Signal Integrity Hardware Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the Customer Engineering Technical Leadership (CETL) function within HIG PSE, the Technical Leader will serve as a key technical interface between external customers and internal engineering teams. In conjunction with CIL (Customer Integration Lead), this role requires deep technical engagement to understand customer application requirements and align them with internal HBM design, product engineering, and manufacturing processes (Front-End and Back-End). The position emphasizes technical problem-solving, multi-functional teamwork, and driving integration success for advanced HBM products. Develops and deploys AI systems that help automate processes and tackle technical challenges. Responsibilities: Develop a strong understanding of customer system architecture, application requirements, and integration challenges. Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams. Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies. Develops and deploys AI (artificial intelligence) systems that help automate processes and tackle technical challenges Work closely with internal teams across front-end/back-end process engineering, product development, and manufacturing to ensure seamless integration. Support design reviews, failure analysis, and yield improvement initiatives tied to customer requirements. </ul

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Key Responsibilities: Lead first‑silicon bring‑up, board validation, and early silicon debug. Develop and complete detailed electrical characterization plans covering DC, AC, parametric, and functional measurements. Characterize high‑speed interfaces such as DDR/LPDDR, SerDes, MIPI, UFS, or custom Micron PHYs. Perform post‑silicon electrical characterization of ASIC/SoC/Memory products across process, voltage, and temperature (PVT) corners. Conduct lab measurements using equipment such as Oscilloscopes, BERTs, VNAs, Spectrum analyzers, Waveform generators, and support tools. Involve in Board design activities with team to gather and place custom requirements as per Chaz. Perform signal integrity (SI), power integrity (PI), Jitter, Eye‑diagram, and compliance testing. Debug silicon issues related to timing, noise, stability, margin loss, and functional failures. Analyze failures and recommend design, firmware, or test fixes. Develop Python/MATLAB-based automation for measurements, data collection, and analysis. Process large volumes of lab and silicon data to extract trends, margins, and correlations. Generate concise characterization reports with clear conclusions and recommendations. Work closely with design, pre‑silicon verification, product engineering, firmware, test, and systems teams. Correlate post‑silicon results with simulation and pre‑silicon expectations to identify root cau

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the fabrication sites and Process Integration through test development to increase effective process feedba

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview The Principal Design Engineer in Micron’s NVEG organization contributes to the development of new memory products by assisting with the overall design, layout, and optimization of datapath circuits for NAND flash memory. This position will drive task forces and make strategic decisions on major datapath architectural changes influenced by new design specs such as higher speed/lower power. They will assess pros and cons of new architecture and drive all activities pertaining its implementation. The role will be expected to lead technical datapath design projects, directing the design planning, layout, and validation activities according to project timelines. Responsibilities Design and optimize TSV(Through-Silicon Via) interface circuits connecting memory die to logic die including Rx/Tx circuit for internal TSV channels, impedance matching and timing margin analysis. Develop and characterize TSV electrical models and define circuit design constraints for datapath interface. Define and implement signal integrity requirements for the TSV channel, including eye margin, crosstalk, and noise budget analysis Define and implement power integrity requirements using TSV for highly parallel IO and array operations Design and verify TSV-specific DFT (Design for Testability) circuits including loopback test modes, TSV continuity checks, and lane redundancy/remapping logic Interface with process technology and DTCO teams to optimize TSV de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Design Engineer, you will build the future of memory by architecting and delivering high‑performance DRAM circuit compositions for advanced technology nodes. In this highly visible technical leadership role, you’ll develop innovation across building, layout, verification, and silicon validation. You will collaborate closely with multi-functional teams to deliver scalable, manufacturable solutions for next-generation memory products. Your work will directly influence performance, power, reliability, and time‑to‑market for Micron’s groundbreaking memory technologies. Responsibilities Design and optimize DRAM circuits spanning digital, analog, and memory core subsystems to meet aggressive power, performance, and reliability targets Develop and refine floorplans, routing strategies, power delivery networks, sense margins, timings, and die‑size tradeoffs Perform advanced circuit simulations using FINESIM, HSPICE, and VERILOG, analyzing speed, power, noise, and long‑term reliability Model parasitics, verify power and signal integrity, and support validation, reticle experiments, and tape‑out revisions Drive simulation‑to‑silicon correlation, identify gaps, and recommend schematic and layout improvements Lead technical reviews, documentation, and best‑practice standardization across design and layout teams Coordinate and manage layout and build resources, tracking breakthroughs and resolving critical path issues S

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Development Engineer in the Media Health team, you will act as a key interface between a variety of engineering groups and specialties, improving a diverse range of expertise to innovate new and improved test strategies, features, and technologies! You will have or develop guide capability with Probe, and/or ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering (DE) to run simulations pre-silicon to validate test strategies and Design for Test circuits. Provide feedback to DE, Test Engineering (TE), and others in Product Engineering (PE) Assist in pre-silicon checklist items and work with TE to define required tester resources Work with TE and PE to modify test programs for specific product requirements to ensure that silicon performance meets expectations Support TE by aiding in test program debug, data analysis, and test development Support fabrication sites and process integration through test development to increase effective process feedback Debug and identifying root causes for failures using test and experimental data, and elec

We’re looking for power integrity engineers to ensure that power is delivered and stable at all levels: rack/tray, package, die, core. Ideal Background: Experience with large die, high TDP chip PDN analysis and design Experience with advanced node (7nm and lower) chip PDN analysis and design Ability to work with package architects to determine best passives design within a given set of constraints Ability to work with ASIC and microarchitecture team to hit power integrity goals given manufacturing design constraints Nice to Have: Experience with WSI (wafer-scale integration) systems Board and system-level power delivery network analysis and design Low voltage die power delivery network analysis and design Many voltage domain power delivery network design and analysis IVR based design experience

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Own package architecture and execution from feasibility through tape-out, qualification, and production readiness, ensuring design intent is translated into manufacturable, reliable, and scalable solutions. Serve as the technical authority for complex package issues, leading cross-functional reviews, trade-off decisions, and risk closure across product, silicon, technology, assembly, quality, supplier, and OSAT teams. Balance performance, reliability, manufacturability, cost, quality, and schedule to deliver production-ready solutions while mentoring engineers through difficult technical decisions. Advance design rules, methodologies, automation workflows, and technology roadmaps for future products. Represent the packaging team in Silicon–package–board co-design by integrating floorplan, interface, interconnect, power, signal, thermal, and mechanical requirements, and resolve cost and manufacturing trade-offs to achieve a balanced package solution. Ability to apply baseline digital fluency and role-approp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead full-chip floor planning, integration, physical implementation, signoff, and tape-out execution. Drive layout implementation of complex analog, mixed-signal, memory, and high-speed interface designs. Own DRC, LVS, ERC, EMIR, reliability, and manufacturability closure. Define and scale layout methodologies, best practices, and execution frameworks. Leverage Artificial Intelligence, Machine Learning, and Agentic AI to improve layout productivity, design quality, automation, and faster decision-making. Drive automation initiatives using AI-assisted design, verification, debugging, and knowledge management solutions. Lead cross-functional and global teams, mentor engineers, and drive technical excellence. Qualifications B. Tech /M. Tech in Electrical Engineering, Electronics, VLSI, or related field. 15&#43; years of hands-on custom layout experience. Proven success leading full-chip programs from concept through silicon tape-out. Deep expertise in: Analog & Mixed-Signal Layout Memory & High-Speed Interface Layout Full-Chip Floor planning & Integration Signal Integrity, Power Integrity, EM/IR Physical Verification & Signoff Advanced Node Technologies (FinFET/GAA) Strong proficiency with Cadence Virtuoso, Calibre, StarRC, Totem, and related EDA tools. Proven experience leveraging <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Department F10 Manufacturing, Photolithography Project Title Internet of Things-Based Photolithography Equipment Monitoring and Anomaly Detection Project Description The intern will undertake a structured engineering project focused on developing an Internet of Things-based solution for photolithography equipment and process monitoring. Under the guidance of experienced engineers, the intern will study photolithography equipment behaviour, process flow, and available sensor signals. The intern will apply Python programming, data analytics, system integration, and selected Machine Learning techniques to develop or enhance a defined monitoring use case. The project will provide practical exposure to semiconductor manufacturing equipment, Internet of Things architecture, data ingestion, signal processing, visualization, and AI-Enabled anomaly detection. Project activities will be limited to the assigned use case and conducted with appropriate engineering guidance. Objective of the Project Develop a strong understanding of photolithography equipment behaviour, process flow, and process signals. Design and implement an Internet of Things-based solution for enhanced equipment or process monitoring. Ena

About the Team OpenAI’s mission is to ensure the responsible and widespread adoption of artificial intelligence. In support of that mission, the Ads Solutions team partners closely with advertisers to deeply understand their businesses and needs, helping inform the development of products and solutions that drive meaningful revenue growth and long-term success on the platform—while maintaining strong standards for user trust and platform integrity. About the Role We’re looking for an Ads Solutions Engineer to partner with advertisers and agencies throughout the pre-sales and growth lifecycle, helping them successfully evaluate, launch, and scale on OpenAI’s advertising platform. You will serve as the technical expert in the sales process, translating advertiser objectives into scalable technical solutions across measurement, integrations, data activation, and campaign execution. This role sits at the intersection of sales, product, and engineering. You’ll work closely with Client Partners, Customer Success Managers, Product, Engineering, Policy, and Operations teams to remove technical blockers, accelerate revenue growth, and shape the future of OpenAI’s ads platform. This role is based in our San Francisco HQ and we offer generous relocation support for new hires. In this role, you will: Partner with Client Partners during the sales cycle to provide technical expertise that unlocks new business and accelerates deal closure. Lead technical discovery with advertisers and agencies to understand data flows, martech stack, measurement requirements, and activation goals. Design and recommend implementation approaches for pixels, APIs, server-to-server integrations, identity solutions, offline conversions, and measurement frameworks. Guide advertisers through onboarding and launch readiness, ensuring successful setup of tracking, attribution, audience signals, and reporting. Troubleshoot technical issues related to implementation, signal quality, delivery, and measurement

About the Team OpenAI’s mission is to ensure the responsible and widespread adoption of artificial intelligence. In support of that mission, the Ads Solutions team partners closely with advertisers to deeply understand their businesses and needs, helping inform the development of products and solutions that drive meaningful revenue growth and long-term success on the platform—while maintaining strong standards for user trust and platform integrity. About the Role We’re looking for an Ads Solutions Engineer to partner with advertisers and agencies throughout the pre-sales and growth lifecycle, helping them successfully evaluate, launch, and scale on OpenAI’s advertising platform. You will serve as the technical expert in the sales process, translating advertiser objectives into scalable technical solutions across measurement, integrations, data activation, and campaign execution. This role sits at the intersection of sales, product, and engineering. You’ll work closely with Client Partners, Customer Success Managers, Product, Engineering, Policy, and Operations teams to remove technical blockers, accelerate revenue growth, and shape the future of OpenAI’s ads platform. This role is based in our San Francisco HQ and we offer generous relocation support for new hires. In this role, you will: Partner with Client Partners during the sales cycle to provide technical expertise that unlocks new business and accelerates deal closure. Lead technical discovery with advertisers and agencies to understand data flows, martech stack, measurement requirements, and activation goals. Design and recommend implementation approaches for pixels, APIs, server-to-server integrations, identity solutions, offline conversions, and measurement frameworks. Guide advertisers through onboarding and launch readiness, ensuring successful setup of tracking, attribution, audience signals, and reporting. Troubleshoot technical issues related to implementation, signal quality, delivery, and measurement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever! As part of the ASIC Technical Products Engineering organization, you will help drive the development of next-generation GenAI, machine learning, and advanced data analytics solutions for semiconductor engineering. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex ASIC pre and post silicon engineering workflows. You will collaborate with cross-functional teams across System Architecture, Logic Design, Analog/Mixed-Signal Design, Data Science and IT to prototype, build, and scale practical AI-driven solutions that improve quality, cost, cycle time, and engineering efficiency. Key Responsibilities GenAI System Development: Design, build, and improve GenAI-powered an

About the Team OpenAI’s mission is to ensure the responsible and widespread adoption of artificial intelligence. In support of that mission, the Ads Solutions team partners closely with advertisers to deeply understand their businesses and needs, helping inform the development of products and solutions that drive meaningful revenue growth and long-term success on the platform—while maintaining strong standards for user trust and platform integrity. About the Role We’re looking for an Ads Solutions Engineer to partner with advertisers and agencies throughout the pre-sales and growth lifecycle, helping them successfully evaluate, launch, and scale on OpenAI’s advertising platform. You will serve as the technical expert in the sales process, translating advertiser objectives into scalable technical solutions across measurement, integrations, data activation, and campaign execution. This role sits at the intersection of sales, product, and engineering. You’ll work closely with Client Partners, Customer Success Managers, Product, Engineering, Policy, and Operations teams to remove technical blockers, accelerate revenue growth, and shape the future of OpenAI’s ads platform. In this role, you will: Partner with Client Partners during the sales cycle to provide technical expertise that unlocks new business and accelerates deal closure. Lead technical discovery with advertisers and agencies to understand data flows, martech stack, measurement requirements, and activation goals. Design and recommend implementation approaches for pixels, APIs, server-to-server integrations, identity solutions, offline conversions, and measurement frameworks. Guide advertisers through onboarding and launch readiness, ensuring successful setup of tracking, attribution, audience signals, and reporting. Troubleshoot technical issues related to implementation, signal quality, delivery, and measurement performance. Build compelling demos, proofs of concept, and technical narratives that demonstrate

About the Team OpenAI’s mission is to ensure the responsible and widespread adoption of artificial intelligence. In support of that mission, the Ads Solutions team partners closely with advertisers to deeply understand their businesses and needs, helping inform the development of products and solutions that drive meaningful revenue growth and long-term success on the platform—while maintaining strong standards for user trust and platform integrity. About the Role We’re looking for an Ads Solutions Engineer to partner with advertisers and agencies throughout the pre-sales and growth lifecycle, helping them successfully evaluate, launch, and scale on OpenAI’s advertising platform. You will serve as the technical expert in the sales process, translating advertiser objectives into scalable technical solutions across measurement, integrations, data activation, and campaign execution. This role sits at the intersection of sales, product, and engineering. You’ll work closely with Client Partners, Customer Success Managers, Product, Engineering, Policy, and Operations teams to remove technical blockers, accelerate revenue growth, and shape the future of OpenAI’s ads platform. In this role, you will: Partner with Client Partners during the sales cycle to provide technical expertise that unlocks new business and accelerates deal closure. Lead technical discovery with advertisers and agencies to understand data flows, martech stack, measurement requirements, and activation goals. Design and recommend implementation approaches for pixels, APIs, server-to-server integrations, identity solutions, offline conversions, and measurement frameworks. Guide advertisers through onboarding and launch readiness, ensuring successful setup of tracking, attribution, audience signals, and reporting. Troubleshoot technical issues related to implementation, signal quality, delivery, and measurement performance. Build compelling demos, proofs of concept, and technical narratives that demonstrate