Package Engineering Engineer Jobs

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness. This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an EMI / Signal Integrity Qualification Engineer/Senior Engineer in Micron’s Global Quality department, you will measure the electro-magnetic properties of Micron’s DRAM or NAND products. You will also validate their signal integrity. This includes defining test methods and specifications, specifying and maintaining laboratory equipment, understanding and applying relevant automotive quality standards such as AEC Q100, and ensuring on-time execution of measurements and data analysis. You will provide functional guidance to laboratory technicians to ensure accurate, timely data collection. You will also collaborate with Technology Development, Product Engineering, and QRA teams to resolve failing/marginal test results, and to ensure that test methods meet company, automotive, and customer needs. You will also be expected to drive continual improvement, both for efficiency and effectiveness, including using AI tools to improve data analysis, documentation, workflow efficiency, and engineering decision support. You will have the opportunity to contribute to innovation at Micron by developing new test methods to keep pace with Micron’s rapidly changing products, solving problems to enable new product introduction, publishing technical papers internally and externally, and sharing knowledge with engineering peers. Responsibilities & Tasks Lead RF package component and SSD qualification testing, including measurement execution, data analysis, and reporting. Develop, validate,

For over 20 years, Smartsheet has empowered teams to manage work seamlessly and scale solutions smarter. Now, in our most ambitious chapter yet, we are uniting human teams with AI agents. By orchestrating the work agents do best, automating manual tasks and uncovering insights at scale, we create the space for people to focus on what truly matters: judgment, creativity, and big thinking. That is magic at work, and it’s what we show up for every day. FedRAMP and GovRAMP (formerly StateRAMP) are transforming how Smartsheet serves government and regulated customers. We need a FedRAMP and GovRAMP subject matter expert to lead these programs—someone with real hands-on experience obtaining and maintaining ATO authorizations, navigating 3PAO assessments, and managing continuous monitoring requirements. In this role, you'll own Smartsheet's FedRAMP and GovRAMP certifications, manage relationships with our 3PAOs, drive annual assessment preparation, manage POA&M processes, and ensure we maintain authorizations at the highest level. You'll understand the nuances of federal compliance, speak fluently with government agencies and authorized assessors, and translate complex regulatory requirements into clear roadmaps for engineering and operations teams. You'll be the voice of federal compliance at Smartsheet and the trusted advisor to government customers on our security posture. You Will: Own FedRAMP and GovRAMP (formerly StateRAMP) certifications and roadmaps: Lead the overall strategy for obtaining and maintaining federal authorizations, including package management, compliance timelines, and authority coordination. Manage 3PAO relationships and assessments: Work with accredited third-party assessment organizations to conduct initial assessments and annual re-assessments. Coordinate scoping, evidence preparation, testing coordination, and results validation. Lead continuous monitoring (ConMon) execution: Oversee the delivery of monthly, annual, and event-driven Fed

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an HBM Power Delivery Network (PDN) Engineer , you will be part of the Heterogeneous Integration Group (HIG), responsible for the design, analysis, and optimization of power delivery networks for next-generation HBM products. You will work closely with architecture, design, physical design, packaging, and product engineering teams to ensure robust, efficient, and manufacturable power delivery solutions that meet aggressive performance, power integrity, and reliability targets. This is a hands-on technical role focused on PDN design, EM/IR analysis, and cross-domain optimization across technology, design, and layout. Key Responsibilities Design and develop SoC-level and HBM-cube-level power delivery networks for HBM designs, including power grid architecture, routing strategies, and decoupling schemes. Perform EM/IR analysis and optimization using industry-standard tools (e.g., Cadence RedHawk, Ansys Totem) to ensure power integrity across dynamic workloads. Collaborate with physical design teams on floorplanning, placement, and routing strategies to enable efficient PDN implementation. Drive power integrity closure across multi-mode/multi-corner scenarios, identifying and mitigating droop, noise, and electromigration risks. Work with package and system teams to co-optimize die-package-system PDN interactions, including bump/pad assignment and current distribution. Develop and validate power models, including activity-based current profiles and transient analysis for realistic

Software Engineer Job Description About the Role: We are seeking a talented and motivated Software Engineer to join our dynamic team. As a Software Engineer, you will play a crucial role in designing, developing, and maintaining high-quality software solutions. You will collaborate with cross-functional teams to deliver innovative products that meet the needs of our users. Responsibilities: Design, develop, and implement software solutions using various programming languages and technologies. Write clean, efficient, and well-documented code. Conduct thorough testing and debugging to ensure software quality. Collaborate with other team members to brainstorm ideas and solve problems. Stay up-to-date with the latest technologies and industry trends. Participate in code reviews and provide constructive feedback. Troubleshoot and resolve technical issues. Qualifications: Bachelor's degree in Computer Science, Engineering, or a related field. Strong programming skills in at least one of the following languages: Java, Python, C++, or JavaScript. Experience with software development methodologies (Agile, Scrum, etc.). Knowledge of database systems (SQL, NoSQL). Excellent problem-solving and analytical skills. Strong communication and teamwork abilities. Experience with cloud platforms (AWS, Azure, GCP) is a plus. What We Offer: Competitive salary and benefits package. Opportunities for professional growth and development. A collaborative and supportive work environment. The chance to work on cutting-edge projects. If you are passionate about technology and want to contribute to innovative projects, we encourage you to apply. To Apply: Please submit your resume and cover letter to [email protected] Please note that this is a general job description and may vary based on the specific requirements of the company and role.

Software Engineer Job Description About the Role: We are seeking a talented and motivated Software Engineer to join our dynamic team. As a Software Engineer, you will play a crucial role in designing, developing, and maintaining high-quality software solutions. You will collaborate with cross-functional teams to deliver innovative products that meet the needs of our users. Responsibilities: Design, develop, and implement software solutions using various programming languages and technologies. Write clean, efficient, and well-documented code. Conduct thorough testing and debugging to ensure software quality. Collaborate with other team members to brainstorm ideas and solve problems. Stay up-to-date with the latest technologies and industry trends. Participate in code reviews and provide constructive feedback. Troubleshoot and resolve technical issues. Qualifications: Bachelor's degree in Computer Science, Engineering, or a related field. Strong programming skills in at least one of the following languages: Java, Python, C++, or JavaScript. Experience with software development methodologies (Agile, Scrum, etc.). Knowledge of database systems (SQL, NoSQL). Excellent problem-solving and analytical skills. Strong communication and teamwork abilities. Experience with cloud platforms (AWS, Azure, GCP) is a plus. What We Offer: Competitive salary and benefits package. Opportunities for professional growth and development. A collaborative and supportive work environment. The chance to work on cutting-edge projects. If you are passionate about technology and want to contribute to innovative projects, we encourage you to apply. To Apply: Please submit your resume and cover letter to [email protected] Please note that this is a general job description and may vary based on the specific requirements of the company and role.

NVIDIA is searching for a highly motivated, creative embedded software engineer to join the GPU Software team. As someone who is hardworking and passionate about their work, you will design key aspects of our RISCV BSP package used across the GPU. You should demonstrate the ability to excel in an environment with complex software and hardware designs. What you'll be doing: Define, design, develop and verify features for next-gen RISCV controllers on our GPU; collaborating with hardware engineers and fellow software engineers You will follow the devices all the way through the development process to the customer desktops, notebooks, workstations, and gaming console products that are used throughout the world Heavily involved with the early modeling and simulation required to produce our world-class products Multiple opportunities to collaborate and communicate effectively with teams from all around the globe What we need to see: BS or MS degree in Computer Engineering, Computer Science, or related degree (or equivalent experience) 8+ years of meaningful software development experience, especially with embedded systems You can demonstrate a hands-on technical background; excellent C programming and embedded, device driver development experience Familiarity with computer system architecture, microprocessor, and microcontroller fundamentals (caches, buses, memory controllers, DMA, etc.) Ways to stand out from the crowd: Familiarity with the RISCV architecture Experience with inner workings of toolchains such as gcc, gdb Background with embedded system SW concepts, e.g.: RTOS and overlay programming models Experience with simulation, emulation and HW development cycle Good documentation and ab

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. AI adoptation and regular development and use is a must. Leveraging Artificial Intelligence is part of day to day operations Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug sessions, and failure analysis activities. Work closely with internal teams across build, product engineering, and manufacturing to resolve technical challenges. Assist in yield improvement and qualification efforts tied to customer programs. Minimum Qualifications: Bachelor’s or Master

EMPLOYER IS A CONTRACTOR FOR THE U.S. GOVERNMENT. Role Description We are seeking a talented Sr. Platform Engineer to join the Navy Delivery team. This role sits at the intersection of platform engineering, application development, DevOps, and application security. The ideal candidate will help application development teams successfully integrate, package, secure, deploy, and operate their software on the Unicorn Delivery Service (UDS) and Kubernetes-based environments. The successful candidate will understand both sides of the application/platform boundary. They should be comfortable working with application source code, APIs, containers, CI/CD pipelines, Kubernetes resources, Helm charts, and production runtime concerns. They will collaborate directly with application teams to understand how their software is built and operated, translate those needs into repeatable deployment artifacts and processes, and identify issues across application and platform layers. Experience developing or supporting modern web applications and APIs is particularly valuable. Current application teams use technologies including React, Vue, NGINX-hosted static assets, C#/.NET services, and Python/FastAPI services. Direct experience with every technology is not expected; we are looking for engineers who can quickly understand unfamiliar application architectures and help teams adapt them for secure, reliable deployment. As a Platform Engineer within our organization, you will join a team of dedicated unicorns focused on advancing freedom and independence globally. Our teams work across different technical baselines depending on the engagement. Although our products primarily operate at the platform layer, delivering successful outcomes for our Heroes also requires us to work closely with application teams on CI/CD components, runner deployments and maintenance, UDS packaging, Kubernetes and Helm configuration, application observability, security controls, and process automation. Res

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. AI adoptation and regular development and use is a must. Leveraging Artificial Intelligence is part of day to day operations Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug s

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most ambitious due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, the

About the Team Frontier Systems Foundations, part of Compute Foundations at OpenAI, builds the systems software foundation that turns new compute infrastructure into reliable, usable capacity for frontier model training. Our mission is to make some of the world's largest GPU clusters work reliably for frontier training. We bring new platforms and clusters online, safely maintain installed fleets, and partner with hardware, infrastructure, and research teams to resolve the system-level issues that keep jobs from running. That means building and maintaining the software closest to the machine: Linux and Ubuntu operating-system images, kernels and modules, drivers, packages and repositories, disks and boot configuration, firmware integration, provisioning, and system-level validation. We make these components reproducible, compatible, and safe to operate across heterogeneous fleets. About the Role We are looking for systems software engineers with deep Linux and host-systems experience to build, qualify, and maintain the operating-system foundation for OpenAI's frontier compute fleet. Relevant backgrounds include kernel and module development, Linux distribution or image engineering, package management, firmware and driver integration, disks and boot, and bare-metal provisioning. You'll work closely with hardware engineers, vendors, and infrastructure teams to bring up new platforms, integrate system components, and debug failures across firmware, disks, boot, operating systems, kernels, drivers, and workload interactions. Your work will directly influence how quickly new capacity becomes usable and how reliably large GPU fleets operate. You should be comfortable writing and maintaining production-quality systems software and automation, but we do not expect expertise across every layer. This is an opportunity to go deep on challenging systems problems while building the image, package, qualification, and recovery paths that power the next generation of frontier models

About the job Shape the power-delivery architecture behind Graphcore’s high-performance AI compute systems, from voltage regulation through package, PCB and silicon. As Staff Power Integrity Engineer, you will provide technical leadership on Graphcore’s most complex power-delivery challenges. Your analysis and judgement will directly influence architecture and product decisions. You will define modelling strategies, optimise decoupling and analyse PDN impedance, voltage droop, transient response and regulator interactions. You will turn complex results into clear engineering decisions, requirements and sign-off approaches. You will lead significant PI issues through resolution and create alignment across silicon, package, board, power, systems and validation teams. You will also develop reusable methods and mentor engineers, raising power-integrity capability across Graphcore. The team and culture The Signal and Power Integrity team sits at the centre of Graphcore’s hardware development. We work across disciplines to understand electrical behaviour and guide consequential architecture decisions. You will own complex PI problems and drive them through to resolution. Decisions are grounded in modelling, first-principles reasoning, hardware evidence and clear assessment of uncertainty. You will challenge assumptions, communicate risk clearly and help teams make pragmatic trade-offs. Technical influence matters more than reporting lines. What we’re looking for Deep practical expertise in power integrity and complex power-delivery network design. Strong understanding of PDN impedance, transient behaviour, voltage droop, resonance, stability and decoupling across high-current digital systems. Ability to reason across silicon, package, PCB, voltage regulation and system boundaries. Strong capability in electromagnetic modelling, circuit simulation, model extraction and selecting appropriate abstraction methods. Engineering judgement to assess model validity, uncertainty an