Packaging Engineer Jobs

We’re looking for a Software Engineer 3 to help bring Voyage’s embedding models - used for semantic search, retrieval, and AI-native experiences; to the platforms and environments where customers already run their workloads, beyond first-party MongoDB Atlas. You’ll join the broader Search and AI Platform organization and collaborate closely with the engineers building Voyage’s first-party inference. Together, we’re extending that platform across cloud marketplaces, third-party inference providers, and self-managed deployments so customers get the same Voyage models, behaving consistently, wherever they choose to run them. As a Software Engineer 3, you'll focus on building the systems, tooling, and deployment workflows that power third-party model delivery. You'll own key components of how Voyage models are packaged, validated, and deployed, work across teams to ensure tight integration with the core inference platform, and contribute to delivery surfaces designed for reliability, observability, and ease of use. We are looking to speak to candidates who are based in Sydney for our hybrid working model. What you'll do Port and tune the model server that runs Voyage embedding and reranking models: improving inference performance, consistency, and runtime behavior across environments Productionize new Voyage models for delivery beyond first-party Atlas, owning the packaging, configuration, and deployment workflows that get them running on AWS, Azure, GCP and more Design correctness, correlation, and performance validation that proves third-party deployments match first-party behavior Build operability into every surface: structured logging, metrics, diagnostics, and health checks with tools like Prometheus and OpenTelemetry Debug problems that span model servers, containers, deployment configuration, and partner cloud environments Work alongside Voyage's model-serving teams, and partner with GTM, SAs, TSEs, and strategic customers on the hardest external deployments Who

About Anthropic Anthropic’s mission is to create reliable, interpretable, and steerable AI systems. We want AI to be safe and beneficial for our users and for society as a whole. Our team is a quickly growing group of committed researchers, engineers, policy experts, and business leaders working together to build beneficial AI systems. About the role Anthropic runs some of the largest AI training and inference workloads in the world, across multiple hardware platforms. We work from the chip level up with our silicon partners, and we are now deepening that investment by building a custom silicon team. You will be one of a small number of people covering a large surface. We are opening searches across the key domains below, and we are interested in candidates whose center of gravity sits in any of them: Front-end design Pre-silicon verification Physical design Design for test Analog and mixed-signal Technology and foundry CAD and design infrastructure Packaging, signal integrity, and power integrity This is a role for someone who has shipped silicon, has a realistic relationship with schedules, and is comfortable making consequential calls without a large organization behind them. Key responsibilities Take part in end to end activities for the program: strategy, specification, execution and the technical bar. Write the specifications and interface definitions that others design against and keep them coherent as the architecture converges Make and own directional calls: technology and IP selection, where we build versus buy versus license, and where we take design authority versus rely on partners Build and share AI-assisted approaches to the code-like parts of your domain, and help the team learn what Claude can genuinely accelerate Contribute to the architecture and micro-architecture discussion from your domain's perspective, including the tradeoffs your area imposes on the rest of the chip Partner with Anthropic's inference, performance, kernels, and infrastr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Realtime Defect Analysis (RDA) Technology Development Engineer in APTD, you will learn how to use pioneering defect detection equipment and processes to solve issues and drive improvement. The goal of this position is to accelerate cycles of learning and technology transfer in Technology Development (TD). We're seeking an engineer who is passionate about creative problem solving and finding innovative solutions. This position will provide the opportunity for you to collaborate with engineers in process integration, process development, data science, and yield analysis within and outside of TD. Your ideas will impact the team globally! We need someone who will investigate process anomalies through root-cause analysis, data manipulation, and correlations. You will be expected to support experimentation, data analysis, baseline health metrics, and systema

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our Technology Development team sits at the center of innovation. We build advanced modeling and AI solutions that shape how memory and storage technologies are designed, built, and scaled. Working at the intersection of physics, data, and engineering, we turn complex problems into practical breakthroughs that matter! This role is critical to how we accelerate semiconductor technology development using advanced AI and physics-based modeling. You will lead the design and deployment of agentic and LLM-powered solutions that directly influence process technology, packaging, and early manufacturing decisions. If you enjoy driving hard problems end to end and collaborating across hardware and software teams, this role offers real impact and visibility. Note: We are hiring for more than one role spanning Senior/Staff/Principal/Technical Staff Engineer. Responsibilities: Design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows Architect agentic AI systems that integrate with modeling tools, design automation environments, and fab/test platforms to enable digital twin development Define and promote best known methods for deploying LLMs and agentic systems reliably in production environments Evaluate and improve model performance using methods such as structured benchmarking, prompt tuning, RLHF, and feedback loops Translate modeling results into clear insights through data storytelling and visualiza

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our Technology Development team sits at the center of innovation. We build advanced modeling and AI solutions that shape how memory and storage technologies are designed, built, and scaled. Working at the intersection of physics, data, and engineering, we turn complex problems into practical breakthroughs that matter! This role is critical to how we accelerate semiconductor technology development using advanced AI and physics-based modeling. You will lead the design and deployment of agentic and LLM-powered solutions that directly influence process technology, packaging, and early manufacturing decisions. If you enjoy driving hard problems end to end and collaborating across hardware and software teams, this role offers real impact and visibility. Note: We are hiring for more than one role spanning Senior/Staff/Principal/Technical Staff Engineer. Responsibilities: Design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows Architect agentic AI systems that integrate with modeling tools, design automation environments, and fab/test platforms to enable digital twin development Define and promote best known methods for deploying LLMs and agentic systems reliably in production environments Evaluate and improve model performance using methods such as structured benchmarking, prompt tuning, RLHF, and feedback loops Translate modeling results into clear insights through data storytelling and visualiza

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Who Are We? Postman is the world’s leading API platform, used by more than 45 million+ developers and 500,000 organizations, including 98% of the Fortune 500. Postman is helping developers and professionals across the globe build the API-first world by simplifying each step of the API lifecycle and streamlining collaboration—enabling users to create better APIs, faster. The company is headquartered in San Francisco and has offices in Boston, New York, Austin, Tokyo, London, and Bangalore - where Postman was founded. Postman is privately held, with funding from Battery Ventures, BOND, Coatue, CRV, Insight Partners, and Nexus Venture Partners. Learn more at postman.com or connect with Postman on X via @getpostman. P.S: We highly recommend reading The "API-First World" graphic novel to understand the bigger picture and our vision at Postman. The Opportunity The mission of the Monetization team is to establish our product-led packaging, subscription model, and billing and scale them as we expand and grow our business. Our team is responsible for building robust Billing systems, focusing on payments, renewals, sales tax, and revenue. We also work closely with all the teams to integrate their products with our packaging model thus offering our customers the best features, pricing, and services through self-serve purchases and our Sales channels. We’re looking for an experienced Senior Engineer who will lead our initiatives for a powerful config-driven platform, improving customer purchase experience and working on the internal tools to match the scale of the growth of Postman. What You'll Do Work on our core Monetization platform to improve offer management, including packaging, plans and pricing, which support the pre-purchase workflow and on our Billing platform to improve data capture for revenue recognition and ARR reporting. Lead the active development of our internal services to introduce new frameworks, optimize the APIs, and improve scale and reliability. Contribu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: Introduction As a Principal Engineer in the Advanced Package Technology Development team at Micron, you will join a dynamic group focused on innovation and collaboration. This role lets you influence solutions that align with company goals. It contributes to increased revenue and strategic successes. You will work at our Boise campus and help develop leading technology in the industry. Responsibilities and Duties include, but not limited to: Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure seamless technology integration. Consult and influence technical and strategic decisions at senior management levels. Lead multi-disciplinary technical teams and task forces to achieve strategic goals. Maintain effective communication with collaborators. Analyze and understand competitive trends to improve Micron’s competitive edge. Participate actively in technology events, contributing to industry knowledge. Guide the development of packaging technology roadmaps. Assess competitive metrics through data intelligence for strategic adv

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Requirements: 3+ years embedded firmware development experience with C / C++, Linux / Unix platform; Experience with ARM processors, embedded Linux; Experience working with H.265; Experience with Git, including merging and rebasing; Basic understanding of electronic circuits; Experience in embedded Linux systems (cross-build, flash, boot, system initialization, rootfs packaging, fault-tolerance, IPC, work with embedded filesystems), embedded distributions (Yocto,buildroot,OpenWRT); Good written and verbal English communication skills; Candidate needs to be in Kyiv (or consider relocation). Hybrid type of work. Will be a plus: Knowledge of Linux kernel; Experience with any SoC, preferrably multimedia-targeted; Video processing, streaming, encoding/decoding; Experience working with OpenCV; Image processing, tuning, enhancement; OOP/OOD, strong programming experience with C/C++; BS degree in Computer Science, or related engineering degree. Tools: ANSI C, Git, Linux kernel, embedded development tools (toolchain, OpenWRT, SW/HW debuggers, scripting). What do we offer: International work environment and work with global development teams; Excellent work conditions in an A-Class office (Horizon Park Business Center); Compensation package matching global standards; Flexible work hours (as required); Paid parki

ABOUT BASETEN Baseten powers mission-critical inference for the world's most dynamic AI companies, like Cursor, Notion, OpenEvidence, Abridge, Clay, Gamma, and Writer. By uniting applied AI research, flexible infrastructure, and seamless developer tooling, we enable companies operating at the frontier of AI to bring cutting-edge models into production. We're growing quickly and recently raised our $1.5B Series F , led by Altimeter Capital, Conviction Partners, and Spark Capital. Join us and help build the platform engineers turn to ship AI products. THE ROLE As a Software Engineer at Baseten, you will own one of the most critical surfaces of our business: pricing, billing, and revenue infrastructure. As we launch more and more products— billing is no longer just operational plumbing. It is a strategic lever for growth. This role will establish clear ownership of billing as a function and create leverage for Finance, Sales, and GTM teams while maintaining a seamless customer experience. RESPONSIBILITIES Own Baseten’s end-to-end billing and revenue infrastructure, including pricing, invoicing, metering, and reporting foundations. Build and evolve our billing platform and integrations (including Orb), ensuring correctness, auditability, and a high-trust experience for customers and internal teams. Partner closely with Finance, Sales, GTM, and Forward Deployed Engineering to turn real-world workflows into reliable internal tooling and automation (quoting, approvals, renewals, usage reconciliation, revenue reporting). Design systems that scale with new products, packaging, and go-to-market motions, making billing a strategic lever for growth. Drive reliability and operational excellence for revenue-critical workflows: monitoring, alerting, incident response, backfills, and clear runbooks. Lead from the front on high-impact projects: clarify requirements, propose crisp technical approaches, ship iteratively, and raise the bar on quality and velocity. Debug and resolve pro

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in APTD Micron you will be responsible for leading and managing the activities and operation of Advanced Package Development by collaborating with internal and external stakeholders to build and execute technology development strategies aligned to organizational and business objectives by providing high performing and cost effective packaging solution on time with best predictable reliability performance. You will need to comprehend package technology development business process (MOR development) and TECHNODE business process for packaging technology and ensure all package development and product transfer work are carried out in accordance with these business processes. Other responsibilities include ensuring organizational compliance to company policies and regulations, as well as to departmental procedures, and providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects, as well as mentoring other functional leaders through collaboration and the development of sustainably successful solutions. Responsibilities and Duties include, but not limited to: Develop and Communicate Technology Development Strategy Develop and communicate Technology Development strategic objectives Understand the impact and implica

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is hiring an experienced MTS - Thermal Simulation Engineer! You would provide technical leadership in advanced thermal and thermo-mechanical modeling for next-generation High Bandwidth Memory (HBM) products. This role will define simulation strategy, solve complex thermal challenges across 2.5D/3D semiconductor packaging systems, drive physics-based model development and silicon correlation, and influence product, package, material, and process decisions across teams . Key Responsibilities Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration. Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions. Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures. Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior. Assess material prop