Package Engineering Engineer Jobs

AI Architect at Capco in Slovakia, Bratislava. From €3.5K/mo.

Data Architect at Capco in Czech Republic, Brno.

Data Architect at Capco in Slovakia, Kosice. From €3K/mo.

Data Architect at Capco in Slovakia, Bratislava. From €3K/mo.

As part of APTD Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead/contribute…

About the Job: LaunchDarkly is seeking a Senior International Accountant to manage and coordinate international accounting, reporting, and compliance activities for our subsidiaries’ operations in EMEA, Australia and India. The Senior International Accountant will partner…

Data Modelling Consultant (Insurance) at Capco in Czech Republic, Brno.

Data Modelling Consultant (Insurance) at Capco in Czech Republic, Prague.

Data Modelling Consultant (Insurance) at Capco in Slovakia, Kosice. From €2.5K/mo.

Data Modelling Consultant (Insurance) at Capco in Slovakia, Bratislava. From €2.5K/mo.

This engineer primarily supports and coordinates the preparation for new product launch activities: setup test station validate firmware confirm low power setup and FW for THB verify test script generate and release training package in Workday conduct training attend PDT meeting…

Job Title: Specialty Doctor in Adult Inpatient Psychiatry Grade: Specialty Doctor Location: Cambridgeshire Working Hours: 37.5 hours per week Salary: Competitive, to be discussed upon application We are seeking a Specialty Doctor or Associate Specialist to join a specialist…

About the Team The Plugin Developer Platform team builds the APIs, SDKs, and tools that let people extend ChatGPT and Codex. We work on plugins, connectors, the Model Context Protocol (MCP), and interactive apps. We want anyone to be able to turn a useful workflow into a plugin,…

The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a…

SoC Timing (Static Timing Analysis/STA) Engineer, HBM at Micron in United States. Full-time · On-site.