Packaging Value Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r

We take play seriously. We’re looking for curious adventurers ready to find their party, fueled by imagination and drive to build what’s never been built before. At Hasbro and Wizards of the Coast, you’ll collaborate with passionate teams to reimagine our iconic brands and create experiences that spark joy, connection, and community through the magic of play. This is your chance to shape legendary play that lasts a lifetime. Position Summary We are seeking a creative and passionate Graphic Designer to work under the supervision of the Graphic Design Leaders to develop innovative design solutions with high visual impact, create print and digital graphics that clearly convey messages, and meet key deadlines for projects. You will collaborate closely with cross functional teams to deliver packaging solutions that protect our products and captivate consumers on the shelf. Core functions will be developing packaging, instructions and eComm visuals/assets from initial conceptualization, branding to final production-ready artwork and managing brand/item level schedule. Responsibilities Develop package/instructions layouts based on brand DNA Create packaging-related presentation assets Produce 3D renderings and animations Consider and apply QA and legal package requirements to packaging/instructions Create illustrations, iconography, logos, and informational graphics Clip and retouch images Collaborate with the team to achieve key milestones and delivery dates. Manage brand/item-level schedules. Ensure alignment with cross functional teams Conduct and present trend research Qualifications / Requirements Bachelor's degree in Graphic Design, Fine Arts, 3D, Digital Design or equivalent experience 5+ years’ experience in related industry Skills Contribute to creative strategy with cross-functional team Attention to detail with a drive for excellence Deliver projects from concept to completion Work independently Comm

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As Package Characterization Lab Manager within Advanced Packaging Technology Development (APTD), you will lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. You will provide technical direction, own lab operational excellence and workforce development, ensuring timely, high‑quality results that directly impact critical APTD technical decisions. This role partners closely with Micron's global engineering labs, subject-matter experts and external vendors to expand lab capability, efficiency and ensure forward-looking readiness for new technologies. Responsibilities and Tasks Lab Management, Compliance & Audits Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards. Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency. Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime. Evaluate and introduce new FA tool models and capabilities in partnershi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of memory systems. Our DRAM Architecture organization works at the intersection of silicon, packaging, systems, and customers to build technologies that power next-generation platforms. If you enjoy solving ambiguous problems that matter at industry scale, this is the place. This role is a senior technical leadership position with broad architectural ownership. You will develop complete DRAM system architectures, impact industry direction, and engage directly with customers and executives to convert complex ideas into scalable products. Responsibilities: Define next-generation memory system builds focusing on performance, capacity, RAS, and telemetry Lead cross-stack co-optimization spanning silicon, package, module, board, and system Architect sophisticated RAS and telemetry features and translate system needs into silicon Drive long-range memory technology strategy and influence industry standards Act as a senior technical liaison to customers, executives, and partners Minimum Qualifications: Bachelor’s degree or relevant equivalent experience in EE, CE, CS, or a related field Extensive hands-on experience in DRAM or memory systems architecture Deep understanding of DRAM timing, signaling, power, and reliability mechanisms Proven ability to translate system requirements into silicon architecture Preferred Qualifications: Master’s degree or PhD, or equivalent experience, in a related technical field Recognized techn

Senior Visual Communication Designer In a nutshell: IDEO Shanghai is in search of a Senior Visual Communication Designer who will inspire and move both teams and clients using the craft of visual communication. Why is this role important for IDEO’s work? Visual Communication Designer makes the biggest impact to solving complex challenges by helping to bring ideas to life visually. We count on them to embody the belief that Creativity can give simple, human and delightful answers to the most complex problems in the world and encourage others to be creative as well by applying design to systemic problems and making the answer visual and tangible. Once here you will: Be called upon to work or consult on a wide range of things: brand identities and full brand implementation, graphics for retail spaces, packaging, workbooks and publications, rapid prototypes for consumer testing, illustrations of business ecosystems, exhibition graphics, user interfaces and even rolling your sleeves up to help create beautiful presentation decks. Work seamlessly with people come from diverse backgrounds to tackle complex challenge (including but not limited to Industrial Designer, Design Researcher, Business designer, Interaction Designer and Environments Designer); Get exposure to and involvement with all aspects of the design consultancy projects: research, inspiration gathering, brainstorm, strategy defining, concept development, prototyping etc.. Go out in the field and build empathy with users through activities like observing the life of a cosplay model and riding a car with a professional race car driver; What does IDEO offer you? IDEO is a place unlike any other. It’s a place where you can solve diverse, complex challenges for our clients or the organization, alongside thoughtful, intelligent individuals who lead with curiosity, empathy, and optimism. Sure we work hard, but we also intentionally craft moments that allow our community to pause, create, and connect. We encour

About Hark Hark is an artificial intelligence laboratory, building the most advanced, personal intelligence in the world. We believe that artificial intelligence can be used to help offload our mental workload through thinking like us and sometimes ahead of us. Intelligence that is proactive and personalised through new models capable of interacting with the world through speech, text, vision and persistent memory. We're pairing that intelligence with next-generation hardware to create a universal interface between humans and machines. While today's AI largely operates through chat boxes and decade-old devices, Hark is focused on what comes next: agentic systems that interact naturally with people and the real world. About the Role We are looking for talented people to help lead our brand design at Hark. Working with or multi-disciplinary group of designers to craft the brand, web, creative direction, packaging, retail and more. You care deeply about craft and branding and are capable of working at both a high level and with incredible detail. You will help define the narrative of hark, while also ensuring that the execution of every detail meets our standards, from ideation to the way people see it in the world. You are deeply ingrained into the culture of the world, care about the mission, creatively curious and love the craft of design. Responsibilities Leading brand at Hark Requirements You have 10+ years of experience on brand building and brand design across a variety of categories. Experience in crafting thoughtful, beautiful brand visuals, films and guidelines. Are able to clearly communicate these concepts through a variety of ways to the team. You're highly skilled in being able to visualise the work to keep the direction moving. Excellent verbal and written communication skills, internally and externally. You love the design process Experience hiring and growing talent. Compensation The US base salary range for this full-time

About the Team DoorDash Labs is a team within DoorDash building autonomous delivery robots and other autonomy solutions from the ground up for DoorDash's core delivery platform. If you have a passion for applying autonomy and robotics in a service used by millions of people daily, then we want to talk to you! About the Role We are seeking a hands-on Electrical Engineer to review the design, drawings, and schematics of the electrical systems for our 4-wheeled autonomous delivery robot. This role is responsible for delivering robust, production-ready hardware across high-speed digital design, PCBAs, RF integration, harnessing, and board-level packaging. This is a deeply technical position for someone who can move seamlessly between system-level thinking and detailed circuit execution. You're excited about this opportunity because... Develop electrical systems for a complex mobile robotic platform from concept through production. Lead high-speed digital design efforts (PCIe, MIPI, Ethernet, DDR, multi-gigabit SERDES, etc.). Own PCBA development including schematic capture, stack-up definition, layout guidance, impedance control, and design-for-manufacture. Drive RF integration (Wi-Fi, LTE/5G, GNSS, Bluetooth, RADAR, and LiDAR), antenna placement, layout constraints, and signal integrity. Develop and review cable harness designs, connector selection, grounding strategy, and environmental robustness. Collaborate closely with mechanical engineering on board packaging, thermal management, vibration resistance, and environmental sealing. Define and implement power distribution architecture, battery interfaces, protection circuits, and system monitoring. Ensure compliance with EMI/EMC and regulatory requirements (FCC/CE) (CISPR-25 and FCC Part 15 Class A). Support prototype builds and bring-up, debug hardware/firmware interface issues, root-cause failures, and drive corrective actions quickly. Establish design standards and perform detailed design reviews across the EE team.

Head of Enterprise GTM Strategy & Operations Reports to VP, Enterprise Sales · SF or NY Reporting to the VP of Enterprise Sales, this role owns both halves of Scale AI’s enterprise revenue engine: the strategy that determines where we play and how we win, and the operating system - people, process, and systems - that makes that strategy executable, measurable, and repeatable. On the strategy side, you set the analytical foundation for enterprise growth: segment and account prioritization, coverage and territory design, pricing and packaging inputs, and the diagnostic work that explains why the funnel behaves the way it does. On the operations side, you own the RevOps stack, forecasting, compensation design, sales enablement, and the operating cadences that convert strategy into predictable quarterly execution. The ideal candidate is equally comfortable building a segmentation model from a blank page and running a Monday morning pipeline review. You will lead an established team, with the Head of Sales Enablement and the RevOps Manager as direct reports. Your first job is to raise the ceiling on what that team delivers: sharper analysis, tighter operating rhythm, and enablement that measurably shortens ramp and lifts win rates. This is a senior, highly visible role partnering with Enterprise Sales leadership, Finance, Marketing, Product, and Solutions Engineering, with regular exposure to the executive team and board materials. STRATEGY Define which segments, industries, and accounts Scale prioritizes, and build the analytical case behind those choices Build and maintain the market sizing, segmentation, and account-tiering models that drive coverage decisions and investment trade-offs Lead hypothesis-driven analyses of the enterprise funnel - win/loss patterns, conversion drivers, deal economics, coverage gaps - and translate findings into specific changes to how we sell Partner with Finance and Product on pricing, packaging, and deal-structure strateg

Become an intern at the most recognised design agency in the world. Gain inspiring experience, work with and be mentored by extraordinary creative talent, start your journey with an idea… Terms: Design students, with a valid EU passport, can apply within their time of studying for a qualification or degree. Placements are available through the year and for a minimum of 3 months. Successful applicants will be interviewed and potentially placed. What you’ll do: Work alongside experienced designers with a dedicated mentor Work on branding and packaging projects Develop and expand design concepts, including research into brand worlds and design processes Gain experience from all stages of the design process, from concepts to artwork Send us your portfolio and a short introduction letter. Selected students will be invited for an interview and possible placement. #LI-DNI #LI-DNP

We are looking for a Shift Engineer to join our Engineering team, providing electrical and mechanical support across our manufacturing operation. You'll be responsible for maintaining production equipment, responding to breakdowns, carrying out planned preventative maintenance, and supporting continuous improvement initiatives to maximise plant reliability and efficiency. Working closely with Production and Operations teams, you'll play a key role in minimising downtime, improving performance, and ensuring all engineering activities are carried out safely and in line with food safety and quality standards. Shift pattern: 4-on-4-off Days & Nights (6am-6pm / 6pm-6am To carry out planned predictive and re-active maintenance of process, packaging and auxiliary equipment To carry out workshop duties such as machine repairs and component manufacture To retrain in new methodology, technology and engineering techniques as the business needs arise To train others in the plant, buildings and auxiliary equipment used on site To respond to machine & auxiliary failures Troubleshooting and fault finding on a range of electrical and mechanical plant equipment, packing machinery and site services. Installation, commissioning and repair of all plant and facilities To assist the Manufacturing Department with line adjustments, changeovers and breakdowns Responsible for improvements and reduction of downtime through increased efficiencies through your own ideas and input To take an active role in the Health and Safety requirements on site on behalf of the Engineering Department To be able to work unsupervised when tasked to do so and to organise the work of others in response to the site needs Work alongside and support the activities of all engineering contractors when they are on site Produce and maintain documents relating to the administration of all engineering tasks The job holder is required to do all tasks considered as relevant by their line manager Responsible for Food Safety

AGENT ALSO WELCOME AGE LIMIT - 50 YEARS CV SELECTION OR IF COMPANY REQUIRED THEN TAKING INTERVIEW IN SKYPE. ALL PERMIT IS :- S- PASS AND E- PASS SALARY DEPENDS ON CANDIDATE PROFILE. RESTAURANT SUPERVISOR 1 TO 2 YEARS EXPERIENCE REQUIRED / FLOOR ATTENDANT 1 TO 2 YEARS EXPERIENCE REQUIRED NETWORK ADMINISTRATOR 1 TO 2 YEARS EXPERIENCE REQUIRED / CIVIL ENGINEER 1 TO 2 YEARS EXPERIENCE REQUIRED ELECTRICAL ENGINEER 1 TO 2 YEARS EXPERIENCE REQUIRED PACKAGING SUPERVISOR 0 TO 1 YEARS EXPERIENCE REQUIRED HELPER HARD WORKING REQUIRED CANDIDATE HR MANAGER 2 TO 4 YEARS EXPERIENCE REQUIRED ADMIN ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED ACCOUNTANT 1 TO 2 YEARS EXPERIENCE REQUIRED COMPUTER OPERATOR 1 TO 2 YEARS EXPERIENCE REQUIRED BILLING ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED BUSINESS DEVELOPMENT MANAGER 1 TO 2 YEARS EXPERIENCE REQUIRED ALL PROCESS DONE IN 45 DAYS r ** ** WORK PERMIT PROFILE NO INTERVIEW DIRECT SELECTION ON CV. WELDER QTY - 10 SALARY 1200 SGD OT + FOOD + ACC + MEDICAL CARPENTER QTY - 15 SALARY 1300 SGD OT + FOOD + ACC + MEDICAL MASON QTY - 17 SALARY 1000 SGD OT + FOOD + ACC + MEDICAL ELECTRICIAN QTY - 20 SALARY 1500 SGD OT + FOOD + ACC + MEDICAL RIGGER QTY - 18 SALARY 1300 SGD OT + FOOD + ACC + MEDICAL HELPER QTY - 15 SALARY 900 SGD OT + FOOD + ACC + MEDICAL PIPE FITTER QTY - 22 SALARY 1000 SGD OT + FOOD + ACC + MEDICAL FABRICATOR QTY - 22 SALARY 1100 SGD + FOOD + ACC + MEDICAL DRIVER (LIGHT & HEAVY) - 35 SALARY 1100 SGD OT + FOOD + ACC + MEDICAL FOREMAN QTY - 30 SALARY 1600 SGD OT + FOOD + ACC + MEDICAL SERVICE CHARGE APPLICABLE HERE FEES ONLY REQUIRED BALANCE DEDUCTION IN YOUR SALARY AFTER YOUR JOINING. NO MEDICAL COST. NO AGENT FEES. NO REJECTION ONLY HERE PAY DOCUMENTATION FEES 10 WORKING DAYS YOU GET { IPA } IN PRINCIPAL OF APPROVAL. DOCUMENTS REQUIRED :- 1 PASSPORT COLOR COPY(FRONT & BACK SIDE) 2 EDUCATION QUALIFICATION CERTIFICATE 3 EXPERIENCE CERTIFICATE (IF ANY) 4 PHOTO P/P SIZE WHITE BACK GROUND 5 PREVIOUS VIS

Job Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. What we do: Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy to exceed the aspirations of our global customers. We are seeking a visionary Principal Engineer to lead the charge in Intel's foundry revolution, serving as a strategic technical architect and executive partner in guiding our most critical customers through the entire product development lifecycle. In this leadership capacity, you will orchestrate multidisciplinary strategies spanning device engineering, product integration, and yield analysis to steer customers from critical design tape-out and pre-silicon evaluation through to NPI silicon qualification. Furthermore, you will define t