Hbm Mrda Shift Process Engineer Jobs

HBM Equipment Technician 輪班助理工程師 — Taichung - MTB, Taiwan. Apply via Workday.

HBM Talent Pool – Engineering, Manufacturing & Facilities (HBM人才專區-台中后里) — 2 Locations. Apply via Workday.

HBM SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM PRODUCTION OPERATOR — Taichung - MTB, Taiwan. Apply via Workday.

HBM Manufacturing Production Engineer — Taichung - MTB, Taiwan. Apply via Workday.

HBM ENGINEERING SUPPORT TECHNICIAN — Taichung - AATT, Taiwan. Apply via Workday.

HBM ASSY EQUIPMENT ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: ​ Accountable and sustain for Bond process. ​ Backup for Debond area process basic maintenance. ​ Establish and improve process condition and technology. ​ Upgrade tool capability and improve product quality. ​ Establish and modify process management projects. ​ Set up process parameters for a variety of semiconductor equipment. ​ Evaluation, promotion and planning of new equipment / materials. ​ Abnormal analysis and improvement. ​ Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement: ​ • Preferred to have over 3-year of working experiences in production line. ​ •

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Hardware Emulation Architect on the HBM architecture team you will be responsible for architecting, enabling, and deploying hardware emulation capabilities for next generation HBM products. You will work with design, verification, firmware, and system teams to determine emulation needs and opportunities. You will drive the development of hardware emulation ecosystem including procurement of hardware emulation platforms, creation of emulation testbenches and transactors, and development of emulation friendly verification IP. You will be responsible for proactively developing emulation capabilities to meet the needs of current and future products. You will also lead the effort to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Responsibilities will include, but are not limited to: Develop and maintain hardware emulation environments for complex SoCs and subsystems. Compile, configure, and debug large-scale RTL designs on emulation platforms (e.g., Palladium, Veloce, Zebu). Support pre-silicon validation, firmware bring-up, and early software development using emulation. Debug functional, performance, and connectivity issues across RTL, firmware, and system layers. Work closely with design, verification, firmware, and architecture teams to enable rapid debug and issue resolution. Create emulation testbenches, transactors, and models for system-level use cases. Enable hybrid validation flows (simulation + emulation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using Through Silicon Via (TSV) technology, we stack multiple DRAM chips with a high-speed interface die, significantly increasing memory density and bandwidth for next-generation AI/ML accelerators and high-performance computing platforms. Our designs target the industry's lowest power-per-bit and highest bandwidth, enabling the most demanding compute workloads. We are seeking a SI/PI Engineer in HBM Build Architecture to develop high-quality SI/PI analysis for interposers, packages, and silicon channels. This work contributes directly to HBM build sign-off and product success. You will be involved in complex, multi-disciplinary SI/PI initiatives spanning multiple HBM product generations — from early interposer channel analysis and equalization co-design, PDN architecture, and system PI analysis. You will ensure Micron's HBM SI/PI architecture remains the industry benchmark for signal quality, power delivery integrity, and interface reliability. This role supports the design and deployment of AI-enabled solutions that improv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1.HBM_TNR process yield maintain（machine alarm, SPACE alarm，product defect analysis） 2.Following PM spec to perform the machine PM 3. Perform the machine trouble shooting and draft the passdown 4. Maintain equipment area 6S 5. Submit the improvement ideas of equipment PM or troubleshooting 6. Reporting the abnormals or findings during daily work 7.Utilize AI-enabled tools to support troubleshooting, equipment maintenance, technical documentation, data review, and continuous improvement activities. Demonstrate the ability to effectively incorporate AI into daily work processes while ensuring accuracy, safety, and compliance. 8.Associate's or Bachelor's degree in Electronics, Electrical, Mechanical Engineering, or a related discipline. 9.New graduates and experienced candidates are encouraged to apply. Prior experience in the electronics or semiconductor industry is a plus. 10.Proficiency in basic English communication skills (listening, speaking, reading, and writing). About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR mem

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. You will also work on efforts to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing coll

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks Your main task will be operating Equipment. Manning of multiple machines Demonstrate ability to use computer based programs and applications to perform daily duties Provide machine coverage during breaks Logging machines accurately Monitoring and awareness of equipment performance discrepancies with timely communication to your Lead Working hours are 12 hours shift with biweekly rotation for day and night. Ensure Quality of Process and Product Run equipment based on current process specifications (e.g. procedures, change notifications, etc.) Organize own workstations and ensuring 6S Make suggestions to improve quality and safety Complete Certification and Recertification Participate actively in assigned on-the-job and other required training; asking questions to increase knowledge and abilities Complete certification requirements by demonstrating understanding and abilities Communication Information Receive and understand pass down, providing clear, accurate, and detailed pass down Seek and provide feedback to leadership, coworker, and support groups to make positive changes in performance Offer suggestions towards improvements when appropriate Always seek clarification when in doubt Contribute to a Safe and Compliant Work Environment Identify and promptly report hazards Follow safety protocols

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r