Packaging Engineer Flip Chip Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our Technology Development team sits at the center of innovation. We build advanced modeling and AI solutions that shape how memory and storage technologies are designed, built, and scaled. Working at the intersection of physics, data, and engineering, we turn complex problems into practical breakthroughs that matter! This role is critical to how we accelerate semiconductor technology development using advanced AI and physics-based modeling. You will lead the design and deployment of agentic and LLM-powered solutions that directly influence process technology, packaging, and early manufacturing decisions. If you enjoy driving hard problems end to end and collaborating across hardware and software teams, this role offers real impact and visibility. Note: We are hiring for more than one role spanning Senior/Staff/Principal/Technical Staff Engineer. Responsibilities: Design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows Architect agentic AI systems that integrate with modeling tools, design automation environments, and fab/test platforms to enable digital twin development Define and promote best known methods for deploying LLMs and agentic systems reliably in production environments Evaluate and improve model performance using methods such as structured benchmarking, prompt tuning, RLHF, and feedback loops Translate modeling results into clear insights through data storytelling and visualiza

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our Technology Development team sits at the center of innovation. We build advanced modeling and AI solutions that shape how memory and storage technologies are designed, built, and scaled. Working at the intersection of physics, data, and engineering, we turn complex problems into practical breakthroughs that matter! This role is critical to how we accelerate semiconductor technology development using advanced AI and physics-based modeling. You will lead the design and deployment of agentic and LLM-powered solutions that directly influence process technology, packaging, and early manufacturing decisions. If you enjoy driving hard problems end to end and collaborating across hardware and software teams, this role offers real impact and visibility. Note: We are hiring for more than one role spanning Senior/Staff/Principal/Technical Staff Engineer. Responsibilities: Design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows Architect agentic AI systems that integrate with modeling tools, design automation environments, and fab/test platforms to enable digital twin development Define and promote best known methods for deploying LLMs and agentic systems reliably in production environments Evaluate and improve model performance using methods such as structured benchmarking, prompt tuning, RLHF, and feedback loops Translate modeling results into clear insights through data storytelling and visualiza

Spotify’s Subscriptions Mission focuses on converting listeners into lifelong subscribers by delivering seamless, valuable experiences across pricing, packaging, and customer journeys. We build the systems and tools that power acquisition, retention, and overall subscription growth at scale. The Messaging Platform powers Spotify’s communications to over a billion users — from push notifications to emails and in-app messages that connect listeners to the content they love. Within this space, the Paloma squad focuses on message optimization: deciding which message reaches which user, through which channel, and at what moment. We’re evolving how messaging works at Spotify — moving from short-term optimization toward systems that understand long-term user journeys. By combining reinforcement learning approaches with deeper domain signals, we’re expanding how machine learning shapes the entire messaging funnel. What You'll Do Design, build, and ship machine learning models that optimize messaging across push, email, and in-app channels Plan and run A/B experiments in a multi-objective environment, balancing conversion, engagement, retention, and reachability Contribute to reinforcement learning systems that optimize for long-term user outcomes rather than immediate interactions Partner with product managers, data scientists, and engineers to define what success looks like and how to measure it Own the full ML lifecycle, from data and modeling to deployment, monitoring, and iteration Integrate ML models with upstream systems, including domain value signals and oppor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: Introduction As a Principal Engineer in the Advanced Package Technology Development team at Micron, you will join a dynamic group focused on innovation and collaboration. This role lets you influence solutions that align with company goals. It contributes to increased revenue and strategic successes. You will work at our Boise campus and help develop leading technology in the industry. Responsibilities and Duties include, but not limited to: Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure seamless technology integration. Consult and influence technical and strategic decisions at senior management levels. Lead multi-disciplinary technical teams and task forces to achieve strategic goals. Maintain effective communication with collaborators. Analyze and understand competitive trends to improve Micron’s competitive edge. Participate actively in technology events, contributing to industry knowledge. Guide the development of packaging technology roadmaps. Assess competitive metrics through data intelligence for strategic adv

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Requirements: 3+ years embedded firmware development experience with C / C++, Linux / Unix platform; Experience with ARM processors, embedded Linux; Experience working with H.265; Experience with Git, including merging and rebasing; Basic understanding of electronic circuits; Experience in embedded Linux systems (cross-build, flash, boot, system initialization, rootfs packaging, fault-tolerance, IPC, work with embedded filesystems), embedded distributions (Yocto,buildroot,OpenWRT); Good written and verbal English communication skills; Candidate needs to be in Kyiv (or consider relocation). Hybrid type of work. Will be a plus: Knowledge of Linux kernel; Experience with any SoC, preferrably multimedia-targeted; Video processing, streaming, encoding/decoding; Experience working with OpenCV; Image processing, tuning, enhancement; OOP/OOD, strong programming experience with C/C++; BS degree in Computer Science, or related engineering degree. Tools: ANSI C, Git, Linux kernel, embedded development tools (toolchain, OpenWRT, SW/HW debuggers, scripting). What do we offer: International work environment and work with global development teams; Excellent work conditions in an A-Class office (Horizon Park Business Center); Compensation package matching global standards; Flexible work hours (as required); Paid parki

ABOUT BASETEN Baseten powers mission-critical inference for the world's most dynamic AI companies, like Cursor, Notion, OpenEvidence, Abridge, Clay, Gamma, and Writer. By uniting applied AI research, flexible infrastructure, and seamless developer tooling, we enable companies operating at the frontier of AI to bring cutting-edge models into production. We're growing quickly and recently raised our $1.5B Series F , led by Altimeter Capital, Conviction Partners, and Spark Capital. Join us and help build the platform engineers turn to ship AI products. THE ROLE As a Software Engineer at Baseten, you will own one of the most critical surfaces of our business: pricing, billing, and revenue infrastructure. As we launch more and more products— billing is no longer just operational plumbing. It is a strategic lever for growth. This role will establish clear ownership of billing as a function and create leverage for Finance, Sales, and GTM teams while maintaining a seamless customer experience. RESPONSIBILITIES Own Baseten’s end-to-end billing and revenue infrastructure, including pricing, invoicing, metering, and reporting foundations. Build and evolve our billing platform and integrations (including Orb), ensuring correctness, auditability, and a high-trust experience for customers and internal teams. Partner closely with Finance, Sales, GTM, and Forward Deployed Engineering to turn real-world workflows into reliable internal tooling and automation (quoting, approvals, renewals, usage reconciliation, revenue reporting). Design systems that scale with new products, packaging, and go-to-market motions, making billing a strategic lever for growth. Drive reliability and operational excellence for revenue-critical workflows: monitoring, alerting, incident response, backfills, and clear runbooks. Lead from the front on high-impact projects: clarify requirements, propose crisp technical approaches, ship iteratively, and raise the bar on quality and velocity. Debug and resolve pro

Job Details: Job Description: Designs, develops, sustains, tests, validates, and debugs software to enable specific factory, wafer process, packaging features, capabilities, solutions, and/or reference platforms for Intel manufactured products. May work across multiple layers of the software stack spanning firmware, drivers, operating systems, database platforms, storage platforms, network/firewall, middleware, frameworks, algorithms, automated material handling systems, and/or applications for mission critical distributed enterprise systems spanning a large number of clients/servers and applications across multiple operating systems, specific technology, product/platform, or Manufacturing segment. Integrates, supports, and sustains Factory Automation software systems to ensure reliable and efficient manufacturing operations. Applies advanced troubleshooting techniques to diagnose and resolve automation system issues, minimizing system downtime and improving overall system performance. Drives continuous improvement initiatives to achieve automation system health goals, enhance system reliability, and support emerging manufacturing capability requirements. Serves as the automation subject matter expert for designated automation systems, representing system integration needs and collaborating with cross-functional and cross-site teams to drive solutions. Supports automation system monitoring tools, system validation, software testing, troubleshooting, and software quality control activities. Partners with Virtual Factory teams and relevant stakeholders to facilitate knowledge sharing, issue resolution, and continuous improvement across manufacturing sites. Provides 24x7 production support through a rotating day and night shift schedule, working 12-hour shifts (AA, BB, CC, DD rotation) to ensure continu

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a Propulsion Systems & Mechanical Integration Engineer to own the mechanical integration of propulsion systems across our next-generation defense platforms. In this hands-on role, you will work at the intersection of propulsion, structures, fluids, thermal management, avionics, and vehicle systems to turn propulsion concepts into reliable, testable, manufacturable hardware. You will integrate next-generation engines, fuel systems, valves, pumps, tanks, actuators, thermal protection, and associated support hardware in tightly constrained aerospace vehicles. You will drive the mechanical architecture and interfaces required to accomodate propulsion systems while balancing performance, mass, packaging, manufacturability, reliability, and cost. At Mach Industries, we are redefining the future of defense through advanced, scalable platforms. As a Mechanical Engineer, you will play a key role in prototyping and refining mechanical systems, and optimizing designs for performance and scalability. Collaborating with a multidisciplinary team, you’ll help shape the next wave of defense technologies, from concept to deployment. Key Responsibilities Own mechanical integration of propulsion systems from early architecture and co

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in APTD Micron you will be responsible for leading and managing the activities and operation of Advanced Package Development by collaborating with internal and external stakeholders to build and execute technology development strategies aligned to organizational and business objectives by providing high performing and cost effective packaging solution on time with best predictable reliability performance. You will need to comprehend package technology development business process (MOR development) and TECHNODE business process for packaging technology and ensure all package development and product transfer work are carried out in accordance with these business processes. Other responsibilities include ensuring organizational compliance to company policies and regulations, as well as to departmental procedures, and providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects, as well as mentoring other functional leaders through collaboration and the development of sustainably successful solutions. Responsibilities and Duties include, but not limited to: Develop and Communicate Technology Development Strategy Develop and communicate Technology Development strategic objectives Understand the impact and implica

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is hiring an experienced MTS - Thermal Simulation Engineer! You would provide technical leadership in advanced thermal and thermo-mechanical modeling for next-generation High Bandwidth Memory (HBM) products. This role will define simulation strategy, solve complex thermal challenges across 2.5D/3D semiconductor packaging systems, drive physics-based model development and silicon correlation, and influence product, package, material, and process decisions across teams . Key Responsibilities Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration. Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions. Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures. Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior. Assess material prop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is seeking an experienced MTS - HBM Thermal Integration Engineer to drive thermal performance optimization for next-generation High Bandwidth Memory products. This role sits at the intersection of thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration. Key Responsibilities Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE) to accelerate technology understanding Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance. Work closely with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges and enable product improvements. Identify and implement opportunities to reduce thermal resistance, improve thermal consistency, and enhance product performance. Drive cross-functional technical investigations and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Introduction: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you eager to be a pioneer in AI and semiconductor breakthroughs? At Micron, we invite a passionate Staff Engineer, Collateral Integration Engineer to join our upbeat group. This opportunity offers the chance to work on innovative technology within a team-orie