister packaging, pouch sealing, cartooning and shrink wrapping; and making and checking labels, as well as operating digital scales and cleaning various components/products. This position could either focus in SJO, Biologics, Augment, or Xerogel operations. Essential Duties & Responsibilities Issues materials to manufacturing orders. Performs packaging operations (blister, pouch, carton, shrink wrap). Makes labels. Fills out routers correctly in Device History Record Management. Performs all preventive maintenance on time. Operating miele washer and cleaning components. Operate digital scales. Data entry - correctly entering required production data into systems for business purposes. Perform daily, weekly, monthly, quarterly, and annual cleanings as required. Participate in daily management activities. Maintains a dependable work schedule through regular attendance and punctuality. Demonstrates flexibility by

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma