Soc Compute Memory Subsystem Architect Jobs

The IR Manager will work closely with the SOC team and report directly to the Head of Cybersecurity Operations. This role is responsible for managing the lifecycle of security incidents, ensuring investigation, response, and recovery, while driving continuous improvements in incident response processes and playbooks. Source: Adani Group | Job ID: 55724

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. You will also work on efforts to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing coll

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. At Tenstorrent, we’re building cutting-edge hardware and software solutions that power AI, HPC, and general-purpose workloads. As a Performance Architect on our Platform Architecture team, you’ll work across ML software stacks, compilers, CPU design, cache coherency protocols, and interconnect fabrics to shape the future of high-performance systems. This role is all about bridging software execution and silicon design—making data-driven decisions that directly influence our SoC performance. This role is remote, based out of The United States. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Passionate about solving complex system-level performance problems. Comfortable working across hardware and software boundaries. Analytical and data-driven, with a talent for turning workloads into architectural insights. Collaborative, thriving in cross-functional teams spanning compilers, CPU, and interconnect. Excited to shape the future of AI/HPC platforms through performance architecture. What We Need BS/MS/PhD in EE, ECE, CE, or CS Deep understanding of NoC topologies, routing algorithms, QoS, and traffic scheduling. Expertise in cache coherenc

HBM SOC Design Engineer — Richardson, TX. Apply via Workday.

NOC / SOC Shift Lead (2nd Shift) — Hampton, VA. Apply via Workday.

Senior SOC Physical Design Engineer, HBM — Richardson, TX. Apply via Workday.

NOC / SOC Technician (2nd Shift) — Hampton, VA. Apply via Workday.

NOC / SOC Technician (2nd Shift) — Hampton, Vatican City State (Holy See). Apply via Workday.

Senior SoC Chiplet Architect — 6 Locations. Apply via Workday.

Custom SOC IP Verification Engineer — 2 Locations. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Seeking a Principal Engineer – ASIC SoC Design to drive IP, Subsystem, and SoC development for next‑generation memory and storage products, requiring strong hands‑on expertise in micro‑architecture, RTL design, and end‑to‑end SoC execution, along with close collaboration across global teams. Key Responsibilities Own end‑to‑end IP and SOC development from micro‑architecture through RTL compose, integration, and physical hardware assistance. Own IP and Subsystem design from scratch, ensuring high‑quality, reusable RTL. Drive SoC integration, including CDC, lint, synthesis, STA, and power analysis. Define and review module interfaces and system‑level architecture. Collaborate closely with Architecture, Verification, FW, DFT, Synthesis, and Physical Design teams. Support post‑silicon debug and bring‑up activities. Provide technical mentorship and participate in design and methodology reviews. This role is expected to utilize Micron-approved AI tools and AI-enabled workflows to improve engineering productivity, design quality, automation, and decision-making across the SoC development lifecycle. The engineer will apply AI-assisted solutions for design analysis, documentation, coding, debug, and workflow optimization while ensuring compliance with Micron AI governance standards. Required Qualifications 12+ years of hands‑on IP & SoC RTL design experience. Strong expertise in micro‑architecture, Verilog/System Verilog, and RTL integration. Solid kn

What We Do: Cybercrime is growing, and more businesses are getting hit by threats that used to target only the biggest organizations. That pushes defenders like us to operate at the highest level, and it deepens our need for good people who want to make a meaningful impact. Founded in 2015 by former NSA cyber operators, Huntress is a remote-first team working to make enterprise-grade cybersecurity accessible to businesses of all sizes. We work closely with security teams and service providers protecting complex environments, often without the time or headcount to handle it all. That’s why we build our technology in-house and back it with a 24/7 human-led Security Operations Center (SOC). As a result, our platform is never disconnected from the experts who manage it, ensuring our customers' protection. Huntress now secures more than 5M endpoints and 16M identities worldwide. Those numbers keep growing because more businesses rely on us to help carry the load and operate with more confidence. Every day, you can see that commitment in how we stand with our customers and how we show up for each other. Reports to: Director, Engineering Location: Remote US, Only Compensation: $165,000 to $190,000 base plus bonus and equity What You’ll Do: Huntress is building an Agentic SOC. When our detection pipeline raises a signal, an LLM-based agent picks it up and investigates it end-to-end. It gathers telemetry across our products, reconstructs what happened, and makes a well-documented determination about whether the activity is malicious. Over time, it will take on more of the work itself, growing from resolving routine cases to acting fast when it finds an attack and handing analysts cases with the evidence already assembled. This system is meant to augment our analysts, not replace them. It takes the high-volume, repetitive work off their plates so they can focus on complex cases and hands-on keyboard intrusions where human expertise matters most. It also reduces toil in