Packaging Engineer Flip Chip Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Material Characterization & Analysis Perform material characterization using DSC, TGA, DMA, TMA, Rheometer, Contact Angle, Density, and other analytical techniques. Evaluate critical material properties including Tg, CTE, viscosity, modulus, cure behavior, filler content, thermal stability, and wettability. Analyze material behavior and establish correlations between material properties and manufacturing performance. Support incoming material evaluation, qualification, and supplier material assessments. Testing Method Development Develop, optimize, and standardize material characterization methods and testing procedures. Establish SOPs, OCAPs, SPC baselines, and MSA plans for laboratory operations. Develop new characterization capabilities for molding compounds, NCF, dicing tapes, liquid EMC, adhesives, and other packaging materials. Execute method validation, correlation studies, and cross-site benchmarking activities. Supplier Quality & Material Investigation Lead supplier material investigations for excursions, abnormal trends, and quality concerns. Conduct root cause analysis and drive corrective and preventive actions with suppliers. Support supplier audits, change management reviews, and material control plan optimization. Establish critical-to-quality (CTQ) monitoring strategies and strengthen supplier process control systems. Failure Analysis &

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary We are seeking a highly motivated Failure Analysis Engineer to join our Product Failure Analysis (PFA) Laboratory. The successful candidate will be responsible for conducting failure analysis, root cause investigations, and advanced package characterization to support product development and yield improvement. This role requires strong analytical skills, hands-on laboratory experience, and the ability to collaborate with cross-functional teams in a fast-paced semiconductor environment. Qualifications Education Bachelor's or Master's degree in: Materials Science & Engineering Electrical Engineering Electronics Engineering Mechanical Engineering Chemical Engineering Physics, Chemistry, or related technical disciplines Experience in one or more of the following areas is preferred: Wafer Fabrication Assembly and Packaging Product Engineering Yield Enhancement Failure Analysis Laboratory Advanced Packaging Technologies Responsibilities Perform electrical and physical failure analysis of semiconductor devices and packages. Conduct root cause investigations and provide technical recommendations. Develop and execute analytical plans to support engineering requests. Interpret analytical results and communicate findings effectively. Collaborate with Process, Product, Quality, Reliability, and Manufacturi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve equipment condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify equipment management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leverage AI-enabled tools and data-driven insights to improve operational efficiency, accelerate problem-solving, and support continuous improvement initiatives. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​ • Preferred to have over 3-year of working experiences in production line.​ • Must have process maintain experience.​ • Bachelor degree or

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department MSB Process Integration Engineering Project Title Semiconductor Manufacturing Reject Reduction Through Process Variability Analytics Project Description The intern will participate in a structured project focused on improving semiconductor manufacturing reject rates through process variability reduction. The project will provide practical exposure to semiconductor packaging, Assembly and Test processes, and manufacturing data analytics. Under appropriate guidance, the intern will analyze inline signals, process parameters, and test results to identify patterns and potential contributors to process variability and yield loss. The intern will also explore the responsible application of Artificial Intelligence and AI-Enabled analytical tools to improve the efficiency, quality, and effectiveness of project analysis. Objective of the Project The project aims to: Identify potential sources of process variability and yield loss. Improve the analysis of inline signals, process data, and test results. Determine relationships between process conditions and manufacturing rejects. Develop data-driven re

Abbott is a global healthcare leader that helps people live more fully at all stages of life. Our portfolio of life-changing technologies spans the spectrum of healthcare, with leading businesses and products in diagnostics, medical devices, nutritionals and branded generic medicines. Our 122,000 colleagues serve people in more than 160 countries. JOB DESCRIPTION: Position Overview The AI Platform Engineer builds and operates the machine learning and generative AI platform used by teams across Abbott Cancer Diagnostics. You'll own the full model lifecycle in production — data and feature pipelines, training and experimentation, evaluation and promotion, serving, and monitoring — along with the platform services, compute and tooling underneath it. This is hands-on infrastructure work backed by solid platform engineering practice: making inference fast and cheap, making the path from experiment to production repeatable and auditable, and shipping interfaces other engineers can build on — in support of software that ultimately reaches patients. Essential Duties Include, but are not limited to, the following: Build and maintain data, feature, and training pipelines for ML and LLM workloads — ingestion, transformation, fine-tuning, distributed training, and reproducible experiment execution with lineage tracked from dataset and code to resulting model. Implement automated evaluation and promotion gates — performance benchmarks, regression checks, and validation criteria that determine whether a model advances toward production. Automate the model lifecycle end to end through CI/CD and GitOps: packaging, promotion across environments, progressive rollout, and rollback. Build and operate production model-serving infrastructure for LLMs and predictive models, including inference optimization, autoscaling,

We are seeking a Staff Logistics Engineer to lead the development of the logistics function for a major vehicle program – inbound planning, internal material flow and warehousing, outbound transportation, and logistics engineering – from initial facility build-out through start of production. You will also serve as the senior logistics leader and primary liaison to a key international manufacturing partner supporting body shop and metallic component manufacturing, as well as material flow across vehicle assembly plants. This role reports to the Manager, Logistics Engineering. The ideal candidate has taken a logistics organization from a greenfield or brownfield site through start of production, has led new-product or new-program launches in a complex automotive manufacturing environment, and has managed an executive-level manufacturing partner relationship. You are comfortable being the single point of accountability for logistics on a major program and can travel as required. In this role, you will: Lead the end-to-end design, layout, and operational launch of new Logistics programs, including inbound planning, internal material flow and warehousing, outbound transportation, and logistics engineering (packaging, systems, and industrial engineering). Serve as the senior logistics lead and primary liaison to a key international manufacturing partner, representing Logistics in onsite workshops, program steering meetings, and executive alignment sessions. Lead Logistics readiness across the full site lifecycle – from greenfield/brownfield facility build-out and build-location decisions through new-product launch and start of production (SOP). Develop a comprehensive logistics launch plan to drive cross-functional logistics readiness for program gate reviews, surfacing schedule, capacity, and material-flow risks early and driving them to closure. Manage a r

About Supabase Supabase is the Postgres development platform, built by developers for developers. We provide a complete backend solution including Database, Auth, Storage, Edge Functions, Realtime, and Vector Search. All services are deeply integrated and designed for growth. About the Role We're looking for a Postgres Deployment Engineer to join our team and elevate our PostgreSQL offerings. You'll work hand-in-hand with the PostgreSQL team and play an instrumental role in technical decision-making and refining internal methodologies. The focus of this role is around owning stability and deployment of our products. This role involves ongoing contribution and co-responsibility for builds/deployments via our public supabase/postgres GitHub repository. This repository bundles an array of features/products into docker images and AWS AMIs, giving users the ability to run Supabase on our cloud and locally. This role will function has developed as a bridge between product and infrastructure teams to improve the reliability of product deployments and upgrades. In this role, your primary responsibilities will include: Packaging software into our supabase/postgres repo to using either nix language with flakes, or debian packaging depending on our required target Supporting the expansion of knowledge in Supabase toward our platform release system so that developers can self service more and more over time. Expanding on our github actions, our team tooling, and our testing/release approaches Timely PostgreSQL major, minor, and extension upgrades. Engaging in proactive identification and resolution of production issues in customer deployments. Contributing to the creation/maintaining of best practices, tools, and tests to ensure enhanced stability and decreased deployment risks over time. What we need This role demands the following pivotal qualities: PostgreSQL Expert : A profound understanding of PostgreSQL and its associated tools. Familiarity with extensions, performance op

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a PDE MRDA KEG Engineer / Senior Engineer , you will be responsible for developing, qualifying, deploying, and sustaining advanced defect inspection and metrology solutions that support New Product Introduction (NPI), HBM technology ramps, and High Volume Manufacturing (HVM). You will drive inspection capability readiness, equipment performance improvement, and defectivity reduction through close collaboration with cross functional team. The role requires strong expertise in semiconductor manufacturing, defect inspection technologies, data analytics, equipment qualification, and cross-functional problem solving to enable industry-leading process control and yield performance. Inspection Technology & Equipment Ownership Manage advanced inspection and metrology platforms throughout package development and manufacturing. Develop technology roadmaps and capability strategies to meet future packaging requirements. Drive equipment lifecycle management, capacity planning, and technology insertion activities. Equipment Qualification & Deployment Lead tool installation, qualification (TIQ), release, and production readiness activities. Establish equipment acceptance criteria, qualification methodologies, and deployment pla

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Design Engineer, you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products . You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates , supporting both silicon release and ongoing product lifecycle needs. This role requires strong technical execution and the ability to independently drive complex issues to closure. Responsibilities Design Support: Work on HBM product design and support sustaining design maintenance (ECOs/spec changes). Silicon Debug: Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. Cross-Functional Collaboration: Work closely with DE, PE, TD, and system teams

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community. We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Develo

Job Details: Job Description: Intel Foundry Automation - Back End Automation Group is seeking a talented student to support our Automation Integrators in advancing manufacturing automation systems. Key Responsibilities: • Assist Automation Integrators with troubleshooting, system upgrades, user training, and root cause analysis to improve efficiency and reduce waste. • Enable Automation Integrators in designing, developing, testing, and debugging software for factory operations, wafer processing, and packaging across multiple software layers. • Support client-based Station Controller systems through validation, troubleshooting, and quality control. Collaborate with global cross-functional teams to drive automation projects and integrate machine learning and AI solutions as needed. Qualifications: Candidates must be currently pursuing a bachelor's degree in computer science, Data Science, Computer Engineering, or a related discipline. They should possess strong analytical, problem-solving, and communication skills, along with hands-on programming experience in languages such as Python, C, and C#. Knowledge of Agile software development methodologies and experience with manufacturing systems are highly desirable. Job Type: Student / Intern Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Malaysia, Kulim Posti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

About the Team DoorDash Labs is an independent team within DoorDash. We explore robotics and automation to transform last mile logistics in the long term. If you have a passion for applying robotics solutions in a service used by millions of people, then we want to talk to you! About the Role We are hiring an Autonomy Platform Engineer to build and evolve the foundational software that runs our autonomy stack across robot and compute platforms. The Autonomy Platform team works across embedded Linux, compute and sensor enablement, robotics middleware, process orchestration, data capture and replay, system observability, and performance. You will develop production software and tooling that enables autonomy engineers to bring up new hardware, deploy services reliably, diagnose failures, and validate system performance across robot generations. You will work closely with autonomy, firmware, electrical, hardware, manufacturing, and validation engineers and report to the Autonomy Platform Lead. We expect this role to be hybrid with some time in-office and some time remote. You’re excited about this opportunity because you will… Build and maintain core runtime, middleware, and platform services used by autonomy applications. Enable new compute, camera, lidar, and other sensor platforms. Improve process orchestration, messaging, configuration, startup and shutdown behavior, resource isolation, and fault recovery. Develop system observability, tracing, performance measurement, diagnostics, and regression-detection capabilities. Build reliable data capture, replay, and debugging workflows. Create provisioning, packaging, deployment, integration-test, and platform-readiness tooling. Lead complex debugging across application, middleware, OS, driver, networking, timing, and hardware boundaries. We’re excited about you because… Strong production C++ and Python experience. Experience with embedded Linux, robotics, autonomous vehicles, or complex mechatronic systems. Solid u

Who we are About Stripe Stripe is a financial infrastructure platform for businesses. Millions of companies - from the world’s largest enterprises to the most ambitious startups - use Stripe to accept payments, grow their revenue, and accelerate new business opportunities. Our mission is to increase the GDP of the internet, and we have a staggering amount of work ahead. That means you have an unprecedented opportunity to put the global economy within everyone's reach while doing the most important work of your career. About the team Metronome is a usage-based billing platform and a Stripe product. It helps modern software companies launch products faster, offer flexible pricing models, and streamline finance workflows. The Metronome Integration Engineering team sits at the intersection of sales, growth, product, and research and development. We own the technical aspects of the customer lifecycle after a sale and before the customer transitions to our post-implementation teams. What you'll do As an Integration Engineer, you’ll help customers implement Metronome successfully and realize value quickly. You’ll lead technical work across requirements gathering, solution and integration design, configuration, testing, data migration, launch, and handoff. Responsibilities Conduct discovery and scoping to understand customers’ challenges across billing, product launches, pricing and packaging, quote-to-cash, customer experience, and related areas. Support customers throughout the implementation lifecycle, including requirements gathering, technical design, integration design, testing, data migration, and launch. Provide expert guidance on usage-based pricing and consumption-based business models. Configure Metronome’s platform on behalf of customers. Design integrations between Metronome’s APIs and customers’ business systems—including CRM and CPQ platforms, payment and tax systems, ERP and billing providers, and reporting and analytics tools—in alignment with Metronome bes