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Physical Therapist Assistant Jobs

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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will be joining a brilliant team to collaborate with Micron’s various design and verification teams all over the world, support the efforts of design verification flow development, optimization, and implementation and work with cross-functional team to assure the best cost, quality, reliability, time-to-market, and customer satisfaction As Memory Design Group CAD Engineer at Micron Technology, Inc., you will be working in a collaborative, production support role evaluating, developing enhancing and debugging both in-house and commercial Electronic Design Automation (EDA) tools and flows for the physical layout and design of CMOS integrated circuits. You will work closely with the Design, Layout teams, supporting their use of electronic design automation tools and methodologies to increase design and layout productivity and work efficiency. Responsibilities : Develop tools, flows, and methodologies to increase the productivity and reliability of our Memory designs Integrate commercial EDA (Electronic Design Automation) tools into design flows Provide training, documentation, and support to end users on new tools and method. Work closely with design, layout, verification and process teams. Undertake independent research and development of ne

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Our Purpose Mastercard powers economies and empowers people in 200+ countries and territories worldwide. Together with our customers, we’re helping build a sustainable economy where everyone can prosper. We support a wide range of digital payments choices, making transactions secure, simple, smart and accessible. Our technology and innovation, partnerships and networks combine to deliver a unique set of products and services that help people, businesses and governments realize their greatest potential. Title and Summary Senior Physical Security Analyst Overview • Physical security and compliance security officer, maintains and monitors physical security policies, standards, and best practices • Abides by Security guidelines relative to security standards to provide safety and security of staff and assets • Manages Security Control Center Coordinators and security operations. • Manages and administers physical security functions for company facilities to ensure the safety; security and protection of MasterCard employees and asset • Recognizes potential and realized security threats and takes reasonable action to mitigate risk or injuries to personnel and or property • Provides MasterCard Corporate Security Standard Operating Guidelines security supervisors and follows-up to ensure adherence • Manages Security officers by delegating department projects, tasks and assignments • Manages Security staff schedules to ensure proper coverage at all times Role • Interaction with employees and guests, provide direction on security policy and visitor directions as needed • Operational use of security systems • Trains and supervises Security officers with respect to the execution of established physical security policies, programs and procedures • Recommends the development and implementation of physical securi

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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron NAND Technology Integration (NTI) Singapore is seeking a Yield Enhancement Physical Failure Analysis Technician to be responsible for providing physical failure analysis for next-generation Micron products. In this meaningful role identification and communication of failure mechanism and assisting with the root cause analysis for yield issues. You will need to be knowledgeable and have hands on experience with physical analysis tools such as but not limit to acid hood operation, polish wheel, delayer techniques with wet/dry etch, SEM, dual beam FIB, and STEM lamella creation. You will also help support the transfer of physical failure analysis processes into production. Qualifications: Self-motivated and enthusiastic to find creative solutions to the challenges<

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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an SoC Physical Design Senior Manager, HBM in the Heterogeneous Integration Group (HIG), you will lead a team of physical design and physical verification engineers responsible for implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tapeout. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Recruit, develop, and mentor a team of physical design engineers delivering HBM base die products. Plan project resourcing requirements and timelines. Prioritize resources across projects and individual assignments to meet aggressive product delivery schedules. Drive physical implementation for SoC blocks and/or top-level including floorplanning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Collaborate with design and integration teams to ensure clean implementation of clocking/reset strategy, power architecture, and SoC integration requirements. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust

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EA
EnCharge AI
📍 Us Remote• Remote• $170K – $240K/yr
1mo ago

EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems. About the Role EnCharge AI is looking for a highly motivated and experienced Staff Physical Design Engineer to drive the physical implementation of our next-generation semiconductor chips. In this role, you will play a critical part in translating complex microarchitectures into high-performance, power-efficient silicon. Working closely with cross-functional teams, you will own block-level and top-level implementation using industry-standard EDA tools, tackle complex timing closure and power challenges, and guide designs all the way from netlist to successful foundry tapeout. Key Responsibilities Drive block-level and top-level physical design, including floor-planning, placement, clock tree synthesis (CTS), and routing. Achieve aggressive timing, power, and area (PPA) targets through advanced timing closure techniques. Perform power grid verification and manage electromigration and IR drop (EM/IR) analysis and resolution. Develop and maintain automation scripts (Tcl/Python) to streamline design flows and methodologies. Collaborate with physical verification and foundry teams to ensure design rule compliance and successful tapeout execution. Qualifications and Requirements Bachelor's or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. 10–15 years of dedicated experience in physical design. Strong understanding of EDA implementation flows

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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Physical Verification Engineer, you will be a key technical contributor within the Heterogeneous Integration Group (HIG), responsible for defining, executing, and driving sign-off quality physical verification flows for next‑generation HBM logic die and memory‑centric SoCs. You will work across physical design, design rule development, EDA tool teams, foundry interfaces, and product engineering teams to deliver industry‑leading, tape-out-ready silicon under aggressive schedule, quality, and reliability constraints. This role combines full-chip physical verification ownership — including DRC, LVS, ERC, and DFM — with deep collaboration across implementation and silicon bring‑up, ensuring design integrity from layout through first silicon. Responsibilities will include, but are not limited to: Implement physical verification sign‑off for full‑chip and hierarchical designs, including Design Rule Check (DRC), Layout Versus Schematic (LVS), Electrical Rule Check (ERC), Physical Electrical Rule Check (PERC), antenna checking, and Design for Manufacturability (DFM). Implement and

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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑performance, low‑power digital logic used in advanced memory products. This role spans backend implementation from Netlist to GDSII, with a strong focus on timing closure, power integrity, and manufacturability in advanced process technologies. The successful candidate will work closely with RTL, DFT, CAD, and verification teams to deliver high‑quality physical designs, contribute to methodology improvements, and help push performance, power, and area (PPA) targets in complex, multi‑hierarchy designs. Key Responsibilities: Own and execute physical design implementation from synthesized netlist through GDSII, including floorplanning, placement, clock tree synthesis, routing, and physical signoff Utilize AI-Enabled tools in the Netlist to GDS flow Perform and drive timing closure across multiple modes, corners, and scenarios using industry‑standard STA tools Analyze and resolve congestion, timing, IR drop, EM, and power integrity issues Develop and refine floorplans, power grids, and clocking strategies for high‑performance designs Work with placement and timing closure of custom analog hard IP macros in a digital-on-top design flow Collaborate closely with RTL designers to influence partitioning, constraints, and micro‑architecture decisions early in the design cycle Implement and va

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NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. With the continuous improvement of chip technology, design scale and performance/power ratio, the physical design of digital chips is facing outstanding challenges in high frequency, low power consumption and multiple applications. High efficiency, high quality of the implementation of the construction chip is the guarantee of the company's competitiveness. As an ASIC-PD intern at NVIDIA, you'll learn and work on the tasks from RTL frozen to tape out, include synthesis, formal verification, constraints definition, timing closure/sign off, study on the timing impact of process and related methodology work. What you'll be doing: Chip integration and netlist generation, cross-team collaboration to implement chip partitioning and floorplan Synthesis, RTL/netlist quality check, formal verification, function eco creation Constraints creation and validation, timing budget, work with ASIC team to analyze/resolve function timing issues, achieve all special timing closure, such as io, test, clock, async etc. Work in conjunction with PR engineers for chip implementation to achieve full chip timing closue Develop and improve entire timing closure flow from frontend (pre-layou

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By submitting your resume, you’re expressing interest in our 2027 RDSS (Research and Development Substitute Services) program. Please confirm your eligibility with the local district office before applying the role. NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. With the continuous improvement of chip technology, design scale and performance/power ratio, the physical design of digital chips is facing outstanding challenges in high frequency, low power consumption and multiple applications. High efficiency, high quality of the implementation of the construction chip is the guarantee of the company's competitiveness. As an ASIC-PD engineer at NVIDIA, you'll be responsible for the stage from RTL frozen to tape out, include synthesis, formal verification, constraints definition, timing closure/sign off, study on the timing impact of process and related methodology work. You will face the biggest challenge based on the most advanced process on building chips in the world. What you'll be doing: Chip integration and netlist generation Synthesis RTL/netlist quality check </li

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M
2mo ago

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Physical Design Engineer-DPG-LPDDR at Micron, you will work on innovative memory and storage solutions. These solutions help transform data into intelligence quickly. You will join a dedicated team collaborating to develop world-class products that set industry standards. Key Responsibilities Lead end-to-end RTL-to-GDSII implementation for complex SoCs across advanced technology nodes. Drive floor planning, power planning, CTS, place & route, timing closure, and physical signoff. Own PPA optimization, low-power implementation, congestion management, and design convergence. Lead STA, SI, EM/IR, DRC, LVS, and reliability closure to achieve tape out readiness. Define physical design methodologies, automation strategies, and flow improvements. Partner with Architecture, RTL, DFT, Verification, CAD, and Product Engineering teams to resolve complex implementation challenges. Provide technical leadership, mentor engineers, and drive execution across global teams. Hands-on custom layout design experience is a strong value-added skill, enabling analog/mixed-signal integration, layout optimization, and advanced-node design challenges Leverage Artificial Intelligence (AI) tools to improve RTL-to-GDSII design productivity, quality, and turnaround time. Drive adoption of Generative AI and Agentic AI solutions for physical design automation, design closure, and engineering workflow optimization. <p

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