Technical Information Security Officer Jobs

As a Manufacturing Development Engineering (MDE) Shift Engineer in Photolithography , you will play a critical role in enabling 24/7 process development for next-generation DRAM technologies. Operating on a 12-hour rotating shift schedule , you will be the primary engineering…

We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling,…

Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next…

As an Senior / Staff RDA Process Engineer, you will play an important role in monitoring inline defectivity, identifying process anomalies, and driving defect reduction initiatives. You will learn to leverage advanced inspection and metrology tools, analyze large data sets, and…

As a Metrology Application Engineer at Micron Technology, you will: 1. Develop, analyze and implement metrology measurement techniques in films with a primary focus on lithography overlay, CD-SEM. Also need to cover ellipsometry/ scatterometry characterization, modeling; XRF,…

Who We Are Addepar is a global data and AI platform empowering investment professionals to turn complex financial information into actionable intelligence. Addepar unifies portfolio, market and client data in a total portfolio view and delivers AI-powered insights within…

We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about…

Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the…

Summary Department Introduction The Front End Process and Cost Transformation (PROCT) team drives manufacturing performance by improving cost, productivity, operational efficiency, and process capability across Micron’s semiconductor fabrication network. The team partners…

The US Expansion Construction team leads the design and construction of some of the most advanced manufacturing projects in the United States. Supporting major semiconductor expansion programs in Boise, Idaho and Clay, New York, we work across engineering, construction,…

As NAND TD RDA LEADER , you will lead a team in the use of next-generation defect detection equipment and processes to identify and solve issues. The goal of this position is to accelerate cycles of learning and technology transfer in Technology Development. We need leaders who…

Job Description As the Operation Central Team (OCT) CPEE HVM team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process expert in…

Key Responsibilities Program Planning & Execution Own end‑to‑end program plans for chip design programs from concept → tape‑out → silicon bring‑up . Develop and maintain coordinated schedules, achievements, and critical paths across: Architecture RTL & DV Physical Design CAD /…

The Test Solutions Engineering Key Equipment Group develops, deploys, and supports wafer probe equipment and processes that enable high-volume semiconductor manufacturing across Micron's global operations. The team drives innovation, quality, efficiency, and standardization…

The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via)…