High Speed Hardware Developer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design onl

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a Mixed Signal IC Layout Design Engineer role involves full-custom physical layout of analog and mixed-signal integrated circuits, turning schematics into manufacturable layouts that meet performance, power, area, and reliability targets in advanced FinFET processes. The role focuses on high quality, high-speed analog/mixed-signal blocks and their integration into larger SoCs. This role is remote, based out of any in the United States. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are An experienced analog/mixed-signal IC layout engineer with strong full-custom layout background on high-speed blocks (PLLs, VCOs, ADCs, DACs, LDOs, comparators, clock generators, high-speed I/Os). Proficient with Synopsys Custom Compiler or Cadence Virtuoso for custom layout, and Synopsys ICV or Siemens Calibre for physical verification (DRC, LVS, ERC, DFM, Antenna). Deep experience in CMOS/FinFET nodes (ideally TSMC or Samsung 12nm–2nm) with delivered silicon and a strong grasp of EM/IR, ESD, and latch-up in mixed-signal layouts. Detail-oriented and organized, able to own complex blocks independently and collaborate effectively with cir

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role As a Senior Electrical Engineer, you will be at the forefront of creating next-generation military technologies. Your expertise will directly contribute to the electrical design, development, and testing of sophisticated defense systems. This role is perfect for a driven individual who thrives in a fast-paced, high-stakes environment andis eager to apply their electrical engineering skills to high-impact projects. Key Responsibilities Design electronic circuit boards consisting of MCUs, low and high-speed communication busses such as USB, Ethernet, MIPI, digital and analog interfaces, power distribution, EMI, and ESD circuits. Design PCB, Altium Designer preferred, for flight avionics, guidance systems, communication systems, and power distribution. Rapidly construct prototypes using standard and application specific lab tools. Test and evaluate prototypes with standard and application specific test equipment to verify design integrity and performance. Develop and maintain detailed design documentation, CAD drawings, and product specifications for board and system designs. Design PCB boards and systems in accordance with Mach and industry quality standards. Collaborate with the quality team ensuring designs meet quality, reliability, and safety

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role As a member of the engineering team, you will take a lead role in the development of next-generation defense technologies, including but not limited to unmanned aerial vehicles (UAVs), missiles, and advanced weapon systems. You’ll regularly interact with senior leadership to influence fundamental operation of our platforms while collaborating with electrical, software, mechanical, and manufacturing teams to steer this project from initial conception to manufacturing. Key Responsibilities Design of advanced RF front ends and transceivers in support of next generation products including phased arrays, transmitters, and receivers. Mastery and expertise of RF components such as matching networks, filter synthesis, LNAs, Mixers, VGA, PLL/Synthesizers, and VCOs. Design, schematic capture, and PCB layout of RF transceivers and High-Speed circuits. Utilize best practice and strategies to minimize and troubleshoot EMI/RFI issues. Perform design validation testing of prototype and production designs with test equipment such as signal generators, spectrum/signal analyzers, network analyzers, power meters, noise figure meters, and etc. Contribute to various aspects of the integration of the RF/Microwave designs into aircraft and other systems. Analyze in-th

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role As a member of the engineering team, you will take a lead role in the development of next-generation defense technologies, including but not limited to unmanned aerial vehicles (UAVs), missiles, and advanced weapon systems. You’ll regularly interact with senior leadership to influence fundamental operation of our platforms while collaborating with electrical, software, mechanical, and manufacturing teams to steer this project from initial conception to manufacturing. Key Responsibilities Design of advanced RF front ends and transceivers in support of next generation products including phased arrays, transmitters, and receivers. Mastery and expertise of RF components such as matching networks, filter synthesis, LNAs, Mixers, VGA, PLL/Synthesizers, and VCOs. Design, schematic capture, and PCB layout of RF transceivers and High-Speed circuits. Utilize best practice and strategies to minimize and troubleshoot EMI/RFI issues. Perform design validation testing of prototype and production designs with test equipment such as signal generators, spectrum/signal analyzers, network analyzers, power meters, noise figure meters, and etc. Contribute to various aspects of the integration of the RF/Microwave designs into aircraft and other systems. Analyze in-th

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design on

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role As a Senior Electrical Engineer, you will be at the forefront of creating next-generation military technologies. Your expertise will directly contribute to the electrical design, development, and testing of sophisticated defense systems. This role is perfect for a driven individual who thrives in a fast-paced, high-stakes environment and is eager to apply their electrical engineering skills to high-impact projects. Key Responsibilities Design electronic circuit boards consisting of MCUs, low and high-speed communication busses such as USB, Ethernet, MIPI, digital and analog interfaces, power distribution, EMI, and ESD circuits. Design PCB, Altium Designer preferred, for flight avionics, guidance systems, communication systems, and power distribution. Rapidly construct prototypes using standard and application specific lab tools. Test and evaluate prototypes with standard and application specific test equipment to verify design integrity and performance. Develop and maintain detailed design documentation, CAD drawings, and product specifications for board and system designs. Design PCB boards and systems in accordance with Mach and industry quality standards. Collaborate with the quality team ensuring designs meet quality, re

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role As an Electrical Engineer, you will be at the forefront of creating next-generation military technologies. Your expertise will directly contribute to the electrical design, development, and testing of sophisticated defense systems. This role is perfect for a driven individual who thrives in a fast-paced, high-stakes environment and is eager to apply their electrical engineering skills to high-impact projects. Key Responsibilities Design electronic circuit boards consisting of MCUs, low and high-speed communication busses such as USB, Ethernet, MIPI, digital and analog interfaces, power distribution, EMI, and ESD circuits. Design PCB, Altium Designer preferred, for flight avionics, guidance systems, communication systems, and power distribution. Rapidly construct prototypes using standard and application specific lab tools. Test and evaluate prototypes with standard and application specific test equipment to verify design integrity and performance. Develop and maintain detailed design documentation, CAD drawings, and product specifications for board and system designs. Design PCB boards and systems in accordance with Mach and industry quality standards. Collaborate with the quality team ensuring designs meet quality, reliability, and safety stand

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most ambitious due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We define ESD and latch-up architecture for next-generation HBM products across advanced nodes and 3D integration. Our team works across device, circuit, and packaging domains to solve reliability challenges that directly impact product quality. We take on complex problems and turn them into scalable solutions that enable high-performance memory! As an SMTS/DMTS HBM ESD/Latch-Up Architect, you will define protection strategies across base die, DRAM stacks, and interconnects. This role shapes product reliability from early architecture through silicon validation. You will work across teams and influence technical direction while solving system-level ESD challenges. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Define end-to-end ESD and latch-up architecture across base die, DRAM die, and interconnects Develop protection strategies for high-speed I/O, TSV interfaces, and advanced packaging Establish ESD/LUP standards, rule decks, and signoff criteria Drive correlation between d

About Atomic Industries Atomic Industries is reinventing how the world makes things. From cars and aerospace systems to medical devices and packaging, most physical goods begin life in a mold or are shaped by a manufacturing tool. Producing these tools has always been slow, manual, and dependent on scarce expertise, taking weeks or months. We’re changing that. At our Detroit headquarters, we combine the industrial DNA of America’s manufacturing heartland with the speed, intelligence, and precision of Silicon Valley. Our AI-driven platform tackles the hardest problems in geometry, process planning, and fabrication, collapsing production timelines from months to days and soon, minutes. We don’t just build software; we run a fully operational factory where our technology produces production-grade tooling every week, enabling tight feedback loops and rapid iteration. Backed by top-tier investors, we’re restoring speed, flexibility, and capability to the American industrial base. Our mission is to make manufacturing as agile and scalable as the digital world, and in doing so, rebuild the infrastructure of the physical economy. About the Role We are seeking a skilled EDM Operator / Electrode Designer to join our tooling and engineering team. This role is responsible for extracting and designing electrodes from 3D mold models and operating sinker (ram) EDM machines to burn precise detail into hardened tooling components. This is a hands-on, highly collaborative role working closely with mold design, CNC machining, and assembly teams to ensure electrodes and EDM burns meet dimensional, surface finish, and quality requirements while supporting efficient cycle times. What You’ll Do Extract and design electrodes from 3D mold models using Cimatron, including burn faces, spark gaps, blank sizing, and reference/holder setup. Program and machine graphite and copper electrodes on high-speed CNC milling equipment. Set up, align, and operate sinker (ram) EDM machines to b

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a person ready to take up the challenge of working in a high-profile project where we design and integrate multiple chiplets into a System-in-package, in collaboration with external stakeholders. You will work with Tenstorrent worldwide experts and leaders in the USA, Japan and other countries, and help us make our IP even better. In this role, you will be responsible for DFT implementation using industry standard tools for high-speed CPU core design. This role is remote based out of the United States. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are You have a Bachelor’s, Master’s, or PhD in Electrical Engineering, Computer Engineering, or Computer Science, along with 10+ years of relevant DFT experience. You have hands-on experience with industry-standard DFT tools such as Synopsys and Siemens, as well as scripting in TCL and Python. You bring expertise in DFT planning, SoC-level silicon debug, formal verification, and signoff of inserted DFT logic. You are a strong cross-functional collaborator who can assess risk, communicate resource needs, and deliver in a complex technical environment. What we need Build

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today, SpaceX is actively developing the technologies to make this possible, with the ultimate goal of making life multiplanetary and expanding consciousness to the stars. SpaceXSI is building Super Intelligence to help humanity understand the universe. Our teams are building the full Super Intelligence stack: from our Colossus supercomputers, to Grok models, to our suite of applications, including Grok Bot, Grok Build, Grok Imagine, Grok Voice, and X. We're creating a powerful flywheel where more compute trains better models, better models power more useful products, and what we learn from people using those products shapes what we build next. ABOUT THE ROLE: As a Lead Fiber Technician on SpaceXSI's traveling data center build team, you will lead crews in the installation, testing, and commissioning of high-performance fiber optic infrastructure across multiple new and expanding data center sites. You’ll bring strong leadership, technical expertise, and a safety-first mindset to fast-paced hyperscale construction projects. This role involves significant travel to support greenfield and expansion builds, ensuring reliable, high-speed network connectivity that powers SpaceXSI's AI training clusters. You will mentor technicians, drive execution excellence, and help deliver mission-critical infrastructure on aggressive timelines. RESPONSIBILITIES: Serve as crew leader for traveling fiber teams, managing daily work assignments, resource allocation, and execution based on Fiber Span sheets, site surveys, path planning, and cross-functional coordination. Lead and mentor a team of Fiber Technicians across multiple project sites, providing on-the-job training, technical guidance, and performance feedback. Oversee all phases of fiber optic installation projects from planning and mobilization through execution, testing, handover

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We are seeking an experienced and motivated System IP RTL Design Lead to drive the definition and implementation of complex datacenter class IP for our next-generation semiconductor products. The ideal candidate possesses a deep understanding of System IP and SoC architecture, IP integration challenges, and is adept at leading a design team to deliver high-quality, scalable IP solutions. This role requires strong hands-on technical leadership, excellent communication skills, and a proven track record in the successful delivery of silicon IP. This role is hybrid, based out of Bangalore, India. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned IP / SoC design leader with 20+ yrs of strong expertise in complex SoC architectures, high-speed protocols, and large-scale IP integration. Skilled in RTL design and debug (Verilog/SystemVerilog) with hands-on experience using industry-standard tools for simulation, synthesis, lint, CDC, and power analysis on high-frequency designs. Experienced in driving microarchitecture decisions, authoring design specifications, and performing complex PPA trade-off optimizations. A proactive problem so

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a highly skilled Physical Design Engineer to drive the critical Die-to-Die (D2D) Physical Implementation from RTL to GDSII. This role demands deep expertise in full physical design flow with a specific focus on closing high-speed D2D interfaces for multi-die/chiplet architectures. This role is remote role open to any location in the U.S. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned ASIC Physical Design Engineer with 5+ years at advanced nodes (7nm or below) and multiple successful tapeouts. Strong in full-chip implementation, comfortable owning blocks from RTL to GDSII across synthesis, floorplanning, place-and-route, CTS, and sign-off. Deeply familiar with high-speed interfaces (D2D, PCIe, HBM, SerDes) and the physical challenges that come with them (timing, signal integrity, power integrity). Detail-oriented and methodical with STA, constraints, and closure for complex, high-speed designs. A hands-on problem solver who enjoys collaborating across analog, digital, and full-chip teams to debug tough issues. What We Need Lead Die-to-Die (D2D) physical implementation and closure, taking high-spe