Package Engineering Engineer Jobs

The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a…

As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material…

About Anthropic Anthropic’s mission is to create reliable, interpretable, and steerable AI systems. We want AI to be safe and beneficial for our users and for society as a whole. Our team is a quickly growing group of committed researchers, engineers, policy experts, and…

As part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead new…

What We’re Looking For: We’re looking for architects to own key blocks on the A-0 and A-1 systems. This is a role with ownership of an entire sub-block, and you will need to understand how it fits into the entire system and work with other architects and architecture leaders to…

What We’re Looking For: We’re looking for a lead architect to own a large portion of the system architecture of the A-0 and A-1 products. Ideal Background: An ideal candidate will have: Experience leading the architecture of an entire system or subsystem (eg chip, board, die,…

What We’re Looking For: We’re looking for an architect to own the logical architecture for the A-0 and A-1 wafer products. You will work with the XPU/Compute chip architect and the memory architect to synthesize the final wafer-level architecture. Ideal Background: An ideal…

What We’re Looking For: We’re looking for PCB design engineers to design and own various PCB boards that are components in the A-0 and A-1 system assemblies. Ideal Background: Experience with high power density PCB design, validation and bringup Experience with chip package and…

What We're Looking For: We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team. Ideal Background:…

We’re looking for a hands-on process and materials engineer to own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing. Summary: Seeking an experienced engineer to lead wafer level mold and underfill…

We’re seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer capture pad design rules, OSAT engagement,…

Enterprise Account Executive at Flexport in Los Angeles, California, United States. Full-time · On-site · $83K – $105K/yr.

Enterprise Account Executive at Flexport in Canada. Full-time · On-site · C$91K – C$115K/yr.

Figma is growing our team of passionate creatives and builders on a mission to make design accessible to all. Figma’s platform helps teams bring ideas to life—whether you're brainstorming, creating a prototype, translating designs into code, or iterating with AI. From idea to…

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