Engineer Hbm Layout Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior Engineer, MCT Operations Quality at Micron Technology, Inc., you will lead and collaborate closely with Global Assembly & Test (AT) sites, Global Quality, and various cross-functional stakeholders to drive on Manual Touchpoint Reduction. You will champion a Quality-First mindset by driving manufacturing solutions and end-to-end redesign initiatives to eliminate manual steps upfront that reduce operational error, prevent customer events and enhance product quality across Global AT network. Job Responsibilities: Lead global initiatives and collaborate with AT sites and Global Quality to identify and eliminate high-risk manual touchpoints across Assembly, Test/Post E, Module/SSD, HBM/PWF areas. Conduct onsite validation of the manual touchpoints at the source, identify quality risks, and propose improvements to eliminate the touchpoints. Collaborate with subject matter experts and drive the development and deployment of scalable solutions through physical automation/robotics, system automation, and Predictive Quality & Generative AI-enabled solutions. Collaborate with subject matter experts on end-to-end redesign initiatives to eliminate manual touchpoints upfront. Lead as the central team program governance to drive strategy, ali

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Department Overview: DRAM Engineering (DRAM Memory) focuses on designing and developing Micron’s industry leading dynamic random access memory products. The team drives process R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. We work across architecture, engineering, and business teams to evaluate innovative memory solutions and influence product direction. If you’re excited about solving complex challenges in DDR and emerging memory technologies, you’ll find strong impact and collaboration here! We are seeking an experienced Distinguished Member of Technical Staff (DMTS) Design Engineer to join the DRAM System team. This role is at the center of memory innovation. You will analyze current and next-generation memory technologies, identify performance and design gaps, and guide teams on future memory direction. Your work will directly influence architecture, product strategy, and competitive positioning, making it both highly visible and technically rewarding. This position is intended to be part of the Technical Leadership Program at Micron. This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Location: Boise, ID or San Jose, CA Responsibilities:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. Job Responsibilities: Perform linear and non-linear static analysis for package and material behavior Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages Develop multiphysics models (thermo-mechanical, therm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As MSH PDE Yield Enhancement (YE) Lead Engineer within Package Development Engineering (PDE), you will lead a team of YE Engineers responsible for yield performance, excursion management, and yield stabilization across High Bandwidth Memory (HBM) New Product Introduction (NPI) . This role is accountable for ensuring predictable yield ramps , fast learning closure , and robust manufacturing readiness for advanced HBM technologies. You will provide people leadership, technical direction, and execution governance , partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing, Quality, and Program Leadership to protect schedule, yield, and customer commitments. Job Responsibilities People & Team Leadership Build, lead, and develop a high‑performing MSH PDE YE team Set clear expectations on yield ownership, execution discipline, and escalation behavior Coach engineers on technical rigor, structured problem solving, and stakeholder communication Drive individual development plans, succession planning, and technical depth within the YE team Ensure sustainable on‑call / coverage models for critical NPI and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the HIG HBM Product Engineering organization, you will help drive the development of next-generation GenAI, machine learning, and advanced data analytics solutions for semiconductor engineering. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. You will collaborate with cross-functional teams across Product Engineering, Design Engineering , System Engineering, Data Science, IT, and Manufacturing to prototype, build, and scale practical AI-driven solutions that imp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Development Engineer in the Media Health team, you will act as a key interface between a variety of engineering groups and specialties, improving a diverse range of expertise to innovate new and improved test strategies, features, and technologies! You will have or develop guide capability with Probe, and/or ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering (DE) to run simulations pre-silicon to validate test strategies and Design for Test circuits. Provide feedback to DE, Test Engineering (TE), and others in Product Engineering (PE) Assist in pre-silicon checklist items and work with TE to define required tester resources Work with TE and PE to modify test programs for specific product requirements to ensure that silicon performance meets expectations Support TE by aiding in test program debug, data analysis, and test development Support fabrication sites and process integration through test development to increase effective process feedback Debug and identifying root causes for failures using test and experimental data, and elec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 【募集職種/Position Title】 Senior / Staff / Principal Process Development Engineer 【日本語】 MicronのDRAM Technology Development Process Development Teamは、MicronのDRAMおよびHBM (High Bandwidth Memory) 製品向けのプロセス技術、装置ソリューションを開発する、世界最高水準のエンジニアと技術専門家で構成された組織です。 当チームでは、先端DRAM、HBM、およびCMOS技術の開発を推進しており、リソグラフィ、CVD、ドライエッチ、ウェットプロセス、メタライゼーション、拡散、イオン注入、CMP、先端材料開発など、幅広いプロセス分野で経験豊富な人材を募集しています。 本ポジションでは、ユニットプロセス技術の探索、開発、最適化を担当し、プロセスインテグレーション、デバイス、設計エンジニアと連携しながら、装置メーカーや材料サプライヤーと協働して、次世代のDRAMおよびHBM向けの高性能かつコスト競争力のある技術開発を推進していただきます。 本ポジションでは、半導体プロセス開発、デバイス物理、CMOS技術に関する高度な知識が求められます。また、データ解析能力や材料分析、表面解析技術への理解も重要です。チームワークと高いコミュニケーション能力は、本職務で成功するための重要な要素となります。 歓迎する技術経験 以下の技術分野における実務経験をお持ちの方を歓迎します。 ・成膜技術 (CVD、ALD、PVD) ・エピタキシャル成長技術 (Si、SiGe、選択成長など) ・ゲートスタックおよび誘電体技術 ・先端パターニングおよびドライエッチ技術 ・ウェット洗浄および表面処理技術 ・イオン注入および熱処理技術 ・コンタクト形成、配線メタライゼーション技術 ・化学機械研磨技術 (CMP) ・ストレスエンジニアリングおよび先端材料統合技術 ・先端トランジスタ開発を含むロジック技術開発 ・メモリCMOSおよび周辺回路向けプロセスインテグレーション技術 主な職務内容 以下を含みますが、これらに限定されません。 ・デバイス、プロセスインテグレーション、および製品要求事項の理解 ・技術目標およびコスト目標達成に向けたプロセス技術ロードマップおよびサプライヤー戦略の策定 ・開発環境および量産環境におけるプロセスレシピの開発、最適化 ・構造解析、材料分析、および電気特性評価データの解析 ・デバイス性能、歩留まり、信頼性、およびコスト競争力向上に向けた技術革新の推進 ・AI（人工知能）を活用した開発業務の効率化、高度化の推進 ・社内関係部門および外部パートナーとの連携による複雑な技術課題の解決 ・技術戦略および開発方針に関する経営層への提言 ・エンジニアの育成、指導を通じた組織能力の向上 ・高い倫理観、オーナーシップ、および他者への敬意を持った業務遂行 応募資格（必須） ・電気工学、物理学、化学工

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DLT Shift Engineer within Advanced Packaging Technology Development Manufacturing Development Engineering (APTD MDE), you will provide shift-based execution support for Die Level Technology development activities in Taiwan. You will sustain development lot movement, respond to process and equipment abnormalities, support issue containment and escalation, and help maintain safe, efficient development execution across rotating day and night shifts. You will collaborate with Process Development, Process Integration, Manufacturing, Equipment Engineering, and other cross-functional teams to support HBM technology development. This role provides hands-on experience in advanced packaging processes, new equipment and material evaluations, Statistical Process Control (SPC), redundancy tool deployment, structured problem solving, and data-driven execution improvement. Key Responsibilities Shift-Based Development Execution Support DLT technology development in a rotating day- and night-shift environment, including development lot execution, abnormal lot response, and shift-to-shift communication. Monitor assigned development devices and DL

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. We are building a global Process Safety function that directly supports the next generation of memory technology. Our team partners across development, manufacturing, and EHS to ensure complex processes scale safely and consistently. If you’re energized by solving high-impact challenges and shaping global safety programs, you’ll find meaningful work here. In this role, you will help drive the Risk-Based Process Safety (RBPS) framework for High Bandwidth Memory (HBM) technologies. You’ll work across global teams to identify and handle safety challenges associated with processes in fast-paced development and manufacturing environments. Your expertise will influence how new technologies are safely developed, transferred, and scaled worldwide. Responsibilities: Lead Risk-Based Process Safety(RBPS) governance and drive consistency across sites supporting HBM processes Partner with engineering and manufacturing teams to identify, assess, and mitigate process safety risks tied to new materials and complex processes Support Management of Change (MOC), ensuring timely risk assessments and closure of actions for tool, chemistry, and process changes Facilitate hazard analyses, audits, investigations, and share findings to improve system-wide perfo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JOB DESCRIPTION As a High Bandwidth Memory Test Engineer at Micron, you will develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Micron Test Engineers support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. In this position, you will constantly learn new device specifications and operations in order to develop efficient and innovative solutions of production test flows thru test algo optimization. Additionally, you will take responsibility to gain a firm understanding of the functionality of advanced memory devices as defined in product data sheets. RESPONSIBILITIES AND TASKS: Independency of development of new tests and test algorithms for HBM, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times. Experienced on test programs development for products using primarily Python and C coding on automated test equipment in the given area followed by test program release to manufacturing area. Be a lead to new product introduction (NPI) as well as pre/post silicon tasks management. Develop test Automation solutions as electrical validation and qualification of new test equipment and tools. Independently debug and identify root causes on test issues and provide solutions across internal/external groups. Provide meaningful statistical data analysis, analytics and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JOB DESCRIPTION As a High Bandwidth Memory Test Engineer at Micron, you will develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Micron Test Engineers support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. In this position, you will constantly learn new device specifications and operations in order to develop efficient and innovative solutions of production test flows thru test algo optimization. Additionally, you will take responsibility to gain a firm understanding of the functionality of advanced memory devices as defined in product data sheets. RESPONSIBILITIES AND TASKS: Independency of development of new tests and test algorithms for HBM, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times. Experienced on test programs development for products using primarily Python and C coding on automated test equipment in the given area followed by test program release to manufacturing area. Be a lead to new product introduction (NPI) as well as pre/post silicon tasks management. Develop test Automation solutions as electrical validation and qualification of new test equipment and tools. Independently debug and identify root causes on test issues and provide solutions across internal/external groups. Provide meaningful statistical data analysis, analytics and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character