System Design And Integration Engineer Jobs

We’re looking for power integrity engineers to ensure that power is delivered and stable at all levels: rack/tray, package, die, core. Ideal Background: Experience with large die, high TDP chip PDN analysis and design Experience with advanced node (7nm and lower) chip PDN analysis and design Ability to work with package architects to determine best passives design within a given set of constraints Ability to work with ASIC and microarchitecture team to hit power integrity goals given manufacturing design constraints Nice to Have: Experience with WSI (wafer-scale integration) systems Board and system-level power delivery network analysis and design Low voltage die power delivery network analysis and design Many voltage domain power delivery network design and analysis IVR based design experience

About us Graphcore is one of the world’s leading innovators in Artificial Intelligence compute. It is developing hardware, software and systems infrastructure that will unlock the next generation of AI breakthroughs and power the widespread adoption of AI solutions across every industry. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. Together, they share a bold vision: to enable Artificial Super Intelligence and ensure its benefits are accessible to everyone. Graphcore’s teams are drawn from diverse backgrounds and bring a broad range of skills and perspectives. A melting pot of AI research specialists, silicon designers, software engineers and systems architects, Graphcore enjoys a culture of continuous learning and constant innovation. About the Role We are looking for Staff System Software Engineer in Test to join our team. In this role, you will be responsible for design, development, automation and reporting of Integration and system tests spanning across firmware and device drivers. This role requires you to have significant technical breadth and deep understanding of low-level system software specifically in server class systems. You will be part of a new team responsible for integration of different system software deliverables and development of system tests spanning all the components. You will contribute to shaping the test strategy , guide best practices and solve complex problems while maintaining a strong hands-on focus. You will partner with development and other QA teams to deliver high quality scalable and reliable solutions. About the Team Integration and system test team is responsible for verification and validation of integrated components across Board management controller (BMC), Firmware and Linux device driver. The team is also responsible for management and maintenance of common tools and pipel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Take responsibility for designing digital IP blocks from initial microarchitecture to RTL creation, integration, and supporting physical hardware development. Define and review module interfaces and system-level architecture. Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate RTL design optimization and design‑space exploration Assist in testbench generation and corner coverage Improve debug efficiency across simulation and silicon learning loops Define semicustom methodology for memory design Drive full-chip integration including CDC, Lint, synthesis, STA and power analysis. Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments. Collaborate closely with architecture, design, verification, and physical design / layout teams. Oversee and manage the layout process including floor-planning, placement, and routing. Perform block-level and full-chip verification including functional, timing, power and reliability analysis using industry standard and Micron-specific simulators and tools. Contribute to cross-group communication to work towards standardization and group success Provide technical mentorship and participate in design and methodology reviews. Drive innovation into the future memory generations and design methodology within a dynamic w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Memory Design Engineer you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products . You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates , supporting both silicon release and ongoing product lifecycle needs. This role requires strong AI driven technical execution and the ability to independently drive complex issues to closure. Responsibilities Design Support: Work on HBM product design and support sustaining design maintenance (ECOs/spec changes). Silicon Debug: Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. Cross-Functional Collaboration: Work closely with DE, PE, TD,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Design Engineer, you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products . You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates , supporting both silicon release and ongoing product lifecycle needs. This role requires strong technical execution and the ability to independently drive complex issues to closure. Responsibilities Design Support: Work on HBM product design and support sustaining design maintenance (ECOs/spec changes). Silicon Debug: Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. Cross-Functional Collaboration: Work closely with DE, PE, TD, and system teams

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking an Actuator Gear Design Engineer to lead the development of custom gears and gear stages for advanced robotic systems. You will own actuator development from early architecture and concept generation through prototype validation and system integration, partnering closely with mechanical, electrical, controls, firmware, and reliability teams. You will partner with external suppliers and internal manufacturing to create full gearbox assemblies. This role focuses on the design, integration, and validation of precision gearing, including broader knowledge around motor electromagnetics, transmission types, sensing, structural components, and thermal architectures. You will help drive actuator development across the full engineering lifecycle while establishing scalable design, test, and integration practices for future robotic platforms. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will: Lead the architecture, design, and integration of custom robotic actuator gearing. Define actuator requirements and system-level trade studies around torque density, bandwidth, efficiency, thermal performance, back drivability, inertia, reliability, manufacturability, and cost. Design precision electromechanical assemblies with strong attention to tolerances, alignment, load paths, thermal expansion, sealing, wear, and serviceability. Drive actuator integration into robotic systems, partnering closely with controls, firmware, electrical, and robotics software teams to optimize closed-lo

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a senior Actuator Electromagnetic Design Engineer to lead the development of custom electromechanical actuators for advanced robotic systems. You will own actuator development from early architecture and concept generation through prototype validation and system integration, partnering closely with mechanical, electrical, controls, firmware, reliability, and manufacturing teams. This role focuses on the design, integration, and validation of precision electromechanical systems, including motors, transmissions, sensing, structural components, and thermal architectures. You will help drive actuator development across the full engineering lifecycle while establishing scalable design, test, and integration practices for future robotic platforms. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will: Lead the architecture, design, and integration of custom robotic actuators, including the design, simulation, integration and sourcing of custom electromagnetic components. Define actuator requirements and system-level trade studies around torque density, bandwidth, efficiency, thermal performance, inertia, reliability, manufacturability, and cost. Design precision electromechanical assemblies with strong attention to tolerances, alignment, load paths, thermal expansion, sealing, wear, and serviceability. Drive actuator integration into robotic systems, partnering closely with controls, firmware, electrical, and robotics software teams to optimize closed-loop performance. Devel

Experienced LO Propulsion Integration Engineer Company: The Boeing Company Come join a winning team and support the development of Boeing’s Next Generation Air Dominance (NGAD) platforms. Boeing Phantom Works is seeking an experienced Low Observable (LO) Propulsion Integration Engineer to lead LO integration of propulsion systems for advanced stealth aircraft programs. The ideal candidate will possess deep technical expertise in propulsion integration, LO design principles, and systems engineering, and will work across multidisciplinary teams to ensure propulsion system performance while maintaining stringent signature, thermal, and structural requirements. Position Responsibilities: LO propulsion integration activities for advanced platforms across concept, design, test, and qualification phases Develop and validate propulsion system LO architectures that meet performance, LO signature, and thermal management requirements Conduct trade studies, signature modeling, and sensitivity analyses for inlet, nozzle, and exhaust treatments Interface with aerodynamicists, structures, materials, thermal management, and signature engineering teams to ensure cohesive design solutions Define requirements, perform risk assessments, and establish verification/validation plans for propulsion integration items Support hardware design reviews (PDR/CDR), test planning, and ground/flight test execution to verify LO and propulsion performance Mentor junior engineers and provide technical leadership within the LO discipline Produce and review technical documentation, specifications, and interface control documents (ICDs) Basic Qualifications (Required Skills and Experience): Bachelor of

About the job Build the test strategy that protects Graphcore’s system software releases at scale. As a Staff System Software Engineer, you will shape integration and system testing across firmware, BMC and Linux device drivers. Your work will help create a high quality gate for system software release packages. You will design, build, automate and report tests across complex server class systems. You will also develop reusable tools, pipelines and packaging solutions that help teams move faster with confidence. This role needs deep low level software knowledge and strong system thinking. You will own hard technical areas, guide best practice and stay close to the code. The team and culture You will join a new integration and system test team within System Software QA. The team verifies integrated components across BMC, firmware and Linux device drivers. Work happens close to the hardware, across component teams and QA. You will partner with developers, consult package stakeholders and turn use cases into robust system tests. Decisions are shaped by evidence, clear technical reasoning and ownership. You will be expected to speak up, act fast and raise standards through hands-on leadership. What we’re looking for · Strong experience in low level system testing and integration across complex software and hardware layers. · Deep understanding of RTOS, complex boot logic, Linux and device drivers. · Test development capability using Python and C/C++. · Experience working with hardware, debuggers, CI/CD pipelines and build or integration tools. · Ability to debug cross-layer issues and drive root-cause investigations to lasting corrective actions. · Clear communication skills, with the ability to mentor engineers and document complex technical decisions. While we have outlined a set of requirements, we value transferable skills and diverse experiences. If you meet most of our essential criteria, we encourage you to submit an application and showcase how your background m

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. Responsibilities will include, but are not limited to: Lead the design and own critical HBM analog circuits, including: High‑speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes‑related analog blocks Biasing, reference, and calibration circuits Power delivery and regulation circuits (LDOs, regulators) Define and lead IP interfaces, power domains, clocking schemes, and reset strategies across subsystems Perform detailed pre‑layout and post‑layout simulations Conduct PVT, Monte Carlo, mismatch, and aging analyses Work closely with layout engineers to define floorplanning and symmetry requirements, ensure matching, shielding, and EM/IR compliance Review and sign off on analog layouts Drive layout‑aware build optimizations for advanced nodes <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! As a Principal HBM Design Engineer , you will lead cross-functional efforts to drive silicon debug, product quality, and system-level stability for high-volume HBM products . You will own the resolution of complex silicon and system issues, influence design and architectural decisions, and ensure successful deployment across key customer platforms. You will operate at the intersection of design, silicon, and system behavior , providing technical leadership across the full product lifecycle and driving continuous improvement into future HBM generations. Responsibilities Design Ownership: Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification, and long-term maintainability. Technical Leadership: Define debug strategies, guide cross-functional teams, and serve as a technical authority in HBM sustaining efforts. Silicon & System Debug: Lead root-cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple doma

Job Details: Job Description: The Role and Impact As a GPU Logic Design Engineer, you will contribute to the design and validation of cutting-edge graphics IPs, including compute, display, and media units. You will be immersed in the creation of register transfer level (RTL) coding, simulation, and optimization strategies to meet power, performance, area, and timing goals. By leveraging your expertise, you will play a pivotal role in enabling high-quality integration of GPU blocks into larger system-on-chip (SoC) designs, directly impacting Intel's future graphics technologies. Business Group You will be joining Intel's Data Center Group (DCG), a team dedicated to driving innovation and delivering high-performance solutions for data-centric workloads. The group focuses on developing advanced graphics hardware that powers data center GPU solutions, supporting Intel's broader mission of creating world-changing technology that enriches lives. It offers an exciting environment where collaboration and technical excellence intersect to shape the future of visual computing. Key Responsibilities - Develop logic design, RTL coding, and simulation for graphics IPs, ensuring compliance with power, performance, area, and timing requirements. - Participate in defining architecture and microarchitecture features for GPU blocks. - Optimize logic design to support physical implementation while maintaining design integrity. - Review and implement verification plans to ensure design features are accurately tested across verification hierarchies. - Drive unit-level verification and resolve RTL test failures to ensure feature correctness. - Support SoC customers in integrating GPU blocks effectively for high-quality results. <p style="text-align:inhe

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Design and analyze digital and analog circuits used in the development of memory products. Collaborate with company’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. Contribute to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits. Parasitic modeling and assist in design validation, reticle experiments and required tape-out revisions. Oversee and manage the layout process including floor-planning, placement, and routing. Perform verification processes with modeling and simulation using industry standard simulators. Contribute to cross group communication to work towards standardization and group success. Work with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Drive innovation into the future Memory generations within a dynamic work environment. Employer will accept a Master's degree in Electrical Engineering or related field. Position requires: 1. System Verilog/Verilog/VHDL, 2. C/C&#43;&#43; Programming and Debugging, 3. TCL/Python/Perl, 4. Dig

Ground Systems Integration Engineer (Experienced or Senior Level) Company: The Boeing Company Boeing Defense, Space & Security (BDS) is seeking a Ground Systems Integration Engineer (Experienced or Senior Level) to support an Air Dominance Fixed Wing Proprietary Program in Berkeley, MO . Step into a fast-paced, cutting-edge program where your expertise will drive the design, integration, and testing of advanced, cloud-based systems that empower mission planning, debrief, and tactical Command & Control (C2) solutions for fixed-wing platforms. As a key contributor, you will support the development, analysis, integration, and testing of innovative engineering solutions for critical Ground System capabilities, including but not limited to: Mission Planning and Debrief Command and Control Systems Network and Communication Architectures Situational Awareness Enhancements You will take ownership of developing prioritized mission systems digital threads, ensuring seamless support for ground systems from initial design through to final delivery. You will work with a high-performing, cross-functional team in an agile environment, driving next-generation capabilities from design through delivery. This role offers the chance to innovate with open-architecture, model-based designs while collaborating across disciplines to support critical defense missions. If you’re passionate about advancing mission-critical systems and thrive in a collaborative, fast-moving environment, this is your opportunity to make a significant impact. Why Join Us? Impactful Work: Be part of a team that plays a crucial role in

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department Photolithography Engineering Project Title Large-Scale Photolithography Software Stack Integration Project Description Photolithography is one of the most software-intensive and technologically advanced manufacturing processes in semiconductor manufacturing. Maintaining world-class performance requires an integrated software ecosystem spanning process control, equipment connectivity, data engineering, automation, visualization, machine learning, and decision-support systems. As an intern within the Photolithography Engineering team, you will collaborate with process, equipment, data, and manufacturing engineers to design and develop software solutions that transform large-scale manufacturing data into actionable insights and automated engineering workflows. Project assignments will be tailored to individual strengths, academic background, and learning interests, providing opportunities to contribute across software engineering, data engineering, system integration, analytics, and Artificial Intelligence domains. Where relevant, the project will incorporate AI-Enabled development approaches, Generative AI, Artificial Intelligence, AI Assistants, Agentic AI technologies, and Agen