Packaging Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in APTD Micron you will be responsible for leading and managing the activities and operation of Advanced Package Development by collaborating with internal and external stakeholders to build and execute technology development strategies aligned to organizational and business objectives by providing high performing and cost effective packaging solution on time with best predictable reliability performance. You will need to comprehend package technology development business process (MOR development) and TECHNODE business process for packaging technology and ensure all package development and product transfer work are carried out in accordance with these business processes. Other responsibilities include ensuring organizational compliance to company policies and regulations, as well as to departmental procedures, and providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects, as well as mentoring other functional leaders through collaboration and the development of sustainably successful solutions. Responsibilities and Duties include, but not limited to: Develop and Communicate Technology Development Strategy Develop and communicate Technology Development strategic objectives Understand the impact and implica

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is hiring an experienced MTS - Thermal Simulation Engineer! You would provide technical leadership in advanced thermal and thermo-mechanical modeling for next-generation High Bandwidth Memory (HBM) products. This role will define simulation strategy, solve complex thermal challenges across 2.5D/3D semiconductor packaging systems, drive physics-based model development and silicon correlation, and influence product, package, material, and process decisions across teams . Key Responsibilities Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration. Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions. Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures. Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior. Assess material prop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is seeking an experienced MTS - HBM Thermal Integration Engineer to drive thermal performance optimization for next-generation High Bandwidth Memory products. This role sits at the intersection of thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration. Key Responsibilities Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE) to accelerate technology understanding Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance. Work closely with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges and enable product improvements. Identify and implement opportunities to reduce thermal resistance, improve thermal consistency, and enhance product performance. Drive cross-functional technical investigations and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Introduction: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you eager to be a pioneer in AI and semiconductor breakthroughs? At Micron, we invite a passionate Staff Engineer, Collateral Integration Engineer to join our upbeat group. This opportunity offers the chance to work on innovative technology within a team-orie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Material Characterization & Analysis Perform material characterization using DSC, TGA, DMA, TMA, Rheometer, Contact Angle, Density, and other analytical techniques. Evaluate critical material properties including Tg, CTE, viscosity, modulus, cure behavior, filler content, thermal stability, and wettability. Analyze material behavior and establish correlations between material properties and manufacturing performance. Support incoming material evaluation, qualification, and supplier material assessments. Testing Method Development Develop, optimize, and standardize material characterization methods and testing procedures. Establish SOPs, OCAPs, SPC baselines, and MSA plans for laboratory operations. Develop new characterization capabilities for molding compounds, NCF, dicing tapes, liquid EMC, adhesives, and other packaging materials. Execute method validation, correlation studies, and cross-site benchmarking activities. Supplier Quality & Material Investigation Lead supplier material investigations for excursions, abnormal trends, and quality concerns. Conduct root cause analysis and drive corrective and preventive actions with suppliers. Support supplier audits, change management reviews, and material control plan optimization. Establish critical-to-quality (CTQ) monitoring strategies and strengthen supplier process control systems. Failure Analysis &

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary We are seeking a highly motivated Failure Analysis Engineer to join our Product Failure Analysis (PFA) Laboratory. The successful candidate will be responsible for conducting failure analysis, root cause investigations, and advanced package characterization to support product development and yield improvement. This role requires strong analytical skills, hands-on laboratory experience, and the ability to collaborate with cross-functional teams in a fast-paced semiconductor environment. Qualifications Education Bachelor's or Master's degree in: Materials Science & Engineering Electrical Engineering Electronics Engineering Mechanical Engineering Chemical Engineering Physics, Chemistry, or related technical disciplines Experience in one or more of the following areas is preferred: Wafer Fabrication Assembly and Packaging Product Engineering Yield Enhancement Failure Analysis Laboratory Advanced Packaging Technologies Responsibilities Perform electrical and physical failure analysis of semiconductor devices and packages. Conduct root cause investigations and provide technical recommendations. Develop and execute analytical plans to support engineering requests. Interpret analytical results and communicate findings effectively. Collaborate with Process, Product, Quality, Reliability, and Manufacturi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve equipment condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify equipment management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leverage AI-enabled tools and data-driven insights to improve operational efficiency, accelerate problem-solving, and support continuous improvement initiatives. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​ • Preferred to have over 3-year of working experiences in production line.​ • Must have process maintain experience.​ • Bachelor degree or

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department MSB Process Integration Engineering Project Title Semiconductor Manufacturing Reject Reduction Through Process Variability Analytics Project Description The intern will participate in a structured project focused on improving semiconductor manufacturing reject rates through process variability reduction. The project will provide practical exposure to semiconductor packaging, Assembly and Test processes, and manufacturing data analytics. Under appropriate guidance, the intern will analyze inline signals, process parameters, and test results to identify patterns and potential contributors to process variability and yield loss. The intern will also explore the responsible application of Artificial Intelligence and AI-Enabled analytical tools to improve the efficiency, quality, and effectiveness of project analysis. Objective of the Project The project aims to: Identify potential sources of process variability and yield loss. Improve the analysis of inline signals, process data, and test results. Determine relationships between process conditions and manufacturing rejects. Develop data-driven re

Abbott is a global healthcare leader that helps people live more fully at all stages of life. Our portfolio of life-changing technologies spans the spectrum of healthcare, with leading businesses and products in diagnostics, medical devices, nutritionals and branded generic medicines. Our 122,000 colleagues serve people in more than 160 countries. JOB DESCRIPTION: Position Overview The AI Platform Engineer builds and operates the machine learning and generative AI platform used by teams across Abbott Cancer Diagnostics. You'll own the full model lifecycle in production — data and feature pipelines, training and experimentation, evaluation and promotion, serving, and monitoring — along with the platform services, compute and tooling underneath it. This is hands-on infrastructure work backed by solid platform engineering practice: making inference fast and cheap, making the path from experiment to production repeatable and auditable, and shipping interfaces other engineers can build on — in support of software that ultimately reaches patients. Essential Duties Include, but are not limited to, the following: Build and maintain data, feature, and training pipelines for ML and LLM workloads — ingestion, transformation, fine-tuning, distributed training, and reproducible experiment execution with lineage tracked from dataset and code to resulting model. Implement automated evaluation and promotion gates — performance benchmarks, regression checks, and validation criteria that determine whether a model advances toward production. Automate the model lifecycle end to end through CI/CD and GitOps: packaging, promotion across environments, progressive rollout, and rollback. Build and operate production model-serving infrastructure for LLMs and predictive models, including inference optimization, autoscaling,

About Supabase Supabase is the Postgres development platform, built by developers for developers. We provide a complete backend solution including Database, Auth, Storage, Edge Functions, Realtime, and Vector Search. All services are deeply integrated and designed for growth. About the Role We're looking for a Postgres Deployment Engineer to join our team and elevate our PostgreSQL offerings. You'll work hand-in-hand with the PostgreSQL team and play an instrumental role in technical decision-making and refining internal methodologies. The focus of this role is around owning stability and deployment of our products. This role involves ongoing contribution and co-responsibility for builds/deployments via our public supabase/postgres GitHub repository. This repository bundles an array of features/products into docker images and AWS AMIs, giving users the ability to run Supabase on our cloud and locally. This role will function has developed as a bridge between product and infrastructure teams to improve the reliability of product deployments and upgrades. In this role, your primary responsibilities will include: Packaging software into our supabase/postgres repo to using either nix language with flakes, or debian packaging depending on our required target Supporting the expansion of knowledge in Supabase toward our platform release system so that developers can self service more and more over time. Expanding on our github actions, our team tooling, and our testing/release approaches Timely PostgreSQL major, minor, and extension upgrades. Engaging in proactive identification and resolution of production issues in customer deployments. Contributing to the creation/maintaining of best practices, tools, and tests to ensure enhanced stability and decreased deployment risks over time. What we need This role demands the following pivotal qualities: PostgreSQL Expert : A profound understanding of PostgreSQL and its associated tools. Familiarity with extensions, performance op

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Design Engineer, you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products . You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates , supporting both silicon release and ongoing product lifecycle needs. This role requires strong technical execution and the ability to independently drive complex issues to closure. Responsibilities Design Support: Work on HBM product design and support sustaining design maintenance (ECOs/spec changes). Silicon Debug: Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. Cross-Functional Collaboration: Work closely with DE, PE, TD, and system teams

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Advanced Packaging Technology Development Manufacturing Development Engineering (MDE) Senior Manager , you will lead the MDE organization supporting DLT, MRDA, and WLT process development execution within APTD. The APTD MDE organization serves as the execution engine of technology development by enabling rapid learning cycles, maximizing development velocity, and providing scalable 24/7 execution support across advanced packaging technology development programs. In this role, you will provide organizational leadership, strategic direction, operational governance, and technical oversight to accelerate technology learning and ensure safe, predictable, and efficient development execution. You will establish and continuously improve the MDE operating model, workforce strategy, organizational capability, and execution systems required to support future technology roadmaps. In support of Micron's AI transformation strategy, this role is expected to champion AI-enabled ways of working, promote responsible adoption of AI and automation technologies, and build organizational capability in leveraging AI, data analytics, and digital solutions to improve decision quality, operational effectiveness, workforce productivity, and technology development execution. You will work closely with Technology Development, Manufacturing, Product Engineering, Equipment Development, Quality, and other cross-functional organizations to accelerate technology readiness and achieve business objectives.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community. We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Develo

Job Details: Job Description: Intel Foundry Automation - Back End Automation Group is seeking a talented student to support our Automation Integrators in advancing manufacturing automation systems. Key Responsibilities: • Assist Automation Integrators with troubleshooting, system upgrades, user training, and root cause analysis to improve efficiency and reduce waste. • Enable Automation Integrators in designing, developing, testing, and debugging software for factory operations, wafer processing, and packaging across multiple software layers. • Support client-based Station Controller systems through validation, troubleshooting, and quality control. Collaborate with global cross-functional teams to drive automation projects and integrate machine learning and AI solutions as needed. Qualifications: Candidates must be currently pursuing a bachelor's degree in computer science, Data Science, Computer Engineering, or a related discipline. They should possess strong analytical, problem-solving, and communication skills, along with hands-on programming experience in languages such as Python, C, and C#. Knowledge of Agile software development methodologies and experience with manufacturing systems are highly desirable. Job Type: Student / Intern Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Malaysia, Kulim Posti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement