Dft Lead Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop test programs of SSD and UFS controller products, and enhance test coverage to ensure excellent outgoing quality and customer satisfaction. Optimize test programs to reduce product test times and manufacturing cost by improving the efficiency of the testing methods . Automate test engineering processes by writing software scripts to improve efficiency. Work closely with product and equipment engineering teams to improve overall product yields and equipment efficiency to maximize ROI. Work closely with design teams to develop design for test features to drive lower costs and increased efficiency Develop and monitor process and engineering metrics to ensure stability, efficiency and effectiveness of test processes. Bachelor’s or master’s degree in Electrical Engineering/Computer engineering. Strong interest in software development with good programming skills. Knowledge of any of the following is desirable: Python, C/C++, Visual Basic, Perl. Prefer candidates with digital, analog, and mixed signal test programming and debug experience. Familiar testing IP blocks such as PLL, efuse, LDO’s, PCIe, DDR, ONFI, and DFT patterns implementation ATPG SCAN, TDF, MemBIST & repair, JTAG, and functional patterns Test program development experience on logic ATE tester platform such as UltraFlex/J7

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Physical Design Engineer-DPG-LPDDR at Micron, you will work on innovative memory and storage solutions. These solutions help transform data into intelligence quickly. You will join a dedicated team collaborating to develop world-class products that set industry standards. Key Responsibilities Lead end-to-end RTL-to-GDSII implementation for complex SoCs across advanced technology nodes. Drive floor planning, power planning, CTS, place & route, timing closure, and physical signoff. Own PPA optimization, low-power implementation, congestion management, and design convergence. Lead STA, SI, EM/IR, DRC, LVS, and reliability closure to achieve tape out readiness. Define physical design methodologies, automation strategies, and flow improvements. Partner with Architecture, RTL, DFT, Verification, CAD, and Product Engineering teams to resolve complex implementation challenges. Provide technical leadership, mentor engineers, and drive execution across global teams. Hands-on custom layout design experience is a strong value-added skill, enabling analog/mixed-signal integration, layout optimization, and advanced-node design challenges Leverage Artificial Intelligence (AI) tools to improve RTL-to-GDSII design productivity, quality, and turnaround time. Drive adoption of Generative AI and Agentic AI solutions for physical design automation, design closure, and engineering workflow optimization. <p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Static Timing Analysis (STA) Engineer — you will be part of the Heterogeneous Integration Group (HIG), owning chip-level timing sign-off for next-generation die. You will work closely with RTL design, physical design, architecture, DFT, verification, and product teams to ensure timing integrity and drive timing closure across all modes and corners from initial design through tape-out. This is a hands-on senior technical role focused on chip-level STA ownership, constraint authoring, timing closure, methodology development, and pre-/post-silicon timing correlation. Key Responsibilities Responsibilities will include, but are not limited to: Own end-to-end chip-level static timing analysis and sign-off across all checks, modes, corners, and voltage and temperature conditions. Develop, maintain, and validate sign-off quality Synopsys Design Constraints (SDC) for clocks, resets, high-bandwidth memory (HBM) interfaces, design for test (DFT), and configuration logic.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Post-Silicon Yield & RMA Leadership Lead end-to-end investigation of silicon yield loss, field returns, customer escalations, and reliability failures. Drive root-cause analysis for complex silicon issues spanning process, design, test, package, and system interactions. Develop hypothesis-driven debug strategies and coordinate cross-functional execution. Own resolution of critical yield and quality issues through containment, corrective actions, and prevention plans. Device Technology & Process Interaction Analysis Analyze device-level failure mechanisms and process sensitivities impacting ASIC functionality and yield. Evaluate design-process interactions affecting analog, mixed-signal, memory, high-speed I/O, and PCIe PHY performance. Partner with foundry teams to understand process variations, excursions, reliability risks, and technology limitations. Translate silicon learning into actionable design and process improvements. Advanced ASIC Design Interaction & Silicon Debug Lead root-cause investigations involving design-process interactions affecting SRAM, PCIe PHY, ONFI interfaces, SerDes, analog/mixed-signal circuits, and high-speed digital subsystems. Analyze silicon failures across transistor, circuit, block, die, package, and system levels. Drive post-silicon debug activities involving design teams, DFT, product engineering, quality,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job responsibilities: · Create SoC Verification plan and develop C/SV/UVM based SoC verification tests · Develop understanding on SoC Architecture and Test controller Architecture · Develop SV / UVM based testcases for Test controller verification, MBIST verification and Functional vectors generation · Develop SV/UVM monitors to measure performance and improve Verification Environment · Interact with Architecture/Design/Tester teams to identify ASIC test vectors and functional patterns requirement · Develop flows to automate verification environment development and drive team · Involve in Vectors Bring-up activity and support ATE/Tester teams for Functional Characterization Job Qualifications · Bachelors/Masters in Engineering. · Minimum 7&#43; years of SOC/IP Verification based on SV/UVM. Proficient in using AI tools and Methodologies · Good understanding on Test controller / MBIST / DFT architecture · Knowledge of industry standard interfaces, such as PCIE, LPDDR*, ONFI/NAND is desired. · Proven experience in ATE/Functional CHAZ vector enablement in Silicon / Wafers and debug abilities on vectors <p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview The Principal Design Engineer in Micron’s NVEG organization contributes to the development of new memory products by assisting with the overall design, layout, and optimization of datapath circuits for NAND flash memory. This position will drive task forces and make strategic decisions on major datapath architectural changes influenced by new design specs such as higher speed/lower power. They will assess pros and cons of new architecture and drive all activities pertaining its implementation. The role will be expected to lead technical datapath design projects, directing the design planning, layout, and validation activities according to project timelines. Responsibilities Design and optimize TSV(Through-Silicon Via) interface circuits connecting memory die to logic die including Rx/Tx circuit for internal TSV channels, impedance matching and timing margin analysis. Develop and characterize TSV electrical models and define circuit design constraints for datapath interface. Define and implement signal integrity requirements for the TSV channel, including eye margin, crosstalk, and noise budget analysis Define and implement power integrity requirements using TSV for highly parallel IO and array operations Design and verify TSV-specific DFT (Design for Testability) circuits including loopback test modes, TSV continuity checks, and lane redundancy/remapping logic Interface with process technology and DTCO teams to optimize TSV de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The qualifications and skills for this position include, but are not limited to: Bachelor’s or master’s degree in Electrical Engineering or Computer Engineering with 7&#43; years of proven experience in Test Engineering role. Excellent programming skills for writing and debugging ATE test programs and test-related hardware development. Proficiency with Advantest V93K ATE platforms and/or other logic device ATE testers is preferred. Proficiency in programming with C/C&#43;&#43; and/or JAVA is required. Solid understanding of testing for CMOS SoCs. Prefer candidates with exceptional digital, analog, and MXS test programming and debug experience. Familiar with testing IP blocks such as PLL, efuse, DDR. Expertise in test strategy development, test plan definition, DFT pattern implementation (ATPG SCAN, TDF, MemBIST and repair, BSACAN, JTAG/IEEE1500, and Functional Patterns). Expertise in ATE architecture and test hardware design and debugging, schematic capture, and PCB layout. ATE test vector conversion tools like VTRAN and proficiency in debugging issues during development or high volume production. Knowledge of semiconductor manufacturing process. Knowledge of accurate and effective use of lab test equipment (i.e., oscilloscope, logic analyzer, etc.). Experience with data analysis software in support of c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Member of Technical Staff, SoC Power and Physical Architect in the Next-generation HBM Architecture Team, you will drive SoC-level specification 3D-stacked, high-performance memories. Apply your knowledge to analyze SoC trade-offs in close collaboration with peer architecture and design teams. Drive power architecture, physical planning, and early SoC design activities, including definition of IP interfaces (e.g., signals, power delivery), clocking, power sequencing, design-for-test, floorplanning, and specification development. Responsibilities: Define clocking architectures, power sequencing, power delivery, and on-die signal interfaces. Define and analyze on-die power delivery networks (PDN) and full-chip thermal implications, including power hot-spot identification and mitigation. Define DFT architectures (e.g., scan chain topology) and set verification requirements. Define SoC floorplans in collaboration with physical designers. Compose and maintain clear SoC physical documentation. Preferred Qualifications: Experie

NVIDIA’s Networking unit is looking for a creative and independent Test Engineer to join our Post-Silicon Validation organization. You will play a pivotal role in bringing cutting-edge networking products (Switches, NICs, SmartNICs) from early design to production readiness. In this role, you will take full ownership of a product from its definition phase, working closely with Design and Architecture teams. You will define and execute Pre-Silicon validation plans using advanced emulation platforms such as Palladium and VTPsim. Post-silicon, you will be responsible for planning and managing bring-up, validation and product stabilization, leading the product towards Bring up and up to P-Rel stage. What you’ll be doing: Own the product lifecycle from definition to pre-launch. Collaborate with Architecture, Design and Verification teams to define product validation strategies. Execute Pre-Silicon tests using emulation tools (Palladium, VTPsim). Define post-silicon validation plans and lead execution. Write Test program code including new infrastructures and methodologies. Drive product bring-up and stabilization toward Prel and production readiness. Develop automated infrastructure to support program execution. Coordinate cross-functional activities with DFT, Production, and Software teams. What we need to see: B.Sc. in Electrical Engineering or related field. 2&#43; years of experience in test or validation engineering, preferably in Post-Silicon. Hands-on coding experience (Java, VBA, Python, C/C&#43;&#43;, or similar). Strong ownership, execution and problem-solving skills. Excellent communication and collaboration abilities. Ways to stand out from the crowd: Familiarity with pre-silicon emulation platforms – advantage. Experience with SMT8/UltraFlex – advantage. </

Job Title Principal Electrical Engineer- Medical Device Job Description As a Principal Electrical Engineer, you will be part of the multidisciplinary IntraSight Hardware Team, contributing to innovative imaging clinical solutions. You will serve as the key technical interface between Philips and external suppliers, design partners, and contract manufacturers for PCBA development, ensuring high-quality, reliable, and cost-effective electronic designs that meet performance, safety, quality, and regulatory requirements. Your role Serve as the primary electrical engineering interface to suppliers, design partners, and contract manufacturers, providing technical leadership for PCBA design, development, prototyping, and industrialization. Drive alignment on electrical requirements, schematics, PCB layout, architecture, acceptance criteria, timelines, cost, and quality. Lead supplier selection, technical evaluations, design reviews, and issue resolution in partnership with sourcing, procurement, and cross-functional engineering teams. Review and approve schematics, PCB layouts, and design documentation to ensure alignment with Philips standards and system architecture. Drive design for manufacturability (DFM), design for testability (DFT), design for cost (DFC), and component selection strategies while considering availability, lifecycle, obsolescence, and overall product cost. Manage supplier change requests and mitigate component and PCBA lifecycle risks. Oversee PCBA verification and validation, including functional, signal integrity, power integrity, electrical safety, and EMC testing, ensuring compliance with applicable medical device standards such as IEC 60601-1 and IEC 60601-1-2. Partner with quality and regulatory teams to ensure suppliers meet required quality systems, documentation, and regulatory expectati

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: The resp

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: T

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage

About Anthropic Anthropic’s mission is to create reliable, interpretable, and steerable AI systems. We want AI to be safe and beneficial for our users and for society as a whole. Our team is a quickly growing group of committed researchers, engineers, policy experts, and business leaders working together to build beneficial AI systems. About the role Anthropic is building custom silicon for Claude. The hardware our models run on is one of the most direct levers we have on capability, cost, and reliability — and we've decided to take design authority over it ourselves. We're looking for a Technical Program Manager to own end-to-end execution of our silicon, from architecture definition through tapeout, first-silicon bring-up, and production ramp. You'll be working alongside a small group of domain experts across front-end design, verification, physical design, DFT, analog/mixed-signal, foundry, and packaging. There is no process to inherit — you'll build the execution machinery this program runs on. This is a partner-heavy program by design. You'll drive a portfolio of external engagements — ASIC design services, IP vendors, foundry, and OSAT. You should have shipped chips before, know what a realistic silicon schedule looks like and its failure modes, and be comfortable making consequential program calls without a large organization behind you. And because this is Anthropic, you'll have Claude as a collaborator — we expect the TPMs on this team to push hard on what AI-assisted program management can look like. Key responsibilities Own the integrated silicon program plan — architecture closure, RTL freeze, DV milestones, IP delivery, PD closure, DFT, tapeout, and post-silicon bring-up. Drive external partner execution across ASIC design partners, IP vendors, foundry, and packaging/test. Run technology and IP selection as a program: track candidate vendors and options, drive evaluations to a decision, and land the build / buy / license calls with engineering leadershi