Dram Systems Architecture Jobs

Intern - DRAM IP Circuits Design Engineer — Boise, ID - Main Site. Apply via Workday.

Intern - DRAM Design Engineer — Boise, ID - Main Site. Apply via Workday.

Advanced DRAM Process Integration Engineer — Boise, ID - Main Site. Apply via Workday.

Engineer- DRAM, Advanced DRAM and EM Device/Cell Technology — Boise, ID - Main Site. Apply via Workday.

Senior DRAM Product Engineer — Manassas, VA - Fab 6. Apply via Workday.

Sr DRAM Product Engineer — Manassas, VA - Fab 6. Apply via Workday.

Principal DRAM Product Applications Engineer — San Jose, CA. Apply via Workday.

LPDDR DRAM Product Engineer — Taichung - Fab 16, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We’re building the next generation of DRAM technology and pushing what’s possible at the intersection of device physics and circuit design. Our team thrives on solving deep technical challenges and turning innovative ideas into high-performance, manufacturable memory solutions. If you’re excited about influencing future technology nodes and working on designs that ship at scale, you’ll feel right at home with us! As a Staff/Principal DRAM Design Engineer, you’ll play a critical role in shaping memory architectures and circuit innovations that directly impact product performance, power, and reliability. This is a hands-on design role where your expertise will drive key decisions from concept through silicon validation, while collaborating with cross-functional teams to deliver meaningful results. Responsibilities: Lead design and optimization of DRAM circuits including memory array, control logic, datapath, and test logic Perform and analyze circuit simulations using tools such as SPICE and Verilog Evaluate architectural trade-offs impacting power, performance, and die size Integrate layout parasitics into simulations and drive design for manufacturability Define validation strategies including test chip development and silicon bring-up Minimum Qualifications: Bachelor’s degree in Electrical Engineering or related field 5+ years of circuit design experience or product engineering experience Strong understanding of analog and digital

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role combines advanced DRAM circuit design with technology development, silicon learning, and yield improvement. We work across Design, Technology Development, Product Engineering, Test, Reliability, Quality, Manufacturing, and other teams to solve challenging memory-design problems and enable future technology generations In this position, you will contribute to the design and optimization of critical DRAM circuitry, including Sense Amplifiers, timing distribution, calibration, and training features. You will influence designs from early process-node development through silicon bring-up and production ramp, using simulation, silicon data, statistical analysis, and automation to improve performance, robustness, yield, and manufacturability Responsibilities: Design, analyze, verify, and optimize memory, logic, and analog circuits, including Sense Amplifiers, timing distribution, calibration, and training features Identify design marginalities and develop circuit- or architecture-level solutions that improve DRAM robustness, performance, scalability, and yield Support new process-node development, qualification, silicon bring-up, yield learning, and production ramp through modeling, simulation, silicon experiments, electrical failure analysis, and statistical analysis Guide layout, parasitic extraction, and modeling activities for Sense Amplifiers and Wordline drivers, including floor planning, placement, routing, signal-margin optimization, and memory-bit interaction Lead technical investigati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global DRAM leader whose innovative builds push the boundaries of future semiconductors. We seek a dynamic BEOL Process Integration Expert with proven experience in developing, transferring, and optimizing advanced DRAM technologies. Our team enjoys solving complex integration challenges and improving yield, reliability, and manufacturability. Known for technical leadership, strategic vision, and passion for semiconductor advancement, this role suits ambitious and determined candidates eager to make a big impact. Responsibilities In this role, you will need to have strong semiconductor Process Integration skills in an R&D department. You will be developing the future generation DRAM technologies. This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Define and implement BEOL process flows, build rules, and specifications for advanced DRAM products. Lead troubleshooting and resolution of complex integration issues spanning multiple modules and fields. Drive yield improvement and reliability enhancement initiatives using data-driven methodologies. Coordinate technology transfers, ensuring robust process qualification and rapid ramp to high-volume manufacturing. Engage in industry benchmarking and collaborative projects to maintain te

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: Micron's DRAM organization focuses on designing and developing industry leading dynamic random access memory products. These teams drive R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. Our Process Integration team is at the center of advancing next‑generation memory technology. We work closely across engineering, manufacturing, and change management to turn data into action and keep programs moving forward. If you enjoy solving complex problems and seeing your impact on real products, you’ll find a home here! We’re hiring a Senior Process Integration Technician to partner with Module Engineers and help drive day-to-day execution. This role is essential to keeping experiments, conversions, and production priorities on track through strong coordination and clear communication. You’ll play a hands‑on role in data analysis, issue resolutions, and cross‑functional alignment to support key technology milestones. Responsibilities Collaborate with cross-functional teams to interpret and complete conversions for assigned PI Engineering Module. Serve as the primary point of contact for experiment coordination, conversion activities, and lot movement logistics. Partner with PI Module Owners, Process Area Owners, PI Conversion Coordinators, and Change Management teams to ensure alignment and execution of module support tasks

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron research and development has an opening for Yield Analysis (DA) engineer to develop our next generation memory solution and to support production transfer for the next generation Micron products. As a DA engineer you will be responsible to characterize electrical data to identify and source out extrinsic and intrinsic device issues that are impacting yield. You will work closely with cross functional team from R&D and manufacturing to accelerate product to market timeline by applying device physics knowledge to develop end of line device performance prediction using machine learning. We need engineers who are passionate about detecting problems, making changes for the better, and seek out innovative ways in how predict end of line device performance. Your responsibilities will include, but are not limited to the following: Analyze end of line test, parametric and fab data to identify design, process, and test issues that are impacting yield Develop new tools for yield analysis and implement machine learning technique to improve analysis efficiency and accuracy, leveraging artificial intelligence (AI) to improve proficiency. Identify new creative and innovative ways to use existing tools to identify relevant process issues or device failures Identify interactions between process modules and/or equipment to detect fail mechanisms Use the data collected inline to drive process improvements Improve yield by standardizing methods and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Enable rapid learning and effective technology transfer across the organization through deep involvement in defect detection equipment applications and advanced data analysis. Analyze process challenges using defect data and equipment signals to identify root causes and improvement opportunities. Collaborate with cross-functional teams across process integration, process development, data science, and yield analysis to deliver solutions with global impact. Drive defect reduction and yield improvement efforts across multiple projects on Micron’s DRAM roadmap, including High Bandwidth Memory (HBM) and advanced DRAM technologies. Develop a comprehensive understanding of process flows, potential failure and defect modes through FMEA, and associated detection strategies for inline yield characterization. Define die loss paretos upon issue detection and partner with process and integration teams to design, execute, and analyze experiments and DOEs to resolve yield limitations. Monitor baseline inline yield health for owned process modules using SPC techniques to quickly identify excursions, process drift, and emerging risks. Protect line yield by proactively escalating issues and coordinating corrective actions. Apply advanced data science and data interpretation skills to analyze complex datasets, draw actionable conclusions, and communicate results effectively. Present findings and recommendations to internal teams and customers using analytical tools such as JMP and Python. Employer will accept a Master’s degree in Material Engineering, Chemical Engi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners! The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the 3D DRAM organization, you will join a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology that enables the future of memory scaling. You will focus on performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process integration knowledge, this position requires a strong background in materials science and semiconductor device physics, along with a creative mindset and effective project management. The role interacts significantly with process development, simulation, characterization, and reliability groups. Responsibilities: Contribute to technology development activities to enable next generation DRAM, working on device components such as charge storage devices and thin-film transistors, among others. Optimize process flows and develop creative solutions to meet product requirements. Engage numerous cross-functional te