Advanced Packaging Engineer Jobs

Silicon Product Integration Description - Role Overview We are seeking an experienced Product Engineer to lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs. The role serves as the technical bridge between HP, foundry partners, design teams, manufacturing organizations, and worldwide program teams to ensure successful technology development, qualification, and high-volume manufacturing readiness. The successful candidate will combine deep semiconductor foundry experience with strong program leadership skills to drive product execution from technology development through qualification and production launch. Key Responsibilities Product Engineering Leadership Own silicon product engineering activities across development, qualification, ramp, and sustaining phases. Drive structural cost saving initiative in wafer Foundry and advanced packaging factories. Lead NPI silicon builds and ensure timely execution of wafer, and advanced packaging factories deliverables. Partner with design, architecture, reliability, systems, and manufacturing teams to close technical issues. Drive issue resolution and technical solution for the process marginality and escalation. Foundry and Technology Development Serve as the primary technical interface with internal/external foundries and technology partners. Drive technical reviews, process optimization, design enablement, and qualification activities. Lead root-cause investigations and corrective actions related to yield, reliability, and manufacturability. Assess technology options and recommend development strategies for future products. Program and NPI Leadership Program Management Leadership cross-functional execution for strateg

Job Details: Job Description: As a Module Equipment Technician, you will play a vital role in ensuring the smooth operation of advanced manufacturing equipment used in semiconductor production. You will perform hands-on troubleshooting, maintenance, and calibration of electromechanical systems while supporting experiments and equipment modifications that drive cutting-edge advancements. Your work will directly contribute to enhancing equipment reliability and optimizing production efficiency, making an essential impact on Intel's manufacturing operations. Business Group Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) organization, a leader in delivering innovative and cost-effective substrate packaging solutions. This business group is focused on advancing Intel's capabilities in manufacturing technology to maintain competitive excellence across global markets. As part of this dynamic team, you will support critical equipment and collaborate on continuous improvement initiatives that align with Intel's broader mission of innovation and growth. Key Responsibilities Perform electrical and mechanical troubleshooting to diagnose issues with manufacturing equipment. Execute setup, calibration, corrective and preventative maintenance on production equipment, including wet chemistry, plating, and dry high-vacuum toolsets. Monitor tool performance and analyze data to identify and address equipment-related issues. Collaborate with engineering and support teams to improve equipment reliability and reduce downtime. Document maintenance activities, repair findings, and parts usage using established systems and procedures. Lead or contribute to continuous improvement projects, focusing on equipment optimization and yie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Build the Future of Memory and AI from India At Micron India , we are helping shape the next generation of memory and storage solutions that power Artificial Intelligence, cloud computing, mobile devices, automotive systems, and data centers worldwide. Join a team of innovators, engineers, and technology leaders working at the forefront of semiconductor design, verification, product development, advanced packaging, data analytics, and manufacturing technology. From pioneering High Bandwidth Memory (HBM) solutions for AI to developing next-generation DRAM and NAND technologies, Micron India plays a critical role in delivering innovations that enable the world's most demanding computing applications. As one of Micron's fastest-growing innovation hubs, our teams collaborate globally to solve complex engineering challenges, accelerate technology development, and transform breakthrough ideas into products used by billions of people around the world. Opportunities Across Micron India Engineering Teams DTPG (Design Technology & Product Group) Design and develop next-generation DRAM, NAND, and emerging memory technologies powering AI, high-performance computing, mobile, and cloud applications. Work across memory architecture, circuit design, layout, verification, characterization, and product engineering to bring cutting-edge semiconductor innovations to market. TD (Technology Development) Drive the future of memory technology

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Join Micron in Shaping the Future of Semiconductor Manufacturing Help drive the strategic decisions behind Micron's global Assembly & Test network. As a Senior Financial Analyst , you will influence critical investments, manufacturing strategies, and technology roadmaps that support the production of the world's most advanced memory and storage solutions. Working with leaders across the business, you will turn complex manufacturing and financial challenges into actionable insights, helping Micron strengthen its competitive advantage and accelerate innovation in a dynamic, fast-paced industry. Job Responsibilities Lead complex Conventional and Advanced Packaging scenario studies and financial analyses to support Micron’s Assembly & Test manufacturing network. Partner closely with Operations, Engineering, Supply Chain, and Finance leadership teams to evaluate business scenarios and provide data-driven recommendations. Develop cost models and financial analyses to support key decisions related to cost competitiveness, capacity planning, manufacturing network optimization, and technology transitions. Manage the increasing volume, speed, and complexit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As Package Characterization Lab Manager within Advanced Packaging Technology Development (APTD), you will lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. You will provide technical direction, own lab operational excellence and workforce development, ensuring timely, high‑quality results that directly impact critical APTD technical decisions. This role partners closely with Micron's global engineering labs, subject-matter experts and external vendors to expand lab capability, efficiency and ensure forward-looking readiness for new technologies. Responsibilities and Tasks Lab Management, Compliance & Audits Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards. Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency. Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime. Evaluate and introduce new FA tool models and capabilities in partnershi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Summary The DRAM Packaging organization is responsible for developing and delivering advanced memory packaging solutions that enable Micron’s next generation products. The team partners across design, technology development, manufacturing, quality, supply chain, and external ecosystem partners to drive innovation, accelerate product development, and deliver industry-leading packaging technologies that support markets including AI, cloud, mobile, automotive, high-performance computing, and data centers! Position Overview As the Director of DRAM Packaging, you will lead the strategy, development, and execution of advanced packaging solutions across Micron's memory portfolio. You will define technology roadmaps, drive innovation in next-generation packaging architectures, and build a high-performing global engineering organization. This executive leadership role combines technical expertise, business strategy, customer engagement, and digital transformation to accelerate innovation, improve organizational effectiveness, and strengthen Micron’s competitive position. Responsibilities Define and execute long-term DRAM packaging strategies that support future product, technology, and business objectives Lead development and deployment of advanced packaging technologies, including HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, and next-generation interconnect solutions Drive adoption of AI, machine learning, advanced analytics, and digital engineering

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior or Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities. You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron’s global leadership in s

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Singapore Campus Hiring Build the Future of AI with Micron Singapore The next era of Artificial Intelligence depends on faster, more powerful, and energy-efficient memory. At Micron Singapore , you'll help create it. Join our global teams and help develop the memory and storage technologies behind AI, cloud computing, smartphones, and data centers. From NAND flash memory and High Bandwidth Memory (HBM) to solid-state drives (SSDs) and advanced chip packaging, you’ll work with experienced engineers to solve real-world challenges and turn new ideas into technologies used around the world. Micron Singapore is proud to be recognized as the #1 Best Workplace in Singapore (Large Category, 2025) and has earned Great Place to Work® recognition for seven consecutive years. <span style="

About Graphcore At Graphcore, we’re building the future of AI compute. We’re a team of semiconductor, software and AI experts, with deep experience in creating the complete AI compute stack - from silicon and software to infrastructure at datacenter scale. As part of the SoftBank Group, backed by significant long-term investment, we are delivering key technology into the fast-growing SoftBank AI ecosystem. To meet the vast and exciting AI opportunity, Graphcore is expanding its teams around the world. We are bringing together the brightest minds to solve the toughest problems, in a place where everyone has the opportunity to make an impact on the company, our products and the future of artificial intelligence. Job Summary We are looking for high-quality silicon physical design engineers to complement our existing exceptional team. We have a range of roles available with focus on those with extensive ranges of skills and experience although exceptional candidates with less experience will be considered. We want people who work collaboratively and proactively within a team focusing on collectively achieving our goals and creating the right engineering solutions. Good communication is essential, as is the ability to adapt and learn – we value the right characteristics more than specific experience. For the successful candidate we offer an open, honest and collaborative environment working on leading-edge designs at the most advanced nodes. Our engineers are not siloed, and they are trusted and encouraged to take ownership of their designs and problem solutions. You will become part of a team that looks for improvements to everything we do: our designs, our flows, our methodologies, our infrastructure. The Team The physical design team sits within the wider silicon design team which includes RTL, verification and DFT and with whom we collaborate extensively. Our work additionally involves strong links with architecture, packaging and product engineering. We are r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in APTD Micron you will be responsible for leading and managing the activities and operation of Advanced Package Development by collaborating with internal and external stakeholders to build and execute technology development strategies aligned to organizational and business objectives by providing high performing and cost effective packaging solution on time with best predictable reliability performance. You will need to comprehend package technology development business process (MOR development) and TECHNODE business process for packaging technology and ensure all package development and product transfer work are carried out in accordance with these business processes. Other responsibilities include ensuring organizational compliance to company policies and regulations, as well as to departmental procedures, and providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects, as well as mentoring other functional leaders through collaboration and the development of sustainably successful solutions. Responsibilities and Duties include, but not limited to: Develop and Communicate Technology Development Strategy Develop and communicate Technology Development strategic objectives Understand the impact and implica

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our Technology Development team sits at the center of innovation. We build advanced modeling and AI solutions that shape how memory and storage technologies are designed, built, and scaled. Working at the intersection of physics, data, and engineering, we turn complex problems into practical breakthroughs that matter! This role is critical to how we accelerate semiconductor technology development using advanced AI and physics-based modeling. You will lead the design and deployment of agentic and LLM-powered solutions that directly influence process technology, packaging, and early manufacturing decisions. If you enjoy driving hard problems end to end and collaborating across hardware and software teams, this role offers real impact and visibility. Note: We are hiring for more than one role spanning Senior/Staff/Principal/Technical Staff Engineer. Responsibilities: Design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows Architect agentic AI systems that integrate with modeling tools, design automation environments, and fab/test platforms to enable digital twin development Define and promote best known methods for deploying LLMs and agentic systems reliably in production environments Evaluate and improve model performance using methods such as structured benchmarking, prompt tuning, RLHF, and feedback loops Translate modeling results into clear insights through data storytelling and visualiza

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our Technology Development team sits at the center of innovation. We build advanced modeling and AI solutions that shape how memory and storage technologies are designed, built, and scaled. Working at the intersection of physics, data, and engineering, we turn complex problems into practical breakthroughs that matter! This role is critical to how we accelerate semiconductor technology development using advanced AI and physics-based modeling. You will lead the design and deployment of agentic and LLM-powered solutions that directly influence process technology, packaging, and early manufacturing decisions. If you enjoy driving hard problems end to end and collaborating across hardware and software teams, this role offers real impact and visibility. Note: We are hiring for more than one role spanning Senior/Staff/Principal/Technical Staff Engineer. Responsibilities: Design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows Architect agentic AI systems that integrate with modeling tools, design automation environments, and fab/test platforms to enable digital twin development Define and promote best known methods for deploying LLMs and agentic systems reliably in production environments Evaluate and improve model performance using methods such as structured benchmarking, prompt tuning, RLHF, and feedback loops Translate modeling results into clear insights through data storytelling and visualiza

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our Technology Development team sits at the center of innovation. We build advanced modeling and AI solutions that shape how memory and storage technologies are designed, built, and scaled. Working at the intersection of physics, data, and engineering, we turn complex problems into practical breakthroughs that matter! This role is critical to how we accelerate semiconductor technology development using advanced AI and physics-based modeling. You will lead the design and deployment of agentic and LLM-powered solutions that directly influence process technology, packaging, and early manufacturing decisions. If you enjoy driving hard problems end to end and collaborating across hardware and software teams, this role offers real impact and visibility. Note: We are hiring for more than one role spanning Senior/Staff/Principal/Technical Staff Engineer. Responsibilities: Design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows Architect agentic AI systems that integrate with modeling tools, design automation environments, and fab/test platforms to enable digital twin development Define and promote best known methods for deploying LLMs and agentic systems reliably in production environments Evaluate and improve model performance using methods such as structured benchmarking, prompt tuning

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: Introduction As a Principal Engineer in the Advanced Package Technology Development team at Micron, you will join a dynamic group focused on innovation and collaboration. This role lets you influence solutions that align with company goals. It contributes to increased revenue and strategic successes. You will work at our Boise campus and help develop leading technology in the industry. Responsibilities and Duties include, but not limited to: Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure seamless technology integration. Consult and influence technical and strategic decisions at senior management levels. Lead multi-disciplinary technical teams and task forces to achieve strategic goals. Maintain effective communication with collaborators. Analyze and understand competitive trends to improve Micron’s competitive edge. Participate actively in technology events, contributing to industry knowledge. Guide the development of packaging technology roadmaps. Assess competitive metrics through data intelligence for strategic adv

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You’ll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we’d love to hear from you. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure. A hands-on problem solver who excels at debugging and driving signoff through complex verification flows. A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces. A mentor and technical leader passionate about building efficient, manufacturable silicon. What We Need BS/MS in Electrical/Electronics Engineering (or related) with 7–14 years of hands-on CPU/IP/SoC physical verif