Pi Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets . Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity. Own and advance product integration programs and loop‑level domain expertise , maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration , including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp. Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and leveraging network BKMs, and scaling proven solutions across sites. Identify efficiency and perfo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance. Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach. Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary. Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals. Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles. Travel to Micron Fab locations as necessary for face-to-face work. About Micron Technology, Inc. We are an industry leader in innovative memory

Who we are Lab37 Robotics , is a technology company focused on the development and deployment of robots designed specifically for direct-to-customer food production. Our mission is to revolutionize the food industry by creating innovative robotic solutions that enhance efficiency, quality, and customer satisfaction. We are passionate about pushing the boundaries of technology to deliver cutting-edge products that meet the evolving needs of our clients. What you’ll do As a Hardware Test Engineer at Lab37 Robotics, you will design, execute, and automate tests that prove out our system per NSF requirements and are reliable, and durable in real kitchens. You’ll translate food safety standard and operational best practices into clear test requirements, build fixtures and rigs (often with Raspberry Pi/Arduino or similar), and instrument systems with temperature, humidity, and other environmental sensors. Your work will uncover failure modes, validate component lifecycles, and drive design improvements that elevate product quality and guest experience. Responsibilities Convert food safety and regulatory requirements into testable specifications, acceptance criteria, and traceable test plans/protocols. Design and build test fixtures/rigs using Raspberry Pi/Arduino (or similar) for sensor logging, control, and automation. Execute environmental, thermal, humidity, ingress, cleaning/chemical exposure, wear/abrasion, and lifecycle/MTBF tests; analyze results and document findings. Develop automated data-logging and reporting for temperature/humidity profiles, duty cycles, etc. Run component and subsystem endurance testing (motors, augers, valves, seals, electronics) to characterize failure modes and recommend design or supplier changes. Partner with engineering and supply chain to resolve issues and conduct root-cause analysis. Maintain lab safety, calibration, and test asset management; publish test reports. What we’re looking for 3+ years in hardware/product val

Everpure (NYSE: P) has evolved from storage pioneer to data platform, closing fiscal 2026 with $3.7 billion in revenue, its first billion-dollar quarter, and accelerating growth into FY27. Our strategic agenda spans the companies defining the next era of technology - hyperscalers, AI labs, the AI hardware supply chain, data platform providers, and the broader AI ecosystem. This type of work—work that changes the world—is what the tech industry was founded on. So, if you're ready to seize the endless opportunities and leave your mark, come join us. THE ROLE We are seeking a highly motivated Hardware Signal Integrity (SI) Engineer for Everpure’s Datastore team. In this role, you will own high-speed signal integrity analysis, simulation, and measurement for enterprise SSD platforms. WHAT YOU'LL DO Own signal integrity analysis for SSD hardware from architecture through production. Drive board-level SI decisions, including: PCB material selection, via structures, loss tradeoffs, stackup definition and channel optimization. Perform SI simulations including: Insertion loss (IL), return loss (RL), crosstalk, TDR / impedance profiles. Lead TDR and S-parameter measurements, including: measurement setup, Calibration and de-embedding. Perform 3D-EM extraction and simulation for vias, connectors, and complex channel structures. Correlate simulation results with lab measurements to refine models and design assumptions. Use and customize IBIS and IBIS-AMI models for PCIe, NAND and DDR channel analysis. High speed signal eye diagram and margin analysis. Support debug activities where SI is a contributing factor. Perform Power Integrity (PI) simulations. Collaborate cross-functionally with PCB design, system, firmware, mechanical, and test teams to ensure robust SI solutions. Document SI design guidelines and best practices to enable scalable, repeatable designs. Provide technical leadership and mentorship to junior engineers. We are primarily an in-office environment and therefore

Senior Java Software Engineer – Developer Company: The Boeing Company The Boeing Company is looking for a Senior Java Software Engineer – Developer to join the Advanced Ground Architecture team located in Herndon, Virginia, Seal Beach, California, El Segundo, California or Colorado Springs, Colorado . This position will focus on supporting the Boeing Defense, Space & Security (BDS) Software Engineering organization. The Advanced Ground Architecture (AGA) software team is dynamic group of software engineers creating the future of Ground support with the extensibility and adaptability to be used across ALL Boeing programs. The software team is executing this vision through modern software technologies (Java, ReactJS, python, CI/CD pipelines) and methodologies (Scaled Agile). AGA is looking for self-motivated high performers to lead and execute the large scope of Java development needed for the program's vision. The ideal candidates will provide software engineering functions for the design, development, and maintenance of complex, multi-tiered application software systems used to support the command and control of space vehicles. The software engineers will work day-to-day with system and test engineers to implement, test, and document new features and improvements for both web services and applications supporting distributed computing solutions. Position Responsibilities: Develops software in conjunction with agile team leadership including participation at agile events Assists in the execution of DevSecOps processes to deliver software baseline on sprint boundaries. Participates in PI planning as an agile team member Engages with users and other engineers

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The SSD Hardware Engineering team develops next-generation storage solutions that power data centers, AI infrastructure, client computing, and intelligent edge applications. Working across hardware, firmware, validation, manufacturing, and system engineering fields, the team delivers high-performance, reliable SSD products while using advanced design methodologies, automation, and AI-enabled engineering tools. As an SSD Hardware Engineering Intern, you will support the design, validation, characterization, and debug of next-generation SSD products. You will gain hands-on experience with high-speed hardware design, PCB development, signal integrity, power integrity, board bring-up, and hardware validation while collaborating with multi-functional engineering teams to solve complex technical challenges and deliver industry-leading storage solutions. Responsibilities Support the design, validation, characterization, and debug of SSD hardware platforms and subsystems. Assist with schematic reviews, PCB design activities, board bring-up, electrical measurements, and laboratory-based hardware testing. Perform data collection, analysis, and documentation of validation results to support product quality and performance objectives. Support signal integrity (SI), power integrity (PI), and system-level analysis through simulation, measurement, and correlation activities. Develop automation tools, scripts, dashboards, and AI-assisted workflows that improve engineering productivity, validation efficien

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s vision is to transfer how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a process integration and device engineer Intern at Micron Technology, Inc., you will have opportunities to work with an industry leading team on cutting edge technologies to enable next generation DRAM in the manufacturing Fab, ramp up production yield and deliver high quality DRAM products to customers. You will be offered hands-on experience in semiconductor process integration, electrical data analysis, with exposure to advanced technology development, yield improvement, and cross-functional collaboration. Responsibilities Support integration of process modules across various DRAM module loops. Analyze electrical and inline data to identify yield detractors and process anomalies. Collaborate with cross-functional teams (YE, Device, PI, process et al) to drive continuous improvement. Document findings and present updates to engineering and leadership teams. Leveraging AI tool to improve problem solving efficiency and productivity Requirements: Strong knowledge of semiconductor devices is required. Advanced CMOS or capacitor knowledge is preferred. Basic Knowledge of mainstream memory such as DRAM, NAND, NOR et al. Knowledge of sta

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our EDA and Design Enablement team sits at the heart of Micron’s memory development. We build and support the tools and flows that enable world-class CMOS design at scale. We work closely with design, layout, and process teams, and we thrive on solving hard technical problems that directly impact product success. As a CAD Engineer, you will play a critical role in keeping our AI enabled design ecosystem running efficiently and reliably. You’ll develop, improve, and support both in-house and commercial EDA tools while partnering closely with engineers across the design flow. This is a hands-on role for someone who enjoys debugging, innovating, and enabling others to do their best work. Responsibilities: Design, develop, and support AI assisted CAD software, EDA tools, flows, and methodologies for CMOS design and verification Debug, evaluate, and support in-house and commercial AI enabled EDA solutions in a production environment Develop P-cells, scripts, and automation for physical design, verification, optimization, and tapeout Collaborate closely with design, PI, and process teams to solve workflow and tool challenges, and to implement scalable layout methodologies aligned with PDK requirements Document processes and provide training and support for end users Minimum Qualifications: Bachelor’s degree in Computer Engineering, Computer Science, or a related field 2+ years of experi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Key Responsibilities: Lead first‑silicon bring‑up, board validation, and early silicon debug. Develop and complete detailed electrical characterization plans covering DC, AC, parametric, and functional measurements. Characterize high‑speed interfaces such as DDR/LPDDR, SerDes, MIPI, UFS, or custom Micron PHYs. Perform post‑silicon electrical characterization of ASIC/SoC/Memory products across process, voltage, and temperature (PVT) corners. Conduct lab measurements using equipment such as Oscilloscopes, BERTs, VNAs, Spectrum analyzers, Waveform generators, and support tools. Involve in Board design activities with team to gather and place custom requirements as per Chaz. Perform signal integrity (SI), power integrity (PI), Jitter, Eye‑diagram, and compliance testing. Debug silicon issues related to timing, noise, stability, margin loss, and functional failures. Analyze failures and recommend design, firmware, or test fixes. Develop Python/MATLAB-based automation for measurements, data collection, and analysis. Process large volumes of lab and silicon data to extract trends, margins, and correlations. Generate concise characterization reports with clear conclusions and recommendations. Work closely with design, pre‑silicon verification, product engineering, firmware, test, and systems teams. Correlate post‑silicon results with simulation and pre‑silicon expectations to identify root cau

About Us: Paytm is India's leading mobile payments and financial services distribution company. Pioneer of the mobile QR payments revolution in India, Paytm builds technologies that help small businesses with payments and commerce. Paytm's mission is to serve half a billion Indians and bring them to the mainstream economy with the help of technology. About the team: Pi Agents At Pi Agents, we are creating AI agents for businesses. We are building agents that help businesses of all sizes with their day to day challenges, across the full lifecycle: Acquiring, Servicing, Retaining, Upselling, and Supporting customers. We operate like a startup inside Paytm, shipping fast with a small, senior team. About the role: This role is for the SMB Growth Agents. You will own product outcomes for growth-focused agents serving small and medium Indian businesses, taking them from capability to measurable business impact at scale. Expectations/Requirements: 1. Own the SMB Growth Agents roadmap end to end, from problem discovery to GTM and adoption. 2. Define and own outcome metrics: merchant activation, campaign performance, incremental revenue, retention. 3. Design agent experiences that self-serve SMB merchants can trust and use daily: onboarding, goal setting, autonomous execution, and clear reporting. 4. Set and enforce a very high bar for UX and UI. 5. SMB users have low tolerance for friction; the agent experience must be simple, vernacular-friendly, and mobile-first. 6. Work with engineering and data science on agent architecture tradeoffs: latency, cost per merchant, guardrails, evals. 7. Run structured experimentation to prove agent-driven lift over merchant self-managed baselines. Partner with sales, ops, and support to scale from pilot cohorts to the long tail Superpowers/Skills that will help you succeed in this role: 1. 5-9 yrs of Product Management experience, Tier-1 institute preferred. 2. Strong B2C product experience; experience dealing with small to m

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities and Tasks • Collaborate with multi-functional network teams from PIE, Process & Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop. • May require travel to global Micron sites to foster collaboration and drive execution. • Communicate module related issues to the Fab engineering and leadership teams. • Design, execute, and analyze experiments to improve fab process, yield, and quality. • Collect and interpret complex data to optimize Fab processes and increase yields. • Engage and/or lead cross-area engineering teams to tackle process issues. • Work closely with global partners to stay ahead of on module related topics and process alignment projects. • Collaborate with other PI module owners and sister fabs to drive business process alignment • Partner with IE, Process and Equipment Engineering and Production to better forecast and balance yield, output and process issues • Promote network synergy through improved benchmarking and standardization of known engineering best-known methods (BKMs), business process. Requirements: • Bachelor’s or advanced degree in Engineering or Science is required • Strong a

Zoox is looking for a Senior Signal Integrity and EMC Engineer to ensure the electrical reliability, signal fidelity, and compliance of our complex autonomous vehicle systems. In this role, you will own the end-to-end strategy for vehicle-level signal integrity, RF/wireless performance, and EMC. You will work within a multi-disciplinary engineering team to set rigorous requirements and ensure best practices are implemented from concept to production. You will serve as the domain expert on a variety of high-speed digital and RF design topics that bring our hardware to life safely and reliably. In this role, you will: Lead the development, implementation, and validation of vehicle-level signal integrity, grounding, and shielding strategies. Maintain rigorous technical requirements and EMC specifications applied across all electrical and electronic systems on all vehicle platforms. Define and maintain vehicle-level RF performance requirements, establishing specifications for all transmitters, receivers, and antenna systems to mitigate the electromagnetic impacts of physical vehicle installation on wireless communication. Perform and/or oversee signal integrity and power integrity (SI/PI) simulations and analysis for critical high-speed interfaces and power distribution networks. Simulate RF performance of all antennas, transmitters, and receivers as installed in a vehicle during the vehicle design phase to drive integration alignment. Collaborate with cross-functional design teams to ensure best practices for signal integrity, RF design, and EMC are implemented. Lead design reviews to identify and remediate vulnerabilities early to meet project milestones. Develop and execute validation plans for vehicle-level signal integrity, RF/wireless performance, and EMC, including radiated and conducted emissions/immunity. Troubleshoot and resolve complex signal integrity, RF, and EMC issues discovered during design, validation, and

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m