High Speed Hardware Developer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of Micron's DRAM Verification organization, you will work within a highly innovative engineering team responsible for verifying advanced memory products that power next-generation computing systems. The team develops and validates sophisticated DRAM technologies that require complex functionality verification, ultra-high-speed operation, advanced low-power capabilities, and power management features. As a DRAM Verification Engineering Intern, you will collaborate with global design and verification teams to ensure the quality and functionality of future DRAM products. You will gain hands-on experience using industry-standard verification tools, simulation environments, debugging methodologies, and advanced verification techniques while contributing to real product development efforts. This role also provides opportunities to employ Artificial Intelligence and AI Assisted tools to improve verification efficiency, analysis, and workflow automation. Responsibilities Perform verification activities including datasheet analysis, verification planning, simulation execution, coverage analysis, debugging, and results review. Support modeling and simulation efforts using industry-standard verification and circuit simulation tools. Collaborate with global design, verification, and multi-functional engineering teams to drive standardization, improve design quality, and support successful product development. Contribute to innovation in future memory technologies by applying adva

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. Micron is seeking a Design Infrastructure Engineer to build, enable, and scale characterization infrastructure and deliver generated IP to multiple advanced memory and logic developments. This position includes characterizing both standard and custom cells across various process technologies. These encompass Micron internal nodes as well as external foundries, such as TSMC. The position supports multiple HBM product lines, including HBM DRAM dies, Logic dies (JEDEC and custom variants), and advanced 3D HBM architectures. You will work where circuit build, EDA infrastructure, and silicon validation readiness meet. You will develop robust, scalable, and high-quality characterization flows. These flows directly affect timing closure, power modeling, and product quality for next-generation HBM programs. Responsibilities: Develop and sustain scalable infrastructure for standard cell and custom cell characterization, encompassing timing, power, noise, and signal integrity modeling. Build reusable, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using Through Silicon Via (TSV) technology, we stack multiple DRAM chips with a high-speed interface die, significantly increasing memory density and bandwidth for next-generation AI/ML accelerators and high-performance computing platforms. Our designs target the industry's lowest power-per-bit and highest bandwidth, enabling the most demanding compute workloads. We are seeking a SI/PI Engineer in HBM Build Architecture to develop high-quality SI/PI analysis for interposers, packages, and silicon channels. This work contributes directly to HBM build sign-off and product success. You will be involved in complex, multi-disciplinary SI/PI initiatives spanning multiple HBM product generations — from early interposer channel analysis and equalization co-design, PDN architecture, and system PI analysis. You will ensure Micron's HBM SI/PI architecture remains the industry benchmark for signal quality, power delivery integrity, and interface reliability. This role supports the design and deployment of AI-enabled solutions that improv

What We’re Looking For: We’re looking for SoC architects to own the detailed SoC-level architecture of dies on the A-0 and A-1 wafer-scale systems. You will work with the architecture and ASIC design teams to create implementable specs and drive the execution of said implementations. Ideal Background: An ideal candidate will have: Experience with full ownership of the specs and drove implementation for at least one SoC/die A deep understanding of the process of architecture, microarchitecture and physical design and the ability to coordinate with various groups to drive implementation of SoCs Understanding of SoC interactions with packages, memory subsystems and IO, and ability to work with teams who are responsible for said interacting blocks Nice to Have: Experience with multi-die/multi-chiplet/MCM designs Experience with reticle-max/large-die SoC architecture Understanding of levers available for improving PPA Track record of very high speed A0 silicon delivery

What We’re Looking For: We’re looking for PIC (photonic integrated circuit) design engineers to contribute to and own aspects of the wafer-scale photonic interposer PIC. This will involve solving unique problems in creative ways, such as the tension between density and manufacturability yields, dealing with process variation on large scale wafers, etc. Ideal Candidates: Ideal candidates will have: Experience with both passive and active PIC design components An understanding of the fundamental physics at play, not just a “simulate and turn the crank” attitude Experience with large device count PIC tapeouts Deep understanding of optical coupling in and out of the PIC, especially how to achieve very low losses under realistic manufacturing conditions (alignment, etc) Understanding of the physical manufacturing process behind PICs Nice to Have: Experience with high speed optical communications PICs Experience in designing with PIC material platforms other than silicon photonics (eg InP, TFLN, SiN, polymers, glass, etc) Experience and knowledge of active gain chip integration (eg integrated lasers, SOAs, etc) Experience with large area PICs Understanding of sources of process variation, statistical process control, etc

What We’re Looking For: We’re looking for great analog and mixed signal circuit designers to join us in contributing to the design of our production optical PHY. Ideal Background: Ideal candidates will have: Deep knowledge, hands on experience and multiple successful tapeouts with advanced node analog and mixed signal circuit designs Deep knowledge, hands on experience and multiple successful tapeouts of high speed communication link Tx and/or Rx circuits Nice to Have: Understanding of PHYs and how analog components and circuits integrated into the broader PHY system Understanding and hands-on experience with clock-forwarded links, especially clock-forwarded optical links Design and successful tapeout experience with optical links, either on Tx or Rx sides Design and successful tapeout experience with AMS circuits for optical components

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking an experience high-speed high-speed IO/Clocking Design Engineering at a Principal/Sr Member of Technical Staff (SMTS) level to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the architecture, design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop core strategy and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Define, innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply robust high-speed circuit design techniques and enhance critical performance evaluation, including timing and jitter sensitivity, of the IO data path and clock path at circuit and full-chip level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation resu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal/Member of Technical Staff (MTS) IO/Clock Design Engeer to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply robust high-speed circuit design techniques and enhance critical performance evaluation, including timing and jitter sensitivity, of the IO data path and clock path at circuit and full-chip level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today, SpaceX is actively developing the technologies to make this possible, with the ultimate goal of making life multiplanetary and expanding consciousness to the stars. SpaceXSI is building Super Intelligence to help humanity understand the universe. Our teams are building the full Super Intelligence stack: from our Colossus supercomputers, to Grok models, to our suite of applications, including Grok Bot, Grok Build, Grok Imagine, Grok Voice, and X. We're creating a powerful flywheel where more compute trains better models, better models power more useful products, and what we learn from people using those products shapes what we build next. ABOUT THE ROLE: As a Manager, Fiber at SpaceXSI's Memphis data center, you will lead and oversee all fiber optic infrastructure activities, driving the successful execution of large-scale installations, maintenance, and optimization projects. You’ll combine hands-on technical expertise with strong leadership to manage teams of technicians, ensure the highest standards of safety and quality, and maintain the ultra-reliable high-speed connectivity that powers SpaceXSI's AI training and operations. Working closely with Foremen, Project Managers, and Superintendents, you’ll play a critical role in building and sustaining the robust network backbone essential to accelerating human scientific discovery through AI. RESPONSIBILITIES: Lead, mentor, and supervise a team of Lead Fiber Technicians and Fiber Technicians in all datacenter fiber optic installation, maintenance, and repair activities Oversee all phases of fiber optic projects from planning and execution to testing, handover, and documentation Ensure a safe, productive, high-quality, and compliant work environment for the entire fiber team Develop and implement sensor indicators, inspection protocols, and preventive maintenance

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job responsibilities: Verification of High speed IPs like PCIe and sub-system using Best-In-Class methodologies and Processes Lead and Drive Deliverables for IP/SS Verification using SV/UVM based verification. Planning and Strategizing Team Execution towards Efficient, Scalable IP/SS Verification Environment and Methodologies Interact with Architecture and Design Team to establish standard flows and Deliverables alignments. Understanding to Architecture requirements and support till end product QS Work across a challenging schedule and maximize Teams efficiency using Automation, Portability and Reusability Lead and drive Silicon Bring up. Plan and ramp-up the team for enabling multiple IP/SS verification in parallel with High Quality and Efficiency Job Qualifications Bachelors/Masters in Engineering with Overall Verification domain experience of 14+ years Minimum 12+ years of experience in IP/SS verification using SV and UVM An expert level experience on PCIe protocols (Root-Complex, Endpoints and SR-IOV) Minimum 3+ years of Experience in managing teams of 10+ engineers and Leads Management Good experience in collaborating with engineering teams across multiple Geographies.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: As a Mixed-Signal Design Engineer in Micron’s Pathfinding Design Team, you will play a key role in crafting next-generation memory technologies. This position involves contributing to defining, developing, and analyzing high-speed logics to operate the memory. These paths span from the memory array to the interface block for memory technologies, including DRAM and emerging memories. You will work on novel concept development, circuit simulation, optimization, and floor planning to enable groundbreaking memory solutions! Responsibilities: Provide technical direction and design implementation for a memory control circuits (both of digital and analog) from the memory array to the interface block. Collaborate closely with physical design teams to ensure timing closure, CDC robustness, and power intent alignment. Demonstrated experience working with custom mixed-signal IC build and development for volatile or nonvolatile memory technology. Experience with modeling and simulation of ICs using HSPICE/finesim. Minimum Qualifications: Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or related field. 7&#43; years of experience in custom mixed-signal circuit design. Proficiency with UNIX and CADENCE design environment (Simulation, Schematic entry, SPF extraction) </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Join us as a Senior Verification Engineer and contribute to modular, scalable verification solutions for next-generation HBM DRAM products! You will work independently within a multi-functional team of technical domain experts, spanning both IP-level and SoC-level verification. You will collaborate with Design Engineering, Product Engineering, and Business Units to complete the HBM verification roadmap. You will apply your solid understanding of testbench architecture, custom or SoC verification methodologies, and 2.5D & 3D package integration to evaluate issues, define solutions, and broaden your expertise. Responsibilities: Develop and implement verification plans and architecture collateral across IP-level and SoC-level verification for current and future HBM designs Support co-verification of the overall system and participate in customer interactions to gather feedback and provide recommendations for future HBM solutions Build and improve verification methodology components and GenAI applications aligned to HBM design cycles, broadening cross-disc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Member of Technical Staff HBM Design Architect, you will be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and control logic, as well serializing and de-serializing scheme. You will collaborate with a highly creative and motivated development team applying brand-new memory technologies to build groundbreaking HBM products! Responsibilities: Responsible for the high-speed DRAM and Base die interface in HBM cube. Design the DRAM command and control logic, as well as serializing and de-serializing scheme at the interface. Conduct circuit simulations using standard industry simulators such as FINESIM, HSPICE and VERILOG Collaborate with data path design on floor planning and full chip testbench. Analyze timing/area/power in high-speed DRAM or mixed-signal design. Contribute to the development of new HBM product opportunities by assisting with the overall design, layout, and optimization of Memory, Logic, and Analog circuits. Qualifications: Extensive experience with DRAM operation and JEDEC specifications across DDR, LPDDR, GDDR, and HBM product families. Strong technical expertise in analog and mixed-signal circuit design. Hands-on proficiency in DRAM command decoding, bank logic, and RAS/CAS chain design. Demonstrated innovation and problem‑solving capabilities in

Experienced or Senior Digital CCA Design Company: The Boeing Company Boeing Defense, Space & Security (BDS) seeks a Digital CCA Design Engineer who is a subject matter expert in high-speed digital circuit design , signal integrity analysis , and electrical design to join our time in Huntsville, AL. This position will p lay a vital role in the Patriot Advanced Capability-3 (PAC-3) program, one of the world's most advanced air and missile defense systems. This is your opportunity to work in a dynamic environment where your skills will directly contribute to protecting critical assets and ensuring mission success. If you are passionate about defense technology and want to make a real impact, we want to hear from you! Position Responsibilities: Focus on electrical design, simulation, verification, and validation testing of high-speed printed circuit board design and electronic system Lead product development cycles Collaborate with cross-functional teams, including other engineering disciplines Keeping current on related industry best practices and technological advancements This position requires obtaining a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim U.S. secret clearance Pre Start and final U.S. secret clearance Post Start is required. Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement. 3 or more years of related experien