ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION β Taichung - Fab 16, Taiwan. Apply via Workday.
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Advanced Packaging Technology Development Director Jobs
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Explore current advanced packaging technology development director jobs. Use filters to narrow by work mode, employment type, experience and date posted.
Director - Foundry Advanced Packaging Business Development β US, California, Santa Clara. Apply via Workday.
Package Architect β Advanced Packaging & System Exploration β 2 Locations. Apply via Workday.
Metro RDA Senior Manager (Package Development for Advanced Packaging) β Fab 10A, Singapore. Apply via Workday.
Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) at Micron in Hyderabad, Phoenix Aquila, India. Full-time Β· On-site.
Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering β Fab 10A, Singapore. Apply via Workday.
What We're Looking For: We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team. Ideal Background:β¦
We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability,β¦
Weβre looking for a hands-on process and materials engineer to own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing. Summary: Seeking an experienced engineer to lead wafer level mold and underfillβ¦
Weβre seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer capture pad design rules, OSAT engagement,β¦
Job Responsibilities Perform electrical and physical failure analysis on advanced packaging products to identify root causes of defects and failures using advanced failure analysis tools. Perform sample preparation, cross-sectioning, decapsulation, polishing, microscopyβ¦
As a Metro Real-time Defect Analysis (RDA) Shift Engineer, you will be responsible for ensuring stable, continuous, and safe operation of advanced packaging equipment platforms, with a strong focus on New Product Introduction (NPI) and early-life production phases. You willβ¦
As a Quality Metro Real-time Defect Analysis (RDA) Engineer, you will be responsible for enabling robust quality monitoring, early detection, and rapid containment of quality risks across advanced packaging and NPI manufacturing environments. You will focus on leveraging RDAβ¦
As a Metro Real-time Defect Analysis (RDA) Process & Equipment Engineer, you will be responsible for developing, deploying, and sustaining RDA capabilities that enable robust process control and equipment performance across advanced packaging and New Product Introduction (NPI)β¦
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