Engineer Hbm Layout Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Memory Systems Engineering team develops the digital and mixed-signal foundation that enables Micron's High Bandwidth Memory (HBM) products. The team works across architecture, PHY, design verification, DFT, and silicon validation functions to deliver innovative memory solutions that achieve demanding performance, power, and reliability targets. In this role, y ou'll receive mentorship from expert engineers while building expertise in sophisticated memory technologies. You will also contribute to the definition, implementation, integration, and validation of HBM base-die digital subsystems. You will collaborate with cross-disciplinary engineering groups to develop robust RTL solutions, support verification activities, and help ensure successful first-pass silicon execution. This position provides an opportunity to gain broad exposure to memory system design, silicon development methodologies, and AI-enabled engineering workflows. Responsibilities Define and implement digital micro-architecture for HBM base-die subsystems, including channel support logic, boot and initialization sequencing, training orchestration, configuration and status registers, telemetry, performance monitoring, and reliability features. Translate system requirements into timing, power, and area objectives while partnering with physical layer and system architects; develop and maintain interface specifications for bus protocols, clock-domain crossings, and reset architectures. Develop, integra

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will lead and develop a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and cov

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Static Timing Analysis (STA) Engineer — you will be part of the Heterogeneous Integration Group (HIG), owning chip-level timing sign-off for next-generation die. You will work closely with RTL design, physical design, architecture, DFT, verification, and product teams to ensure timing integrity and drive timing closure across all modes and corners from initial design through tape-out. This is a hands-on senior technical role focused on chip-level STA ownership, constraint authoring, timing closure, methodology development, and pre-/post-silicon timing correlation. Key Responsibilities Responsibilities will include, but are not limited to: Own end-to-end chip-level static timing analysis and sign-off across all checks, modes, corners, and voltage and temperature conditions. Develop, maintain, and validate sign-off quality Synopsys Design Constraints (SDC) for clocks, resets, high-bandwidth memory (HBM) interfaces, design for test (DFT), and configuration logic.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s Memory Systems Engineering team and contribute to the development of premier digital and mixed-signal foundations for our high-bandwidth memory (HBM) products. This position offers an outstanding chance to work intimately with multiple engineering areas, guaranteeing the smooth integration and implementation of HBM base die. Join a motivated team committed to delivering robust first-pass silicon that meets our strict bandwidth, latency, power, and reliability objectives! Responsibilities Assist in defining and carrying out digital micro-architecture for HBM base-die subsystems, covering channel support logic, boot and initialization sequencing, training orchestration, configuration and status registers, telemetry, performance counters, and reliability features. Translate system requirements into timing, power, and area considerations by partnering with physical layer and system architects, and help maintain interface specifications for bus protocols, clock-domain crossings, and reset strategies. Implement and integrate synthesizable SystemVerilog RTL, including multi-channel logic, interrupts, events, register maps, scan hooks, and design-for-test interfaces, while supporting clean integration and ECO flows. Collaborate with design verification teams to support verification planning, coverage goals, CDC/RDC checks, and debugging of RTL, testbench, and gate-level issues. Support silicon bring-up and post-silicon validation through debug enablement, issue correlation to RTL or architecture, and col

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About the Team At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops future High-Bandwidth Memory (HBM) architectures, PHY design methodologies, and automation solutions that enable next-generation AI, high-performance computing, networking, and data center applications. The team works closely with Architecture, Design Engineering, Verification, Product Engineering, and external partners to advance memory technologies while improving design quality, productivity, and development efficiency. Position Overview As a Senior or Graduate Engineering Intern, you will collaborate with experienced HBM architects and engineers to support the development of digital design methodologies, automation frameworks, timing analysis flows, and architecture validation solutions for next-generation HBM PHY and IO subsystems. This role offers hands-on experience in digital design, verification, automation, and timing analysis, while providing opportunities to leverage AI Assisted engineering workflows, Large Language Models (LLMs), and Generative AI tools to enhance engineering productivity and design efficiency. Responsibilities Support digital design, integration, and timing analysis activities for HBM PHY and IO subsystems, including timing constraint development and timing closure efforts. Develop an

Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM — Fab 10A, Singapore. Apply via Workday.

New College Grad - Mixed Signal Design Engineer, HBM — Richardson, TX. Apply via Workday.

New College Grad - Memory Design Engineer, HBM — Richardson, TX. Apply via Workday.

SoC Static Timing Analysis (STA) Engineer, HBM — 2 Locations. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the HIG HBM Product and System Engineering organization, you will be leading a team of engineers building the predictive models that determine how HBM is screened, dispositioned, and tested in high-volume manufacturing. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. You will collaborate with cross-functional teams across Product and System Engineering, Design Engineering, Test Engineering, Data Science, IT, and Manufacturing to prototype, build, and scale practical AI-driven solutions that improve quality, cost, cycle time, and engineering efficiency. Also, you will need to be experienced as people leader and manager and able to lead, manage and coach a group of engineers. Key Responsibilities Mentorship and Development: Actively mentor and develop tea

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimizati