Engineer Hbm Layout Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related brea

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future. Main Responsibilities: Process Development: Establish and improve process management projects to deliver technology node requirements and scaling for next node for wafer level process conditions and technologies including photolithography, dry etch, CMP, wet process, de

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Cost Engineer within MSH/ MSB Lean Manufacturing, you will be responsible for driving cost efficiency across High Bandwidth Memory (HBM), Component Assembly and Test, and SSD operations. You will collaborate with cross-functional teams to identify , implement, and govern cost improvement initiatives, ensuring alignment with site and network-wide financial goals. Main Responsibilities Manage and introduce cost improvement programs across manufacturing operations High-bandwidth Memory (HBM), Multi-Chip Packages (MCP ) and Low Power DRAM (LPDRAM) Component Assembly/Test/SSD . Perform month-end close activities and driv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction The Central Process Integration Engineering (cPIE) Loop Integration team drives process optimization, defect reduction, structural performance improvement, and technology integration across Micron's advanced DRAM and HBM manufacturing network. We are ready for the future! The team serves as the technical owner of critical process loops including FEOL, MOL, CAP, BEOL, Uniformity, and Backside Engineering, partnering closely with Process Engineering, Yield Engineering, RDA, Manufacturing, and Technology Development teams to accelerate yield learning and qualification readiness! Position Overview As a Senior Process Integration Engineer, you will own process loop performance across one or more critical semiconductor manufacturing modules. You will identify process interactions, drive yield improvement, characterize failure mechanisms, and enable successful deployment of new technologies from development through high-volume manufacturing. This role provides opportunities to influence process architecture, conversion strategies, inline monitoring systems, and technology ramp execution while collaborating with global engineering teams across multiple sites. In support of Micron's AI transformation, you will be expected to harness Artificial Intelligence tools and advanced analytics to improve engineering productivity, accelerate problem solving, and enhance process understanding. Responsibilities Drive process loop performance and structural optimization for assigned

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Technology Development — Advanced Modeling & AI Solutions (AMAIS) organization, you will be part of a multidisciplinary team developing next-generation Digital Twins, predictive modeling solutions, and AI-driven technologies that accelerate advanced memory development and manufacturing excellence. You will create predictive digital representations of semiconductor processes, materials, structures, equipment, and products across DRAM, NAND, and advanced packaging technologies including HBM. Leveraging physics-based modeling, computational methods, machine learning, GenAI, large language models (LLMs), and agentic AI frameworks, you will enable technology co-optimization, design-space exploration, process optimization, yield improvement, and accelerated technology learning. Working at the intersection of engineering fundamentals, manufacturing data, and digital engineering, you will develop scalable predictive and prescriptive solutions that connect process, structure, performance, yield, reliability, and cost. This role offers the opportunity to influence critical technology decisions, drive fab-technology co-optimization , and advance Micron's leadership in data-driven semiconductor memory innovation. Qualifications: Independence – be comfortable executing activities and needs Experience in algorithm development, numerical methods, and scientific computing Solid experience with Plasma, FPM, HAR etching, and MC modeling Experience with Wet Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Dry Etch Lead Principal Engineer at Micron Technology, Inc. Micron is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM, and other memory-based systems. As the only memory fab in the western hemisphere, Micron is in the industry for over forty-five years and continues to stay as the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and still growing. Responsibilities: Develop dry etch processes to meet physical and electrical product requirements Optimize processes to reduce cost, variability, and improve capability Collaborate with integration and process teams to develop innovative solutions Perform root cause and failure mode analysis and drive vendor improvements Support pilot line operations and transfer processes to production sites Minimum Qualifications: Bachelor’s degree in Engineering, Physics, or related field 3+ years of relevant experience including internships Strong analytical and creative problem‑solving skills Working knowledge of statistics and statistical process control Ability to manage multiple projects and work independently Preferred Qualifications:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Responsibilities: Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products Drive process capability, cost, and variability improvements using data‑driven experimentation and equipment innovation Collaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding Perform root‑cause and failure‑mode analysis a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is hiring an experienced MTS - Thermal Simulation Engineer! You would provide technical leadership in advanced thermal and thermo-mechanical modeling for next-generation High Bandwidth Memory (HBM) products. This role will define simulation strategy, solve complex thermal challenges across 2.5D/3D semiconductor packaging systems, drive physics-based model development and silicon correlation, and influence product, package, material, and process decisions across teams . Key Responsibilities Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration. Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions. Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures. Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior. Assess material prop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Introduction: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you eager to be a pioneer in AI and semiconductor breakthroughs? At Micron, we invite a passionate Staff Engineer, Collateral Integration Engineer to join our upbeat group. This opportunity offers the chance to work on innovative technology within a team-orie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are building a global Process Safety function that directly supports the next generation of memory technology. Our team partners across development, manufacturing, and EHS to ensure complex processes scale safely and consistently. If you’re energized by solving high-impact challenges and shaping global safety programs, you’ll find meaningful work here. In this role, you will help drive the Risk-Based Process Safety (RBPS) framework for High Bandwidth Memory (HBM) technologies. You’ll work across global teams to identify and handle safety challenges associated with processes in fast-paced development and manufacturing environments. Your expertise will influence how new technologies are safely developed, transferred, and scaled worldwide. Responsibilities: Lead RBPS governance and drive consistency across sites supporting HBM processes Partner with engineering and manufacturing teams to identify, assess, and mitigate process safety risks tied to new materials and complex processes Support Management of Change (MOC), ensuring timely risk assessments and closure of actions for tool, chemistry, and process changes Facilitate hazard analyses, audits, investigations, and share findings to improve system-wide performance Develop clear updates and guidance for leaders on process safety risks, trends, and program health Minimum Qualifications: Bachelor’s degree in Chemical Engineering, Safety, Industrial Hygiene, or related field 5+ years of experience in process e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates from other materials-intensive industries and research institutions to apply. Responsibilities Develop, characterize, qualify, and integrate advanced materials for next-generation memory and packaging technologies. Form hypotheses, design and run rigorous experiments, analyze data, and use the results to guide materials and technology decisions. Investigate materials behavior, including interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions. Drive materials development in areas such as: Polymer composites and encapsulation materials,