Physical Therapist Assistant Jobs

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You’ll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we’d love to hear from you. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure. A hands-on problem solver who excels at debugging and driving signoff through complex verification flows. A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces. A mentor and technical leader passionate about building efficient, manufacturable silicon. What We Need BS/MS in Electrical/Electronics Engineering (or related) with 7–14 years of hands-on CPU/IP/SoC physical verif

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an exceptional Senior-level Physical Design Engineer to drive top-level implementation of our complex AI and CPU System-on-Chip designs. You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level. If you excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware, we need your expertise. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned physical design engineer who thrives on complex, full-chip implementation challenges. Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams. Passionate about optimizing chip-level implementations for power, performance, and area. Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules. What We Need 8+ years of top-level SOC physical design experience on complex, multi-million gate designs. Deep expertise in hierarchic

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an Physical Design Engineer to lead cross-functional efforts to solve complex physical design challenges and develop end-to-end RTL-to-GDS methodologies across advanced nodes, with a strong focus on PPA and runtime improvements. The engineer will architect, integrate, and deploy AI/ML-driven solutions into production physical design flows, creating custom CAD tools and partnering with internal teams and EDA vendors to drive next-generation, ML-enabled capabilities. This role is hybrid, based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are BS in Electrical or Computer Engineering (or equivalent experience) with 5+ years in Physical Design CAD methodology at advanced nodes. Proven track record improving PPA and/or runtime on high-performance, low-power taped-out designs. Hands-on with industry-standard EDA tools (e.g., Fusion Compiler) across synthesis, P&R, STA, signoff, and hierarchical flows. Strong Python/Tcl and data skills, with interest or experience in ML frameworks (PyTorch, TensorFlow), and the ability to drive complex projects independent

EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems. Job Title: Senior Physical Design Engineer Experience: 4–7 Years Focus: Block-Level RTL-to-GDSII & PPA Optimization Location: Bangalore Hybrid The Role We are looking for a high-energy, technically curious Physical Design Engineer to join our advanced silicon team. This isn't a role for someone who wants to just "push buttons" on a vendor flow. We need a driver—someone with 4–6 years of experience who has lived through the trenches of quality tape-outs and is hungry to take full ownership of complex partitions. You will be expected to work with a high degree of independence, using your analytical skills to bridge the gap between a standard recipe and a world-class PPA result . You should be comfortable following expert lead direction while maintaining the "question the status-quo" mindset when you see a more efficient path. Key Responsibilities Partition Ownership: Lead the physical implementation of complex blocks from Synthesis and Floor-planning through to CTS, Routing, and Sign-off. PPA Recipe Development: Don't just run the flow—optimize it. You will perform deep-dive analysis on timing paths, power profiles, and congestion to derive custom optimization strategies. Automation-First Mindset: Use Tcl and Python to automate repetitive tasks, build custom analysis scripts, and enhan

EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems. Job Title: Principal Physical Design Engineer (RTL-to-GDSII) Experience: 14+ Years Technology Focus: Sub-5nm (3nm/2nm) Location: Bangalore Hybrid The Vision We are seeking a Principal Physical Design Engineer who thrives on complexity and rejects the "black box" approach to EDA tools. This role is for a First Principles thinker who questions the status quo. If a standard flow isn't yielding the desired PPA (Power, Performance, Area), you dive into the PDK, the tool algorithms, and the methodology to find a better way. You are responsible for transforming raw RTL into world-class silicon by eliminating systemic bottlenecks and building a scalable, predictable path to GDSII. Key Responsibilities Full-Flow Ownership: Lead the implementation of massive, high-speed blocks/SoCs from Synthesis through Sign-off using the Cadence Digital Suite . PPA Optimization: Push the theoretical limits of the PDK and tools. You will analyze and optimize the interplay between library cells, metal stacks, and tool engines to squeeze out every millivolt and picosecond. Methodology & Scalability: Build and refine a "Push-Button" style execution methodology that is robust, repeatable, and minimizes manual "human-in-the-loop" iterations. Cross-Functional "Left-Shift": Collaborate with RTL, Architecture, and DFT te

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. As a Senior Chiplet Physical Design Engineer at Tenstorrent, you will work on a high-profile, cutting-edge program designing and integrating multiple chiplets into a System-in-Package (SiP). You’ll collaborate closely with Tenstorrent experts and leaders across the USA, Japan, and other global sites, as well as external partners, to deliver world-class CPU and AI silicon. In this role, you will own critical aspects of synthesis and place-and-route for high-speed CPU core designs, contributing directly to performance, power, and area outcomes on advanced process nodes. This role is remote, based out of The United States. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An experienced physical design engineer with at least 10 years of relevant experience, who thrives in complex, multi-stakeholder projects. Detail-driven, with a strong sense of ownership from synthesis through design closure. Comfortable working at advanced nodes (3nm and below) and multi-GHz designs. A collaborative team player who enjoys mentoring others and influencing methodology. Clear communicator who can balance technical depth with schedule and resource constraints. &nbsp

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking talented Physical Design Engineers to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid , based out of Austin, TX, Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts. Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration. Strong problem solver who excels at debugging complex issues across design hierarchies. Collaborative team player who thrives in fast-paced, technically challenging environments. What We Need BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs. Expertise with industry-

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will be joining a brilliant team to collaborate with Micron’s various design and verification teams all over the world, support the efforts of design verification flow development, optimization, and implementation and work with cross-functional team to assure the best cost, quality, reliability, time-to-market, and customer satisfaction As Memory Design Group CAD Engineer at Micron Technology, Inc., you will be working in a collaborative, production support role evaluating, developing enhancing and debugging both in-house and commercial Electronic Design Automation (EDA) tools and flows for the physical layout and design of CMOS integrated circuits. You will work closely with the Design, Layout teams, supporting their use of electronic design automation tools and methodologies to increase design and layout productivity and work efficiency. Responsibilities : Develop tools, flows, and methodologies to increase the productivity and reliability of our Memory designs Integrate commercial EDA (Electronic Design Automation) tools into design flows Provide training, documentation, and support to end users on new tools and method. Work closely with design, layout, verification and process teams. Undertake independent research and development of ne

Digital Physical Implementation and Integration Engineer — San Jose, CA. Apply via Workday.

CPU Physical Design Engineer — India, Bangalore. Apply via Workday.

SoC Physical Design Engineer, Senior Member of Technical Staff (SMTS) — 2 Locations. Apply via Workday.

CPU Physical Design Engineer — Texas, Austin. Apply via Workday.

NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities which are hard to solve, that only we can pursue, and that matter to the world. This is our life’s work, to amplify human inventiveness and intelligence. We are now looking for a motivated Senior ASIC Physical Design Engineer, Netlisting to join our dynamic and growing team. If you want to challenge yourself and be a part of something great, join us today! NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing! More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities which are hard to tackle, that only we can pursue, and that matter to the world. This is our life’s work, to amplify human inventiveness and intelligence. What you'll be doing: You will drive physical design of high-frequency and low-power CPUs, GPUs, SoCs at block level, cluster level, and/or full chip level, with a focus on netlist-related aspects such as equivalence checking, asynchronous checking including clock domain crossing checks and MTBF analysis, logic synthesis, netlist quality checks, etc. Help in all aspects of physical design, such as driving timing convergence, timing constraints generation and management, and ECO generation and implementation. What we need to see: BS (or equivalent experience) in Electrical or Computer Engineering with 5&#43

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are currently looking for motivated individuals to join Micron Technology Inc. Central Engineering (CE) - Product Yield Improvement (PYE) Engineering Team. As CE PYE Failure Analysis (FA) Engineer for Micron Technology, Inc., you will be responsible for providing full fault isolation and failure analysis support for qualifications, customer returns, new device introduction, and general test failures. You will become the domain expert on fault isolation and physical failure analysis methods for any given electrical failure. As the CE PYE FA Engineer, you will be responsible for understanding all relevant physical analysis methods to isolate electrical failures by working closely with Product Engineering Teams. You will also have a detailed understanding of the product architecture, process flow, and test sequence to work with Process Integration, Product, Test, and Quality Reliability Assurance Engineering groups ensuring physical defect descriptions are classified. Responsibilities: Advanced Electrical device characterization to identify electrical fail mechanism. Operate fault isolation equipment to narrow failure defect location. Perform physical failure analysis to identify physical defects. Establish and hypothesize possible electrical or process fail mechanism based on electrical fail model and physical failure analysis characterization, to support process improvement. Work closely with various stake holders from frontend to backend and Global Quality (GQ)