Design Manager Jobs

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Life at Intel We developed the Intel microprocessors, a foundational technology that powers a diverse range of devices-from entry-level PCs to high-end gaming desktops and laptops, as well as data center solutions and many other applications. As part of our team, you will help design the next generation of high-performance microprocessors. We are looking for a skilled individual who is hands-on with RTL implementation for integer, floating point and reservation station logic and can provide technical leadership to deliver world-class products. As a CPU RTL Logic Design Engineer your responsibilities will include but are not limited to: • Collaborates, drives and develops logic design, register transfer level (RTL) coding, and simulation for a CPU required to generate cell libraries, functional units, and the CPU IP block for integration in full chip designs. • Participates actively in the definition of architecture and microarchitecture features of the CPU being designed. • Applies various strategies, tools, and methods to write RTL and optimize logic to qualify the design to meet power, performance, area, and timing goals as well as design integrity for physical implementation. • Reviews the verification plan an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are shaping the memory technologies that power today's most advanced computing platforms, from AI accelerators to mobile and client devices. Our DRAM Engineering team brings together skilled engineers across the globe to solve complex technical challenges, drive innovation, and deliver high-performance memory solutions. If you enjoy tackling difficult problems and turning ideas into products, you'll find exciting opportunities to make an impact here. As a Semiconductor Design Engineer (Principal / Member of Technical Staff / Senior Member of Technical Staff), you will play a key role in designing and optimizing next-generation DRAM products. You will work closely with global design, verification, and multi-functional teams to develop innovative circuit solutions that balance performance, power, quality, reliability, and cost. This role also offers the opportunity to influence technical direction, mentor engineers, and help advance future memory technologies. Responsibilities: Design and optimize digital and analog circuits for next-generation DRAM products, including memory arrays, control logic, datapaths, address decoding, and I/O circuitry. Lead circuit development, simulation, verification, and silicon validation to achieve performance, power, area, and quality targets. Drive floor-planning, layout optimization, parasitic analysis, and tape-out activities. Advance AI-assisted design, automation, and design-space exploration through collaboration with internal and external partne

About the Team DoorDash completes over 2.5 billion deliveries per year and is investing heavily in the next generation of delivery automation. This role is part of a small, high-impact team building a new autonomous system from the ground up, with the potential to eventually operate at a massive global scale. We haven’t publicly announced this specific project yet. We are seeking a highly capable, driven, and passionate mechanical engineer to design and develop high performance electric motors. The primary application of these motors is unmanned aerial vehicle (UAV) propulsion. There are other important motors on our aircraft and within ground equipment that we may decide to develop in house as well. About the Role This is an exploratory product space with significant opportunity for architectural ownership. This role is on-site in San Francisco’s mission district at least 3 days per week. Availability to be onsite 5 days per week is required with flexibility to work from home as appropriate. Occasional travel to suppliers is expected. You will operate in a very fast-paced, prototype-driven environment where hands-on engineering and rapid iteration are encouraged. We provide access to a full machine shop with welding equipment, additive manufacturing tools, electrical integration tools, and significant in-house test capability to enable efficient concept-to-hardware development. This is a senior role that offers autonomy, cross-functional collaboration, mentoring, and opportunities for increasing responsibility. You're excited about this opportunity because... Collaborate closely with: Electro-mechanical design experts on winding and magnet design. Internal, domestic and foreign manufacturing partners Electrical, systems, structural, aerodynamics, reliability, and test engineers as well as industrial design to refine requirements. Design mass and volume optimized rotor and stator structures. Bearing selection and bearing system design. Electrical wiring and co

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most ambitious due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, the DRAM Design organization develops industry-leading memory solutions that span technology development, advanced circuit design, product engineering, system validation, and manufacturing enablement. Teams collaborate globally to deliver innovative memory products that meet demanding requirements for performance, quality, reliability, and time-to-market. As an Intern DRAM Design Engineer, you will contribute to the design, analysis, verification, and optimization of digital, analog, and mixed-signal circuits used in next-generation memory products. You will work closely with design, verification, product engineering, test, process integration, assembly, and marketing teams to support new product development and manufacturability initiatives. This role also provides opportunities to apply Artificial Intelligence and AI Assisted methodologies to improve design workflows, automation, and design quality. Responsibilities Play a key role in the development of new memory products through circuit build, layout, optimization, and validation of Memory, Logic, and Analog circuits. Support physical design activities including parasitic modeling, floor-planning, placement, routing, reticle experiments, tape-out revisions, and design verification using industry-standard simulation tools. Collaborate with global design, verification, product engineering, test, process integration, assembly, and marketing teams to improve manufacturability, quality, and product performance. Proactiv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s advanced memory design organization, where digital innovation directly shapes the next generation of DRAM products. We work across global teams, combining deep technical expertise with diverse perspectives to solve complex problems and push memory technology forward. We are also deeply engaged with AI tools to develop/optimize the design verification flow for better quality and efficiency This role plays a critical part in defining and delivering competitive digital IP for advanced DRAM. You will influence architecture, design, and verification while collaborating closely with layout, modeling, and CAD partners. It’s a hands-on opportunity to grow your technical depth while making a visible impact on future memory products. Responsibilities: Develop competitive digital IPs for advanced DRAM products Define design and verification requirements from specifications and reference designs Build high-level behavioral and algorithmic models for architecture verification Design IP using RTL or custom methodologies and guide layout and verification teams Collaborate with standards, CAD, modeling, and verification teams to improve design quality Leveraging AI (EX Claude Code or other AI tools) to develop, improve design quality and efficiency Minimum Qualifications: Bachelor’s degree in Electrical Engineering or related field, or equivalent experience 6+ years of experience in digit

Senior Engineer - SW Design (RAIL) — Hyderabad. Apply via Workday.

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking an Actuator Gear Design Engineer to lead the development of custom gears and gear stages for advanced robotic systems. You will own actuator development from early architecture and concept generation through prototype validation and system integration, partnering closely with mechanical, electrical, controls, firmware, and reliability teams. You will partner with external suppliers and internal manufacturing to create full gearbox assemblies. This role focuses on the design, integration, and validation of precision gearing, including broader knowledge around motor electromagnetics, transmission types, sensing, structural components, and thermal architectures. You will help drive actuator development across the full engineering lifecycle while establishing scalable design, test, and integration practices for future robotic platforms. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will: Lead the architecture, design, and integration of custom robotic actuator gearing. Define actuator requirements and system-level trade studies around torque density, bandwidth, efficiency, thermal performance, back drivability, inertia, reliability, manufacturability, and cost. Design precision electromechanical assemblies with strong attention to tolerances, alignment, load paths, thermal expansion, sealing, wear, and serviceability. Drive actuator integration into robotic systems, partnering closely with controls, firmware, electrical, and robotics software teams to optimize closed-lo

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a senior Actuator Electromagnetic Design Engineer to lead the development of custom electromechanical actuators for advanced robotic systems. You will own actuator development from early architecture and concept generation through prototype validation and system integration, partnering closely with mechanical, electrical, controls, firmware, reliability, and manufacturing teams. This role focuses on the design, integration, and validation of precision electromechanical systems, including motors, transmissions, sensing, structural components, and thermal architectures. You will help drive actuator development across the full engineering lifecycle while establishing scalable design, test, and integration practices for future robotic platforms. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will: Lead the architecture, design, and integration of custom robotic actuators, including the design, simulation, integration and sourcing of custom electromagnetic components. Define actuator requirements and system-level trade studies around torque density, bandwidth, efficiency, thermal performance, inertia, reliability, manufacturability, and cost. Design precision electromechanical assemblies with strong attention to tolerances, alignment, load paths, thermal expansion, sealing, wear, and serviceability. Drive actuator integration into robotic systems, partnering closely with controls, firmware, electrical, and robotics software teams to optimize closed-loop performance. Devel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a member of the ASIC Design team, you will work on design tasks for Micron's next generation of solid-state drive controllers. You will be involved in various phases of the ASIC design process, from concept to production silicon. This includes writing micro-architecture specifications, implementing RTL design, collaborating with the verification team to fully validate the design, delivering a gate netlist to the back-end implementation team to meet timing and physical constraints, and developing scripts to improve the design process. The ideal candidate is highly motivated, detail-oriented, and possesses excellent documentation and communication skills. Strong collaboration skills and a commitment to completing tasks with high quality are essential. This role additionally expects familiarity with AI assisted engineering tools to improve productivity, accelerate debugging, and enhance documentation quality, while ensuring responsible and secure usage. Responsibilities: Design, implement, and debug complex logic designs. Integrate your IP into larger and more complex IPs. Support front-end integration activities such as Lint, CDC, Synthesis, and ECO. Implement design automation using Python or other programming languages. Collaborate with SOC Design, SOC Design Verification, Emulation, STA, and Physical Design teams. Work closely with software and systems teams to ensure high-quality system integration.<

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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary Micron Technology is seeking a Principal RTL Design Engineer to lead the development of high-quality DRAM digital and mixed-signal IP. In this role, you will be responsible for the full RTL design lifecycle—from architecture and implementation through signoff—while delivering designs that meet aggressive power, performance, and area (PPA) targets. This position is in Boise, Idaho, offering strong opportunities for technical leadership, innovation, and collaboration across global teams. Responsibilities Own and drive RTL design for DRAM digital and mixed-signal IP from specification through silicon-ready signoff. Architect and deliver high-performance, power- and area-efficient RTL designs aligned with product requirements. Perform and sign off front-end quality checks, including lint, CDC/RDC, synthesis, UPF, and timing QoR. Collaborate closely with physical design, verification, and architecture teams to achieve timing closure and PPA goals. Improve design quality and efficiency by refining methodologies, driving automation, and enhancing RTL design flows. Minimum Qualifications Master’s degree in Electrical Engineering with 8&#43; years of experience, or Bachelor’s degree with 10&#43; years of pre-silicon RTL design experience. Proven ownership of complex RTL/IP development from micro-architecture definition through handoff to physical design. Strong experience with ASIC low-power d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where innovation meets excellence. We are passionate about advancing memory and storage technologies through collaborative engineering and creative problem-solving. Our team works at the forefront of semiconductor design, developing groundbreaking solutions that shape the future of memory products in a dynamic, learning-focused environment. As a Design Engineer, you will play a key role in developing next-generation memory technologies by designing, analyzing, and optimizing digital and analog circuits. You will collaborate with global cross-functional teams throughout the product lifecycle, helping deliver high-quality, manufacturable memory solutions that meet performance, reliability, cost, and customer requirements. Responsibilities: Contribute to the design, layout, verification, and optimization of memory, logic, and analog circuits for new product development Perform parasitic modeling and support design validation, reticle experiments, and tape-out revisions Lead layout activities including floor planning, placement, and routing Partner with Product Engineering, Test, Probe, Assembly, Process Integration, and Marketing teams to ensure manufacturable product designs Collaborate with CAD, modeling, standards, and verification teams to improve design quality and execution Minimum Qualifications: Bachelor’s or Master’s degree in Electrical Engineering Minimum 4 years o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. You will also work on efforts to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing coll